Patents Assigned to STMicroelectronics, Inc.
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Publication number: 20100165963Abstract: Methods and apparatus for implementing a robust unicast/broadcast/multicast protocol are provided. In one aspect, a method of avoiding collision of intra-basic service set unicast, broadcast or multicast transmissions notifies stations in the basic service set of a reserved transmit opportunity for a unicast, broadcast or multicast transmission. Transmissions from at least one station in the basic service set are deferred until after the reserved unicast, broadcast or multicast transmit opportunity.Type: ApplicationFiled: June 29, 2009Publication date: July 1, 2010Applicant: STMICROELECTRONICS, INC.Inventors: Liwen Chu, George A. Vlantis
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Publication number: 20100169736Abstract: A system and method is capable of performing a Low Density Parity Check (LDPC) coding operation on-the-fly without using a generator matrix. The system and method includes an input configured to receive data and an output configured to output a plurality of codewords. The system and method also includes a processor coupled between the input and the output. The processor is configured to encode the received data and produce the plurality of codewords using a plurality of parity bits. The processor creates the plurality of parity bits on-the-fly using a portion of an LDPC matrix and a protograph matrix.Type: ApplicationFiled: October 2, 2009Publication date: July 1, 2010Applicant: STMicroelectronics, Inc.Inventor: Shayan S. Garani
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Publication number: 20100157493Abstract: An integrated circuit includes an electrostatic discharge (ESD) detection circuit which detects an ESD event and generates an event signal. In response to that event signal, a control circuit controls the operation of a buffer circuit to function in an additional mode wherein the normal differential operation of the buffer circuit is disabled and the buffer circuit is instead configured to form a conduction path between supply rails to discharge the ESD event. Preferably, a plurality of buffer circuits are driven in parallel by the control circuit to function in the additional mode to form parallel discharge paths for the ESD event. Multiple ESD detection circuits may be provided, and any one of those detection circuits can trigger the control circuitry to place all of the buffer circuits in the additional mode.Type: ApplicationFiled: December 24, 2008Publication date: June 24, 2010Applicant: STMicroelectronics, Inc.Inventors: Yannick Guedon, Meiliana Leow, Sze-Kwang Tan, Mariano Dissegna, Lorenzo Cerati
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Publication number: 20100158272Abstract: Psychoacoustic bass audio signal enhancement can be accomplished using a monotonic, asymmetric polynomial distortion. A non-linear process applies a monotonic, asymmetric polynomial distortion function that has continuous first and second derivatives to generate even and odd harmonics of missing fundamental frequencies. This polynomial distortion produces the desired psychoacoustic effect with a fairly rapid roll-off so as to avoid unpleasant aliasing. Moreover, the lack of first-order discontinuities prevents clicks or glitches.Type: ApplicationFiled: December 10, 2009Publication date: June 24, 2010Applicant: STMicroelectronics, Inc.Inventor: Earl Corban Vickers
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Publication number: 20100148363Abstract: A ball grid array (BGA) package includes a substrate layer having first and second sides. A semiconductor chip is attached to the first side of the substrate layer by a dielectric adhesive layer. A plurality of solder balls are attached to the second side of the substrate layer. The solder balls may be set out by rows and columns. A plurality of wires electrically connect the semiconductor chip to the solder balls. A layer of encapsulating compound is deposited over the semiconductor chip. A step cavity of a selected depth and shape is formed in the layer of encapsulating compound at or near the edge or periphery of the layer of encapsulating compound. The step cavity is separated from the solder balls by the substrate layer but spans over a plurality of selected solder balls.Type: ApplicationFiled: December 16, 2008Publication date: June 17, 2010Applicant: STMicroelectronics, Inc.Inventors: Kim-Yong Goh, Jing-En Luan
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Publication number: 20100148347Abstract: A chip scale package (CSP) device includes a CSP having a semiconductor die electrically coupled to a plurality of solder balls. A can having an inside top surface and one or more side walls defines a chamber. The CSP is housed in the chamber and is attached to the inside top surface of the can. A printed circuit board is attached to the solder balls and to the one or more side walls to provide support to the CSP and to the can. The CSP may be a Wafer-Level CSP. The can may be built from a metallic substance or from a non-metallic substance. The can provides stress relief to the CSP during a drop test and during a thermal cycle test.Type: ApplicationFiled: December 16, 2008Publication date: June 17, 2010Applicant: STMicroelectronics, Inc.Inventors: Kim-Yong Goh, Jing-En Luan
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Patent number: 7739643Abstract: In a semiconductor device, a method for reducing the effect of crosstalk from an aggressor line to a victim line begins with sensing the occurrence of a voltage change on the aggressor line that can induce a voltage pulse having a pulse magnitude that exceeds a pulse threshold on the victim line. The induced voltage pulse is counteracted by coupling the victim line to a counteracting voltage source. After a predetermined delay period, the coupling of the counteracting voltage source is removed from the victim line. The voltage change on the aggressor line my be sensed from a node connected to either the aggressor line or the victim line. A rising induced pulse is counteracted by coupling the victim line to a more negative voltage source, and a falling induced pulse is counteracted by coupling the victim line to a more positive voltage source.Type: GrantFiled: December 26, 2007Date of Patent: June 15, 2010Assignee: STMicroelectronics, Inc.Inventor: Rozak Hossain
