Abstract: A resonant converter includes a primary switching circuit including a primary winding and upper and lower switching half-bridge circuits alternately activated during switching cycles of the resonant converter responsive to switching control signals. The switching half-bridge circuits each include a phase node to drive the primary winding. A resonance inductor is coupled to the primary winding. A secondary resonant circuit has a secondary winding magnetically coupled to the primary winding and a resonance capacitor electrically coupled to the secondary winding. A driving circuit generates the switching control signals and senses if a voltage on the phase node of one of the upper and lower switching half-bridge circuits is a negative voltage. The driving circuit adjusts the switching control signals for the switching half-bridge circuit to be activated next switching cycle by a shift time reduced each switching cycle until the negative voltage is less than a negligible under-voltage value.

Abstract: A circuit provides a high-voltage low-drop diode-like conductive path between a DC voltage supply terminal and a bootstrap terminal in charging a supply capacitor for driving a power switch with the capacitor set between the bootstrap terminal and an output terminal alternatively switchable between a low voltage and a high voltage DC voltage. In an embodiment, the circuit includes first and second transistors such as LDMOS depletion transistors with the first transistor set in a cascode arrangement between the bootstrap terminal and the DC voltage supply terminal and the second transistor coupled with a sense comparator for comparing the voltage at the bootstrap terminal with the voltage at said DC voltage supply terminal. The first and second transistors have common control terminals coupled with the DC voltage supply terminal and common coupling terminals to the bootstrap terminal.

Abstract: A clock generator includes a microcontroller unit calibrated by aligning at subsequent calibration times a frequency of a first clock with respect to the frequency of a second clock having a higher frequency accuracy than the first clock, with the frequency of the first clock varying between subsequent calibration times. The frequency of the first clock is aligned to a frequency which is offset by a certain amount with respect to the frequency of the second clock to counter frequency error which may accumulate over time due to the variation in the frequency of the first clock.

Abstract: A circuit with Miller compensation effect includes a first stage and a second stage, with a first terminal for receiving a bias current and a second terminal that can be coupled to ground, wherein the first stage includes a differential stage coupled via a coupling line to the second stage. The second stage includes a transistor with a Miller compensation network, which is set between the first terminal of the second stage and the control terminal of the aforesaid transistor. A compensation-control transistor, which is coupled to the second terminal of said differential stage, can be activated for coupling the aforesaid second terminal to ground, the compensation-control transistor having its control terminal coupled to the aforesaid coupling line between the first and second stages.

Abstract: Described herein is a modular system for a system for electrically stimulating a biological tissue, which includes: a first device (32) including a number of electrodes (45), which in use contact the biological tissue; and a second device (34) including an electronic control circuit (55), which transmits stimulation signals. The second device may be operatively coupled in a releasable way to the first device, in such a way that the first device receives the stimulation signals transmitted by the second device.

Abstract: An electronic component, such as an integrated circuit, includes at least one circuit having coupled therewith electrical connections including a lead frame of electrically conductive material. The lead frame is produced by an additive process of conductive material, e.g., by 3D printing, by forming a three-dimensional structure of leads having overlapping surfaces with a gap therebetween.

Abstract: An embodiment of a video-surveillance method comprising: activating a video camera for acquiring, for a surveillance system comprising the aforesaid video camera, a digital video sequence of images of a scene to be surveyed, detecting given events and transmitting to a remote center images of the aforesaid digital video sequence of images acquired according to the result of the aforesaid operation of event detection. An embodiment includes: executing an operation of extraction of key frames on the aforesaid digital video sequence of images for composing a visual storyboard, detecting given events on the basis of data supplied by one or more event sensors for generating an event signal, controlling operating states assumed by the aforesaid key-frame-extraction operation as a function of the values assumed by the aforesaid event signal, and transmitting the aforesaid visual storyboard to the aforesaid remote center.

Abstract: A method for activation of a payment card includes accessing a remote computer server of a card issuer to input card activation information, storing a unique code in the payment card having a contactless readable interface and in the remote computer server, the unique code corresponding to the payment card, and reading the unique code by a user terminal having a corresponding contactless interface, the user interface configured to connect over a communication network to access messages directed to the cardholder. The method also includes sending the unique code from the user terminal to the remote computer server, and upon verification of the unique code at the remote computer server, generating and sending an activation code to the user terminal and supplying access to an activation code input mask corresponding to the payment card.

Abstract: An integrated circuit on a substrate includes a peripheral portion that surrounds an active area and is positioned close to a scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations starting from the substrate and forms an integrated antenna. Another conductive structure extends in the peripheral portion on different planes of metallizations and forms a seal ring.

