Abstract: A MEMS force sensor has: a substrate; a fixed electrode coupled to the substrate; and a mobile electrode suspended above the substrate at the fixed electrode to define a sensing capacitor, the mobile electrode being designed to undergo deformation due to application of a force to be detected. A dielectric material region is set on the fixed electrode and spaced apart by an air gap from the mobile electrode, in resting conditions. The mobile electrode comes to bear upon the dielectric material region upon application of a minimum detectable value of the force, so that a contact surface between the mobile electrode and the dielectric material region increases, in particular in a substantially linear way, as the force increases.

Abstract: A process for manufacturing a surface-mount electronic device includes forming a plurality of preliminary contact regions of a sinterable material on a supporting structure, the supporting structure being of a soluble type. A chip including a semiconductor body is mechanically coupled to the supporting structure. The sinterable material is sintered such that each preliminary contact region forms a corresponding sintered preliminary contact, and the chip and the plurality of preliminary contact regions are coated with a dielectric coating region, and the supporting structure is removed using a jet of liquid.

Abstract: A galvanic isolation is provided between a first circuit and a second circuit. A first galvanically isolated link is configured to transfer power from a first circuit to a second circuit across the galvanic isolation. A second galvanically isolated link is configured to feed back an error signal from the second circuit to the first circuit across the galvanic isolation for use in regulating the power transfer and further configured to support bidirectional data communication between the first and second circuits across the galvanic isolation.

Abstract: A projective MEMS device, including: a fixed supporting structure made at least in part of semiconductor material; and a number of projective modules. Each projective module includes an optical source, fixed to the fixed supporting structure, and a microelectromechanical actuator, which includes a mobile structure and varies the position of the mobile structure with respect to the fixed supporting structure. Each projective module further includes an initial optical fiber, which is mechanically coupled to the mobile structure and optically couples to the optical source according to the position of the mobile structure.

Abstract: A circuit includes a final stage that includes an H-bridge comprising first and second half-bridges. A read circuit is configured to read a load current supplied by a class-D audio-amplifier to a load. The read circuit is configured for estimating the load current by reading a current at an output by the first or second half-bridge by measuring a drain-to-source voltage during an ON period of a power transistor of the H-bridge. A sensing circuit is configured to detect a first drain-to-source voltage from a transistor of the first half-bridge and a second drain-to-source voltage from a corresponding transistor of the second half-bridge. The sensing circuit is also configured to compute a difference between the first drain-to-source voltage and the second drain-to-source voltage and to perform an averaging operation on the difference to obtain a sense voltage value to be supplied to an analog-to-digital converter.

Abstract: A system for designing Network-on-Chip interconnect arrangements includes a Network-on-Chip backbone with a plurality of backbone ports and a set of functional clusters of aggregated IPs providing respective sets of System-on-Chip functions. The functional clusters include respective sub-networks attachable to any of the backbone ports and to any other functional cluster in the set of functional clusters independently of the source map of the Network-on-Chip backbone.

Abstract: A circuit for generating a bandgap voltage includes a circuit module for generation of a base-emitter voltage difference, the circuit module including a pair of PNP bipolar substrate transistors which identify a first current path and a second current path. A first current mirror of an n type is connected between the first and second branches and is further connected via a resistance for adjustment of the bandgap voltage to the second bipolar transistor. A second current mirror of a p type is connected between the first and second branches, and connected so that the current mirrors repeat current of each other. In operation to generate the bandgap voltage, current flows from the supply voltage to ground only through said the first and second bipolar substrate transistors.

Abstract: A current mirror includes an input transistor and an output transistor, wherein the sources of the input and output transistor are connected to a supply voltage node. The gates of the input and output transistors are connected through a switch. A first current source is coupled to the input transistor to provide an input current. A copy transistor has a source connected to the supply node and a gate connected to the gate of the input transistor at a mirror node. A second current source is coupled to the copy transistor to provide a copy current. A source-follower transistor has its source connected to the mirror node and its gate connected to the drain of the copy transistor. Charge sharing at the mirror node occurs in response to actuation of the switch and the source-follower transistor is turned on in response thereto to discharge the mirror node.

Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

Abstract: A MEMS device includes a fixed structure and suspended structure including an internal structure and a first arm and a second arm. Each arm has a first end fixed to the fixed structure and a second end fixed to the internal structure. The ends are angularly arranged at a distance apart. Piezoelectric actuators mounted to the arms are driven so as to cause deformation of the arm and produce a rotation of the internal structure. In a resting condition, each of the first and second arms has a respective elongated portion with a respective concavity. The internal structure extends in part within the concavities of the elongated portions of the first and second arms.

Abstract: An integrated current sensor device includes a supporting structure of conductive material, arranged within a package, and an integrated circuit die including a first and second magnetic-field sensor elements that are arranged along a sensor axis. An electronic circuit operatively coupled to the first and second magnetic-field sensor elements performs a differential detection of electric current. The supporting structure defines a current path for the electric current. The current path includes: a first path portion extending at the first magnetic-field sensor element; a second path portion extending at the second magnetic-field sensor element; and a third path portion that connects the first and second path portions. The first path portion and the second path portion are arranged on opposite sides of the sensor axis, and the third path portion crosses the sensor axis along a transverse axis.