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EMBEDDED MICROELECTROMECHANICAL SYSTEMS (MEMS) SEMICONDUCTOR SUBSTRATE AND RELATED METHOD OF FORMING
Publication number: 20100140724Abstract: An embedded MEMS semiconductor substrate is set forth and can be a starting material for subsequent semiconductor device processing. A MEMS device is formed in a semiconductor substrate, including at least one MEMS electrode and a buried silicon dioxide sacrificial layer has been applied for releasing the MEMS. A planarizing layer is applied over the substrate, MEMS device and MEMS electrode. A polysilicon protection layer is applied over the planarizing layer. A polysilicon nitride capping layer is applied over the polysilicon protection layer. A polysilicon seed layer is applied over the polysilicon nitride capping layer. The MEMS device is released by removing at least a portion of the buried silicon dioxide sacrificial layer and an epitaxial layer is grown over the polysilicon seed layer to be used for subsequent semiconductor wafer processing.Type: ApplicationFiled: December 10, 2008Publication date: June 10, 2010Applicant: STMicroelectronics, Inc.Inventors: Olivier LE NEEL, Peyman Sana, Loi Nguyen, Venkatesh Mohanakrishnaswamy -
Publication number: 20100142559Abstract: A coexistence communications method for use between wireless networks includes adopting a super-frame structure for use in a wireless network having a plurality of frames, wherein a first frame includes a super-frame preamble, a super-frame control header, a data portion, and a regular self-coexistence window, an intermediate frame includes an OFDM symbol, a data portion, and a regular self-coexistence window, and a last frame includes an OFDM symbol, a data portion, and a joining self-coexistence window, using the self-coexistence windows to exchange inter-wireless network co-existence messages, and using a last reserved self-coexistence window to announce intra-wireless network negotiation decisions.Type: ApplicationFiled: November 10, 2009Publication date: June 10, 2010Applicant: STMicroelectronics, Inc.Inventor: Wendong Hu
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Publication number: 20100140062Abstract: The invention is directed towards a protective circuit for an apparatus including an accelerometer having an output and a microcontroller coupled to the output of the accelerometer. The protective circuit also includes a switch for controlling the apparatus coupled to an output of the microcontroller and a load coupled to the switch. A power source is coupled to the load and the switch. In operation the microcontroller is cable of sending a signal to the switch to turn of power to the load when a dangerous condition has occurred. Also, the invention is directed toward a method of controller an apparatus with the protective circuit.Type: ApplicationFiled: December 9, 2008Publication date: June 10, 2010Applicant: STMicroelectronics, Inc.Inventor: Thomas L. Hopkins
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Publication number: 20100142463Abstract: The message flows of a distributed, cooperative, and real-time protocol for frame-based spectrum sharing called Frame-based On-Demand Spectrum Contention (FODSC) employs interactive MAC messaging on an inter-network communication channel to provide efficient, scalable, and fair inter-network spectrum sharing among the coexisting cognitive radio cells.Type: ApplicationFiled: November 10, 2009Publication date: June 10, 2010Applicant: STMicroelectronics, Inc.Inventor: Wendong Hu
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Patent number: 7729077Abstract: An H-bridge driver for a disk drive system includes first and second high side switched legs and first and second low side switched legs. An inductor head for writing data to and reading data from a magnetic media is connected to form a center of the H-bridge. The system includes a voltage regulator circuit that generates a common mode regulated voltage. First and second high side logic circuits, which selectively control operation of the first and second high side switched legs, are coupled between a high reference voltage and the common mode regulated voltage. First and second low side logic circuits, which control the first and second low side switched legs, are coupled between the common mode regulated voltage and ground.Type: GrantFiled: August 30, 2006Date of Patent: June 1, 2010Assignee: STMicroelectronics, Inc.Inventors: Vineet Tiwari, Baris Posat
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Patent number: 7730116Abstract: A processor includes a multi-stage pipeline having a plurality of stages. Each stage is capable of receiving input values and providing output values. Each stage performs one of a plurality of data transformations using the input values to produce the output values. The data transformations collectively approximate at least one of: a discrete cosine transform and an inverse discrete cosine transform. The stages do not use any multipliers to perform the data transformations.Type: GrantFiled: May 13, 2005Date of Patent: June 1, 2010Assignee: STMicroelectronics, Inc.Inventor: Philip P. Dang
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Publication number: 20100130006Abstract: A thick metal layer is formed on a semiconductor integrated circuit in multiple different deposition chambers. A first portion of the metal layer is formed in a first deposition chamber, the first thickness being approximately half the target thickness. The substrate is then removed from the first chamber and transported to a second chamber. The deposition of the same metal layer continues in a second chamber, having the same grain structure and orientation. The second portion of the metal layer is grown to achieve the final thickness. By using two different deposition chambers to form the single metal layer, layers in excess of 25,000 angstroms in thickness can be obtained.Type: ApplicationFiled: February 1, 2010Publication date: May 27, 2010Applicant: STMICROELECTRONICS, INC.Inventor: Ardeshir J. Sidhwa
