Abstract: In various embodiments, the present disclosure provides semiconductor packages, devices, and methods. In one embodiment, a device includes a die pad, leads that are spaced apart from the die pad, and a semiconductor die on the die pad. The semiconductor die has a first surface and a second surface opposite the first surface. The second surface faces the die pad. An encapsulant is provided on the semiconductor die, the die pad and the leads, and the encapsulant has a first surface opposite the die pad and the leads, and a second surface opposite the first surface. The second surface of the encapsulant extends between the die pad and an adjacent lead. The second surface of the encapsulant is spaced apart from the first surface of the encapsulant by a first distance, and an exposed surface of the die pad is spaced apart from the first surface of the encapsulant by a second distance that is greater than the first distance.

Abstract: The present disclosure is directed to a semiconductor package that include a non-conductive encapsulation layer encapsulation an integrated circuit chip, and a conductive encapsulation layer over the non-conductive encapsulation layer. A lead is exposed from the non-conductive encapsulation layer and contacts the conductive encapsulation layer. The conductive encapsulation layer and the lead provide EMI shielding for the integrated circuit chip.

Abstract: Incorporation of metallic quantum dots (e.g., silver bromide (AgBr) films) into the source and drain regions of a MOSFET can assist in controlling the transistor performance by tuning the threshold voltage. If the silver bromide film is rich in bromine atoms, anion quantum dots are deposited, and the AgBr energy gap is altered so as to increase Vt. If the silver bromide film is rich in silver atoms, cation quantum dots are deposited, and the AgBr energy gap is altered so as to decrease Vt. Atomic layer deposition (ALD) of neutral quantum dots of different sizes also varies Vt. Use of a mass spectrometer during film deposition can assist in varying the composition of the quantum dot film. The metallic quantum dots can be incorporated into ion-doped source and drain regions. Alternatively, the metallic quantum dots can be incorporated into epitaxially doped source and drain regions.

Abstract: A microelectromechanical system (MEMS) accelerometer sensor has a mobile mass and a sensing capacitor. To self-test the sensor, a test signal is applied to the sensing capacitor during a reset phase of a sensing circuit coupled to the sensing capacitor. The test signal is configured to cause an electrostatic force which produces a physical displacement of the mobile mass corresponding to a desired acceleration value. Then, during a read phase of the sensing circuit, a variation in capacitance of sensing capacitor due to the physical displacement of the mobile mass is sensed. This sensed variation in capacitance is converted to a sensed acceleration value. A comparison of the sensed acceleration value to the desired acceleration value provides an indication of an error in operation of the MEMS accelerometer sensor if the sensed acceleration value and desired acceleration value are not substantially equal.

Abstract: A microelectromechanical system (MEMS) gyroscope sensor has a sensing mass and a quadrature error compensation control loop for applying a force to the sensing mass to cancel quadrature error. To detect fault, the quadrature error compensation control loop is opened and an additional force is applied to produce a physical displacement of the sensing mass. A quadrature error resulting from the physical displacement of the sensing mass in response to the applied additional force is sensed. The sensed quadrature error is compared to an expected value corresponding to the applied additional force and a fault alert is generated if the comparison is not satisfied.

Abstract: A passive cable adaptor for connecting a data source device with a display device is described. The adaptor has a packet-based interface connector at one end, the connector having a positive main link pin, a negative main link pin, a positive auxiliary channel pin, and a negative auxiliary channel pin. At the other end is a micro serial interface connector, wherein multimedia content is transmitted over the cable adaptor and electrical power is supplied over the cable adaptor simultaneously. The cable adaptor has an auxiliary and hot plug detect (HPD) controller utilized to map the auxiliary channel and HPD signals of the packet-based digital display to the micro serial interface ID signal.

Abstract: A method and apparatus for classifying a spatial environment as open or enclosed are provided. In the method and apparatus, one or more microphones detect ambient sound in a spatial environment and output an audio signal representative of the ambient sound. A processor determines a spatial environment impulse response (SEIR) for the audio signal and extracts one or more features of the SEIR. The processor classifies the spatial environment as open or enclosed based on the one or more features of the SEIR.

Abstract: An image projection device, such as a pico projector or LCD projector, includes image projection circuitry configured to generate a light beam having a power. The image projection circuitry projects the light beam onto and focuses the light beam on a projection surface located an imaging distance from the image projection circuitry. A time-of-flight sensor is configured to sense the imaging distance between the image projection circuitry and the projection surface and to generate an imaging distance signal indicating the sensed imaging distance. Control circuitry is coupled to the image projection circuitry and to the time-of-flight sensor and is configured to adjust the power and the focus of the light beam based upon the imaging distance signal.

Abstract: A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, and source and drain regions adjacent the channel region to generate shear and normal strain on the channel region. A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, source and drain regions adjacent the channel region, and a gate over the channel region. The fin may be canted with respect to the source and drain regions to generate shear and normal strain on the channel region.

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

Abstract: A system includes inertial sensors and a GPS. The system generates a first estimated vehicle velocity based on motion data and positioning data, generates a second estimated vehicle velocity based on the processed motion data and the first estimated vehicle velocity, and generates fused datasets indicative of position, velocity and attitude of a vehicle based on the processed motion data, the positioning data and the second estimated vehicle velocity. The generating the second estimated vehicle velocity includes: filtering the motion data, transforming the filtered motion data in a frequency domain based on the first estimated vehicle velocity, generating spectral power density signals, generating an estimated wheel angular frequency and an estimated wheel size based on the spectral power density signals, and generating the second estimated vehicle velocity as a function of the estimated wheel angular frequency and the estimated wheel size.

