Abstract: In an embodiment, a circuit includes cascaded delay units arranged in a chain, each delay unit having an input-to-output delay time, wherein a first delay unit in the chain is configured to receive an input signal for propagating along the delay units in the chain, logic circuitry coupled to delay units in the chain, the logic circuitry configured to generate a clock signal as a logic combination of signals input to and output from the delay units in the chain and feedback circuitry configured to supply to the first delay unit in the chain a feedback signal, the feedback circuitry including a first feedback signal path from a last delay unit in the chain to the first delay unit in the chain and a second feedback signal path from an intermediate delay unit in the chain to the first delay unit in the chain, the intermediate delay unit arranged between the first delay unit in the chain and the last delay unit in the chain.

Abstract: A supply node receives supply voltage and an output node provides a regulated output voltage to a load. A switching transistor is coupled between the supply and output nodes. The switching transistor is controlled by a drive signal generated by a control circuit to control switching activity. The control circuit includes circuitry to sense a feedback voltage indicative of the regulated output voltage and a comparator generating a comparison logic signal dependent on a comparison of the feedback voltage to a reference. A logic circuit generates a skip signal in response to the comparison logic signal. A counter generates a termination signal. Signal processing circuitry controls the switching activity by asserting the drive signal as a function of the skip signal and the termination signal.

Abstract: Disclosed herein is a method for manufacturing a semiconductor product package. The method includes arranging a leadframe with one or more leads such that each lead has an inner end facing a portion of a die-pad, attaching a semiconductor chip to the die-pad, attaching a first electrically conductive mass to the die-pad such that it is aligned with the inner end of a lead protruding over the die-pad, attaching an electrical component to the first electrically conductive mass such that a longitudinal axis of the electrical component is arranged traverse to the die-pad, and coupling a second electrically conductive mass between a termination of the electrical component and the inner end of the lead.

Abstract: A method for controlling a BLDC motor includes controlling the rotational speed or position of the BLDC motor based on a position of the rotor of the motor. The BLDC motor is driven by a three-phase inverter. A PWM signal is generated for three PWM phases, each including a pair of complementary signals with dead-time and having a duty cycle based on the current position of the rotor. The complementary signals are supplied to a respective high side and low side switch of each of three arms of the three-phase inverter, and a zero-crossing time measurement is performed on each of the back electromotive forces. Corresponding signals are obtained indicating the zero-crossing times. Trigger signals are generated, and the occurrence of a time interval corresponding to the dead time in the respective PWM phase is identified. The zero-crossing time measurement is performed during the occurrence of the dead-time.

Abstract: A time based boost DC-DC converter generates an output voltage using an inductor. A voltage error between the output voltage and a reference voltage is determined and processed in a) an integral control branch which converts the voltage error into an integral control current signal used to control a current controlled oscillator, and b) a proportional branch which converts the voltage error into a proportional control current signal used to control signal a delay line. Current flowing in the inductor is sensed, attenuated and used to apply adjustment to the integral and proportional control current signals. The output from the current controlled oscillator is passed through the delay line and phase detected in order to generate pulse width modulation (PWM) control signaling driving switch operation in the converter.

Abstract: A photosensitive sensor is capable of operating in a global shutter mode and in a rolling shutter mode. The sensor includes at least one pixel with a photosensitive region configured to photogenerate charges. A first transfer gate is configured to transfer photogenerated charges from the photosensitive region to a transfer node. A source-follower transistor is configured to transmit a reading signal to a read node, in the global shutter mode, in a manner controlled by a potential of the photogenerated charges on the transfer node. A second transfer gate is configured to transfer the photogenerated charges from the photosensitive region to the read node in the rolling shutter mode.

Abstract: A half-bridge driver circuit periodically repeats switching cycles by closing a first FET via a first drive signal, detecting an instant when a current flowing through the first FET reaches a threshold and then opening the first FET and closing a second FET via a second drive signal. An error amplifier generates a control voltage by comparing a feedback signal with a reference signal, and a variable current generator generates a first current as a function of the control voltage. The error amplifier includes a proportional-integral controller, and a slope compensation circuit that generates a second current as a ramp signal. The threshold is generated by subtracting the second current from the first current. In response to detecting the instant, the second current is sampled and a signal indicative of the threshold is generated by subtracting the sampled second current from the first current.

Abstract: Single gate and dual gate FinFET devices suitable for use in an SRAM memory array have respective fins, source regions, and drain regions that are formed from portions of a single, contiguous layer on the semiconductor substrate, so that STI is unnecessary. Pairs of FinFETs can be configured as dependent-gate devices wherein adjacent channels are controlled by a common gate, or as independent-gate devices wherein one channel is controlled by two gates. Metal interconnects coupling a plurality of the FinFET devices are made of a same material as the gate electrodes. Such structural and material commonalities help to reduce costs of manufacturing high-density memory arrays.

Abstract: An integrated circuit includes a semiconductor substrate and at least one memory cell provided with a vertical gate selection transistor buried in the substrate and a floating gate state transistor. The floating gate state transistor covers a first active region and a second active region of the substrate delimited by lateral isolation regions. The memory cell includes a lateral isolation region thickness (in breadth) dimension between a sidewall of the vertical gate of the buried transistor and the second active region.