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Patent number: 7724172Abstract: A digital-to-analog converter, in response to a digital signal, selectively taps a resistor string to generate an analog output and selectively shunts around resistors in the string to voltage shift the analog output. If two supply voltage sets are present, two strings are provided. A mutually exclusively selection of outputs is made to select a source of the analog output. An integrated circuit temperature sensor uses the converter and includes a sensing circuit that determines exposure to one of a relatively low or high temperature. A measured voltage across the base-emitter of a bipolar transistor is selected in low temperature exposure and compared against a first reference for a too cold temperature condition. Alternatively, a measured delta voltage across the base-emitter is selected in high temperature exposure and compared against a second reference voltage for a too hot temperature condition. Through the comparisons, a temperature exposure detection is made.Type: GrantFiled: January 28, 2008Date of Patent: May 25, 2010Assignee: STMicroelectronics, Inc.Inventors: David C. McClure, Sooping Saw
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Publication number: 20100123419Abstract: A drive circuit having asymmetrical drivers. In an embodiment, a brushless DC motor may be driven by a drive circuit having three high-side MOSFETs and three low-side MOSFETs. A driver controller turns the MOSFETs on and off according to a drive algorithm such that phase currents are injected into motor coils to be driven. The high-side MOSFETs may be sized differently than the low-side MOSFETs. As such, when a MacDonald waveform (or similar drive algorithm) is used to drive the phases of the motor, less power may be required during disk spin-up because the MOSFETs that are on more (e.g., the low-side MOSFETs with a MacDonald waveform) may be sized larger than the MOSFETs that are on less (e.g., the high-side MOSFETs). In this manner, less power is dissipated in the larger size MOSFETs that are on more than the others.Type: ApplicationFiled: November 18, 2009Publication date: May 20, 2010Applicant: STMicroelectronics, Inc.Inventor: Frederic BONVIN
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Patent number: 7720898Abstract: A floating point unit, a central processing unit, and a method are provided for adjusting the exponent of a floating point number. During an addition or subtraction of two floating point numbers, the significand of the floating point result is rounded, and the exponent of the result may be adjusted due to normalization or renormalization. The exponent adjustment due to renormalization or the exponent adjustment due to normalization and renormalization is combined with the significand rounding operation.Type: GrantFiled: June 11, 2003Date of Patent: May 18, 2010Assignee: STMicroelectronics, Inc.Inventors: Alexander Driker, Cristian Duroiu
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Patent number: 7716455Abstract: A high speed processor. The processor includes terminals that each execute a subset of the instruction set. In at least one of the terminals, the instructions are executed in an order determined by data flow. Instructions are loaded into the terminal in pages. A notation is made when an operand for an instruction is generated by another instruction. When operands for an instruction are available, that instruction is a “ready” instruction. A ready instruction is selected in each cycle and executed. To allow data to be transmitted between terminals, each terminal is provided with a receive station, such that data generated in one terminal may be transmitted to another terminal for use as an operand in that terminal. In one embodiment, one terminal is an arithmetic terminal, executing arithmetic operations such as addition, multiplication and division. The processor has a second terminal, which contains functional logic to execute all other instructions in the instruction set.Type: GrantFiled: December 3, 2004Date of Patent: May 11, 2010Assignee: STMicroelectronics, Inc.Inventor: Stefano Cervini
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Patent number: 7714599Abstract: An integrated circuit burn-in test system includes an integrated circuit and a tester. The integrated circuit includes operating circuitry, a heater for heating the operating circuitry, and burn-in test circuitry for testing the operating circuitry while being heated. A package surrounds the operating circuitry, the heater and the burn-in test circuitry. The burn-in test circuitry causes the operating circuitry to operate and generate data related thereto. The tester receives data from the burn-in test circuitry. The heater may be configured within the package to heat at least one predetermined portion of the operating circuitry.Type: GrantFiled: December 22, 2006Date of Patent: May 11, 2010Assignee: STMicroelectronics, Inc.Inventors: Riccardo Maggi, Massimo Scipioni
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Patent number: RE41337Abstract: The entire data path of a synchronous integrated circuit device is initialized in a test mode upon power-up of the synchronous integrated circuit device. Upon power-up of the integrated circuit device in the test mode, a clock signal (either an external clock signal or an associated internal clock signal) is internally clocked. As the clock signal goes to a low logic state upon power-up of the device, a master latch (flip-flop) flip-flop element of the integrated circuit device is loaded with data and is allowed to conduct; a slave latch (flip-flop) flip-flop element of the integrated circuit device does not conduct. As the clock signal goes to a high logic state, the data in the master latch is latched. Also upon the high logic state of the clock, the slave latch element is loaded with data and is allowed to conduct.Type: GrantFiled: June 15, 2000Date of Patent: May 18, 2010Assignee: STMicroelectronics, Inc.Inventor: David Charles McClure