Abstract: Generally described, one or more embodiments are directed to a leadframe package having a plurality of leads, a die pad, a semiconductor die coupled to the die pad, and encapsulation material. An inner portion of the die pad includes a perimeter portion that includes a plurality of protrusions that are spaced apart from each other. The protrusions aid in locking the die pad in the encapsulation material. The plurality of leads includes upper portions and base portions. The base portion of the plurality of leads are offset (or staggered) relative to the plurality of protrusions of the die pad. In particular, the base portions extend longitudinally toward the die pad and are located between respective protrusions. The upper portions of the leads include lead locks that extend beyond the base portions in a direction of adjacent leads. The lead locks and the protrusion in the die pad aid in locking the leads and the die pad in the encapsulation material.

Abstract: A device including microelectromechanical systems (MEMS) sensors is used in dead reckoning in conditions where Global Positioning System (GPS) signals or Global Navigation Satellite System (GNSS) signals are lost. The device is capable of tracking the location of the device after the GPS/GNSS signals are lost by using MEMS sensors such as accelerometers and gyroscopes. By calculating a misalignment angle between a sensor frame of the device with either the movement direction of the vehicle or the walking direction of a pedestrian using the MEMS sensors, the device can accurately calculate the location of a user of the device even without the GPS/GNSS signals. Accordingly, a device capable of tracking the location of a pedestrian and a user riding in a vehicle without utilizing GPS/GNSS signals can be provided.

Abstract: One or more embodiments are directed to methods of forming one or more cantilever pads for semiconductor packages. In one embodiment a recess is formed in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.

Abstract: Incorporation of metallic quantum dots (e.g., silver bromide (AgBr) films) into the source and drain regions of a MOSFET can assist in controlling the transistor performance by tuning the threshold voltage. If the silver bromide film is rich in bromine atoms, anion quantum dots are deposited, and the AgBr energy gap is altered so as to increase Vt. If the silver bromide film is rich in silver atoms, cation quantum dots are deposited, and the AgBr energy gap is altered so as to decrease Vt. Atomic layer deposition (ALD) of neutral quantum dots of different sizes also varies Vt. Use of a mass spectrometer during film deposition can assist in varying the composition of the quantum dot film. The metallic quantum dots can be incorporated into ion-doped source and drain regions. Alternatively, the metallic quantum dots can be incorporated into epitaxially doped source and drain regions.

Abstract: Integrated circuits are disclosed in which the strain properties of adjacent pFETs and nFETs are independently adjustable. The pFETs include compressive-strained SiGe on a silicon substrate, while the nFETs include tensile-strained silicon on a strain-relaxed SiGe substrate. Adjacent n-type and p-type FinFETs are separated by electrically insulating regions formed by a damascene process. During formation of the insulating regions, the SiGe substrate supporting the n-type devices is permitted to relax elastically, thereby limiting defect formation in the crystal lattice of the SiGe substrate.

Abstract: A microelectromechanical system (MEMS) gyroscope sensor has a sensing mass and a quadrature error compensation control loop for applying a force to the sensing mass to cancel quadrature error. To detect fault, the quadrature error compensation control loop is opened and an additional force is applied to produce a physical displacement of the sensing mass. A quadrature error resulting from the physical displacement of the sensing mass in response to the applied additional force is sensed. The sensed quadrature error is compared to an expected value corresponding to the applied additional force and a fault alert is generated if the comparison is not satisfied.

Abstract: A method includes providing a power supply package (PSP) that includes a power supply, an RFID tag, and a power switch, where a control terminal of the power switch is coupled to an output terminal of the RFID tag, and load path terminals of the power switch are coupled between an output terminal of the PSP and a first terminal of the power supply, where a control register of the RFID tag is pre-programmed with a first value such that the RFID tag is configured to generate a first control signal that turns off the power switch; receiving, by the RFID tag, a second value for the control register of the RFID tag; and writing, by the RFID tag, the second value to the control register of the RFID tag such that the RFID tag is configured to generate a second control signal that turns on the power switch.

Abstract: Embodiments of the present disclosure are directed to leadframe semiconductor packages having die pads with cooling fins. In at least one embodiment, the leadframe semiconductor package includes leads and a semiconductor die (or chip) coupled to a die pad with cooling fins. The cooling fins are defined by recesses formed in the die pad. The recesses extend into the die pad at a bottom surface of the semiconductor package, such that the bottom surfaces of the cooling fins of the die pad are flush or coplanar with a surface of the package body, such as an encapsulation material. Furthermore, bottom surfaces of the cooling fins of the die pad are flush or coplanar with exposed bottom surfaces of the leads.

Abstract: A passive cable adaptor for connecting a data source device with a display device is described. The adaptor has a packet-based interface connector at one end, the connector having a positive main link pin, a negative main link pin, a positive auxiliary channel pin, and a negative auxiliary channel pin. At the other end is a micro serial interface connector, wherein multimedia content is transmitted over the cable adaptor and electrical power is supplied over the cable adaptor simultaneously. The cable adaptor has an auxiliary and hot plug detect (HPD) controller utilized to map the auxiliary channel and HPD signals of the packet-based digital display to the micro serial interface ID signal.