Abstract: An inertial device that is integratable in a portable electronic device includes: an inertial sensor for generating at least one raw acceleration signal in response to accelerations caused by movements of walking and running of a user of the pedometer; and a processing unit, associated to the inertial sensor for counting a number of steps of the user of the pedometer on the basis of the raw acceleration signal. The inertial sensor and the processing unit are both encapsulated within a single package for integrated circuits, which can be coupled to a circuit board of an electronic device and is provided with at least one connection terminal for making the number of steps available to the outside world.

Abstract: A ringing peak detector module detects a ringing at the output of an inductive load driver including a bridge circuit containing high side and low side switches. A ringing peak detector receives differential feedback signals representative of the drain-source voltage of the low-side switch and detects a ringing peak of an oscillation of a current/voltage on the inductive load. A module compares said detected ringing peak with a maximum value and controls said driver by an error signal calculated as a function of the difference between said peak value and maximum value. The ringing peak detector module includes an input buffer module upstream of said peak detector circuit that shifts the differential feedback signals so a common mode of these signals is centered at a half-dynamic level of a supply voltage to provide correspondingly shifted voltages forming a shifted differential output corresponding to a steady state of the differential feedback signals.

Abstract: A pad forms a connection terminal suitable for coupling circuit elements integrated in a chip to circuits outside the chip itself. At least one inductor is provided for use in the reception/transmission of electromagnetic waves or for supplying the chip with power or both. The connection pad and inductor are combined in a structure which reduces overall occupied area. A magnetic containment structure surrounds the structure to contain a magnetic field of the inductor.

Abstract: A light-emitting device may include a semiconductor body having a first conductivity type, with a front side and a back side. The light-emitting device may also include a porous-silicon region which extends in the semiconductor body at the front side, and a cathode region in direct lateral contact with the porous-silicon region. The light-emitting device may further include a barrier region of electrically insulating material, which extends in direct contact with the cathode region at the bottom side of the cathode region so that, in use, an electric current flows in the semiconductor body through lateral portions of the cathode region.

Abstract: An integrated electronic device 1 for detecting at least one parameter related to humidity and/or presence of water and/or acidity/basicity of an environment surrounding the device is described. Such device 1 comprises a separation layer 14 from the surrounding environment, comprising at least one portion of insulating material 14, and further comprises a first conductive member 11 and a second conductive member 12, made of an electrically conductive material, arranged inside the separation layer 14, with respect to the surrounding environment, and separated from the surrounding environment by the separation layer 14. The device 1 also comprises a measurement module 15, having two measurement terminals 151, 152, electrically connected with the first 11 and the second 12 conductive members, respectively; the measurement module 15 is configured to provide an electric potential difference between the first 11 and the second 12 conductive members.

Abstract: A memory device includes a memory array with memory cells arranged in rows and columns and with word lines and bit lines. A dummy structure includes a dummy row of dummy cells and a dummy word line. A first pre-charging stage biases a word line of the memory array. An output stage includes a plurality of sense amplifiers. Each sense amplifier generates a corresponding output signal representing a datum stored in a corresponding memory cell pre-charged by the first pre-charging stage. A second pre-charging stage biases the dummy word line simultaneously with the word line biased by the first pre-charging stage. The output stage includes an enable stage, which detects a state of complete pre-charging of an intermediate dummy cell.

Abstract: A method is provided for performing a management of a multi-subscription SIM module. The multi-subscription SIM module includes at least one memory adapted to store at least a first and a second profile associated with a respective first and a second mobile network operator. The memory includes a volatile portion. The operation of storing includes installing or updating profiles by downloading one or more downloaded profiles from a remote host. The management includes selecting one or more enabled profiles including an application to be executed and allocating a partition of the volatile portion of the memory to the one or more enabled profile.

Abstract: A method reading a magnetic-field sensor provided with at least one first magnetoresistive element envisages generation of an output signal, indicative of a magnetic field, as a function of a detection signal supplied by the magnetic-field sensor. The reading method envisages: determining an offset signal present in the output signal; generating at least one compensation quantity as a function of the offset signal; and feeding back the compensation quantity at input to the reading stage so as to apply a corrective factor at input to the reading stage as a function of the compensation quantity, such as to reduce the value of the offset signal below a given threshold.

Abstract: A read-amplifier circuit includes a core with a first input and a second input that are intended to receive in a measurement phase a differential signal arising from a first bit line and from a second bit line of the memory device. The circuit also includes a memory element with two inverters coupled in a crossed manner. The first and second inputs are respectively connected to two of the power supply nodes of the inverters via two transfer capacitors. A first controllable circuit is configured to temporarily render the memory element floating during an initial phase preceding the measurement phase and during the measurement phase.