Abstract: A memory device includes an array of phase-change memory (PCM) cells and complementary PCM cells. A column decoder is coupled to the array of PCM cells and complementary PCM cells, and a sense amplifier is coupled to the column decoder. The sense amplifier includes a current integrator configured to receive first and second currents of a given PCM cell and complementary PCM cell, respectively. A current-to-voltage converter is coupled to the current integrator and is configured to receive the first and second currents, and to provide first and second voltages of the given PCM cell and complementary PCM cell to first and second nodes, respectively. A logic circuit is coupled to the first and second nodes and is configured to disable the column decoder and to discharge the bitline and complementary bitline voltages in response to the first and second voltages.

Abstract: A probe card is adapted for testing at least one integrated circuit that integrated on a corresponding at least one die of a semiconductor material wafer. The probe card includes a board adapted for the coupling to a tester apparatus. Several probes are coupled to the board. The probe card includes replaceable elementary units, wherein each unit includes at least one probe for contacting externally-accessible terminals of an integrated circuit under test. The replaceable elementary units are arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.

Abstract: An electronic device provided with a package housing a stacked structure formed by dies of semiconductor material, which have a respective integrated circuit and a respective top surface, which extends in a horizontal plane, and are stacked on one another in a vertical direction, transverse to the horizontal plane, and staggered parallel to the same horizontal plane. Provided at a first portion of the top surface is a first plurality of contact pads, and provided at a second portion of the top surface is a second plurality of contact pads. The first portion is covered by a overlying die, and the second portion is exposed and freely accessible. At least some of the contact pads of the first plurality are electrically coupled to internal through silicon vias traversing a substrate of the overlying die to put overlapping dies in electrical contact.

Abstract: A photodiode structure is based on the use of a double junction sensitive to different wavelength bands based on a magnitude of a reverse bias applied to the photodiode. The monolithic integration of a sensor with double functionality in a single chip allows realization of a low cost ultra-compact sensing element in a single packaging useful in many applications which require simultaneous or spatially synchronized detection of optical photons in different spectral regions.

Abstract: A semiconductor device includes: a semiconductor body including an active region that houses an electronic component and a passive dielectric region surrounding the active region; a conductive buried region, of metallic material or metallic alloy, which extends in the semiconductor body in the active region; and one or more electrical contacts, of metallic material, which extend between the conductive buried region and a top surface of the semiconductor body, and form respective paths for electrical access to the conductive buried region.

Abstract: A probe card fits in a system for testing a micro-electro-mechanical device having an element sensitive to a magnetic field. The probe card is formed by a PCB having a through-opening and probe tips for electrically contacting the micro-electro-mechanical device. A housing structure is received within the through-opening. The housing structure includes a planar peripheral region surrounding seats that protrude and extend at least partly into the through-opening. Magnetic elements are arranged in the seats, with the magnetic elements configured to generate a test magnetic field for testing operation of the micro-electro-mechanical device.

Abstract: A comparator circuit including: a first node and a second node, which receive a first current and a second current, respectively; a first current mirror, which includes a first load transistor and a first output transistor; and a second current mirror, which includes a second load transistor and a second output transistor.

Abstract: An electroacoustic MEMS transducer, having a substrate of semiconductor material; a through cavity in the substrate; a back plate carried by the substrate through a plate anchoring structure, the back plate having a surface facing the through cavity; a fixed electrode, extending over the surface of the back plate; a membrane of conductive material, having a central portion facing the fixed electrode and a peripheral portion fixed to the surface of the back plate through a membrane anchoring structure; and a chamber between the membrane and the back plate, peripherally delimited by the membrane anchoring structure.

Abstract: An integrated sensor device including a first die, housing a sensor element to detect a quantity external to the sensor device and transduce the external quantity into an electrical sensing signal; a second die mechanically coupled to the first die so that the first and second dies are stacked on one another along one and the same axis; and at least one heater of a resistive type integrated in the first die and/or in the second die, having a first conduction terminal and a second conduction terminal configured to couple respective first and second conduction terminals of a signal generator for causing an electric current to flow, in use, between the first and second conduction terminals of the heater and generate heat by the Joule effect. It is possible to carry out calibration in temperature of the sensor element.

Abstract: A triangular-voltage generator has an input terminal that receives a power supply voltage and an output terminal that supplies a triangular-wave voltage having a repetition period. An operational amplifier in an integrator configuration has a first input, a second input and an output coupled to the output terminal. The second input receives a reference voltage as a function of the power supply voltage. The first input is selectively and alternately connected to the input terminal during a first half-period of the repetition period and to a reference terminal during a second half-period of the repetition period.

Abstract: An integrated circuit includes an array of phase-change memory (PCM) cells, and bitlines coupled to the array of PCM cells. The integrated circuit also includes a first decoder circuit having a respective plurality of transistors having a first conductivity type being coupled together and to a given bitline from among the plurality thereof and configured to inject a program current pulse into a selected PCM cell. In addition, the integrated circuit includes a second decoder circuit having a plurality of transistors having a second conductivity type being coupled together and to the given bitline and configured to discharge the given bitline at an end of the program current pulse.