Abstract: A microelectromechanical device includes: a supporting body, containing semiconductor material; a movable mass, constrained to the supporting body with a relative degree of freedom with respect to a first motion direction perpendicular to the supporting body; and at least one stopping structure, configured to limit out-of-plane movements of the movable mass along the first motion direction. The stopping structure includes: first elements, extending parallel to the first motion direction and anchoring the stopping structure to the supporting body; and a second element, extending transversally to the first elements, surmounting and connecting the first elements.

Abstract: A MOSFET device comprising: a structural region, made of a semiconductor material having a first type of conductivity, which extends between a first side and a second side opposite to the first side along an axis; a body region, having a second type of conductivity opposite to the first type, which extends in the structural region starting from the first side; a source region, having the first type of conductivity, which extends in the body region starting from the first side; a gate region, which extends in the structural region starting from the first side, traversing entirely the body region; and a shielding region, having the second type of conductivity, which extends in the structural region between the gate region and the second side. The shielding region is an implanted region self-aligned, in top view, to the gate region.

Abstract: Articles carried by a carrier are processed in a sequence of processing steps that includes a plating step where a base layer of plating material is plated on a surface of the carrier. The plating material plated on the surface of the carrier is selectively stripped to partially remove the plating material to reduce e thickness of the base layer of plating material plated present on the surface of the carrier. A residual protective layer of plating material having the reduced thickness is left on the surface of the carrier.

Abstract: A wireless charging transmitter device is includes a square wave signal generation circuit. The square wave signal generation circuit is formed by a first PMOS transistor switching circuit having a group of PMOS performance transistors and at least one PMOS functionality transistor, and a second NMOS transistor switching circuit having a group of NMOS performance transistors and at least one NMOS functionality transistor.

Abstract: At least one transmission of scrambled data with a pseudo-random sequence generated by a scrambling polynomial and an initialization value is performed between a transmitter and a receiver. Prior to the transmission, transmitter and the receiver engage in a secret negotiation phase to specifically determine the scrambling polynomial and the initialization value for the at least one transmission.

Abstract: MEMS device having a substrate of semiconductor material; a first structural layer of semiconductor material, on the substrate; a second structural layer of semiconductor material, on the first structural layer; an active portion, accommodating active structures formed in the first structural layer and/or in the second structural layer; a connection portion, accommodating a plurality of connection structures and arranged laterally to the active portion; and a plurality of conductive regions, arranged on the substrate and extending between the active portion and the connection portion. Each connection structure is formed by a first connection portion, in electrical contact with a respective conductive region and formed in the first structural layer, and by a second connection portion, on the first connection portion and in electrical continuity therewith, the second connection portion formed in the second structural layer. The first connection portion has a greater thickness than the second connection portion.

Abstract: A resettable digital stage operates when a supply voltage is higher than a threshold. A non-volatile memory stores a digital code read by a reading stage. A main power-on reset circuit generates a main reset signal controlling reset of the reading stage. A resettable volatile memory coupled to the reading stage stores a default value when reset. An auxiliary power-on reset circuit generates an auxiliary reset signal controlling reset of the volatile memory. Upon deactivation of the reset, the reading stage loads the digital code into the volatile memory. The main power-on reset circuit functions in a non-trimmed configuration response to the stored default value and in a trimmed configuration responsive to the stored digital code. The main power-on reset circuit has first and second operative thresholds which respectively fall within a first and second non-trimmed voltage range or within a first and second trimmed voltage range.

Abstract: A method for making a phase change memory includes a step of forming an array of phase change memory cells, with each cell being separated from neighboring cells in the same line of the array and from neighboring cells in the same column of the array, by the same first distance. The method further includes a step of etching one memory cell out of N, with N being at least equal to 2, in each line or each column.

Abstract: A receiver or transmitter circuit includes a signal propagation path between a radio-frequency (RF) signal node and a baseband processing circuit. Variable gain circuitry is configured to vary a gain applied to a signal propagating between the RF signal node and the baseband processing circuit. The variable gain circuitry varies the gain via first, coarse steps as well as via second, fine steps. This facilitates fine matching of the gains experienced by signals propagating over the in-phase and the quadrature branches in the transmitter and/or receiver circuit.

Abstract: The present disclosure relates to an electronic circuit comprising a semiconductor substrate, radiofrequency switches corresponding to MOS transistors comprising doped semiconductor regions in the substrate, at least two metallization levels covering the substrate, each metallization level comprising a stack of insulating layers, conductive pillars topped by metallic tracks, at least two connection elements each connecting one of the doped semiconductor regions and formed by conductive pillars and conductive tracks of each metallization level. The electronic circuit further comprises, between the two connection elements, a trench crossing completely the stack of insulating layers of one metallization level and further crossing partially the stack of insulating layers of the metallization level the closest to the substrate, and a heat dissipation device adapted for dissipating heat out of the trench.

Abstract: An optoelectronic device includes a backlight panel illuminating a display panel. The backlight panel includes an array of light emitting pixels, each light emitting pixel having at least one subpixel with one or more light emitting diodes positioned on a substrate. The pixel further includes at least one photodetector positioned on the substrate and arranged to detect an amount of reflected light emitted by said subpixel and reflected by the display panel.