Abstract: A motor control circuit wherein Bemf zero crossings are sensed to provide phasing information. To avoid incorrect timing (due to detection of zero crossings which may be caused by switching noise when the power transistors switch to commutate other phases), the Bemf detection is masked. Advantageously, the Bemf detection is masked not only for the normal masking period (including an additional percentage beyond the minimum period), but is also for an additional period, if the Bemf output is not of the expected polarity.

Abstract: A processor is provided with a set of instructions formed, in general, of an operation section and an operand section. For a special control instruction, the operand section is transmitted to the operation blocks along a bypass path separate from the normal path in which normal instructions are interpreted. In this way, an extension of the set of instructions can be achieved for tailoring the set of instructions to the user's own requirements. Consequently, the processor control unit should be capable of coupling its outputs to its inputs upon receiving one such instruction, thereby to transfer such internal operation control signals without interpretation.

Abstract: A method for manufacturing integrated capacitive elements on a semiconductor substrate includes depositing a first metallization layer on a first dielectric layer. The first metallization layer includes a lower plate for a capacitive element and an interconnection pad. The method further includes forming a second dielectric layer over the first dielectric layer, forming a first opening aligned with the lower plate through the second dielectric layer, and depositing a third dielectric layer on the second dielectric layer and the lower plate and covering sidewalls of the first opening. A second opening is formed through the third dielectric layer and aligned with the interconnection pad. A fourth dielectric layer is deposited on the whole wafer surface, wherein the fourth dielectric layer is etchable in a completely selective manner relative to the third dielectric layer.

Abstract: Disclosed is a CMOS image sensor that includes circuitry for identifying defective pixels, particularly pixels having leaky access switches. The leaky access switches allow charge to escape from the pixel over a row or column line in a pixel array, thereby corrupting the outputs of an entire row or column of pixels. A disclosed test involves (a) electronically setting a defined charge in a selected pixel of the CMOS imager; (b) reading the output of the selected pixel; and (c) comparing the output of the selected pixel to an expected value based upon the defined charge set in the selected pixels. If the output significantly deviates from the expected value, then the selected pixel is identified as having a leaky access switch. Preferably, a newly fabricated sensor is first tested as described. If such leaky access switch is discovered, the imager is discarded without incurring further manufacturing cost.

Abstract: A device includes a capacitive structure including an input node and n output nodes, r integrated capacitors connected in series between two adjacent nodes, an integrated capacitor connected between the input node and ground, an integrated capacitor connected between the nth output node and ground, and r capacitive branches connected in parallel between ground and each node of the capacitive structure including the first output node and the (n−1)th output node. Each branch may include r+1 series-connected integrated capacitors. Furthermore, the integrated capacitors of the capacitive structure are theoretically identical. The device may also include a charge source for charging each node of the capacitive structure. Additionally, a measurement circuit may measure the charge at each of the nodes of the structure, and a comparison circuit may compare each measured nodal charge value with a theoretical nodal charge value while taking into account a predetermined nodal tolerance.

Abstract: An electric connection structure connecting a first silicon body to conductive regions provided on the surface of a second silicon body arranged on the first body. The electric connection structure includes at least one plug region of silicon, which extends through the second body; at least one insulation region laterally surrounding the plug region; and at least one conductive electromechanical connection region arranged between the first body and the second body, and in electrical contact with the plug region and with conductive regions of the first body. To form the plug region, trenches are dug in a first wafer and are filled, at least partially, with insulating material. The plug region is fixed to a metal region provided on a second wafer, by performing a low-temperature heat treatment which causes a chemical reaction between the metal and the silicon. The first wafer is thinned until the trenches and electrical connections are formed on the free face of the first wafer.

Abstract: A method of writing in page mode in an electrically erasable and programmable non-volatile memory includes an initialization phase of writing an information element for the selection of the page in a storage latch associated with a column of the non-volatile memory array, and the writing in a temporary memory of each of the data bits to be written in the page. A write phase includes the selection of rows of the non-volatile memory array according to the contents of the temporary memory. A page mode write circuit includes one latch per column of the non-volatile memory array to contain a page selection information element, and a control logic circuit to give the row selection signals as a function of the contents of the temporary memory in a phase for writing the column of the non-volatile memory array.

Abstract: A method and circuit are disclosed for controlling the write head of a magnetic disk storage device. The circuit includes a pull-up device and a current sink circuits coupled to each terminal of the write head, for selectively sourcing current to and sinking current from the write head, respectively. A clamp device is coupled to each write head terminal to selectively clamp the write head terminals to steady state intermediate voltage levels. The circuit further includes a control circuit for individually activating the pull-up devices, the current sink circuits and the clamp devices. In particular, when reversing the direction of current flow through the write head from a first direction in which current is provided to the write head via the write head terminal to a second direction in which current is drawn from the write head from the write head terminal, the appropriate pull-up device is activated for a predetermined period of time.

Abstract: A number of voltage-controlled resistance cells, each formed by a transistor with a biasing capacitor connected between the gate and source and an associated controller coupled to the capacitor to maintain a steady charge on the biasing capacitor and keep the gate-source voltage at a control voltage corresponding to a desired resistance, are employed to form a voltage-controlled resistance structure. The gate voltage applied to each transistor is able to “float” together with the source voltage in order to keep the gate-source voltage constant, and the resistance structure exhibits improved voltage-dependent resistance linearity together with a larger range of biasing while lowering needed refresh frequencies to avoid noise injection.

Abstract: The thin film transistor formed of polycrystalline silicon is positioned adjacent a heat reaction chamber. The gate electrode for the transistor is formed within a silicon substrate and a gate dielectric is positioned over the gate electrode. A pass transistor is coupled to the gate electrode, the pass transistor having a source/drain region in the same semiconductor substrate and positioned adjacent to the gate electrode of the thin film heating transistor. When the pass transistor is enabled, a voltage is applied to the gate electrode which causes the current to flow from the drain to the source of the thin film transistor. The current flow passes through a highly resistive region which generates heat that is transmitted to the heat reaction chamber.

Abstract: Described herein is a nonvolatile memory comprising a memory array organized according to global word lines and local word lines; a global row decoder; a local row decoder; a first supply stage for supplying the global row decoder; and a second supply stage for supplying the local row decoder; and a third supply stage for biasing the drain and source terminals of the memory cells of the memory array. Each of the supply stages comprises a respective resistive divider formed by a plurality of series-connected resistors, and a plurality of pass-gate CMOS switches each connected in parallel to a respective resistor. The nonvolatile memory further comprises a control circuit for controlling the pass-gate CMOS switches of the supply stages, and a switching circuit for selectively connecting the supply input of the control circuit to the output of the second supply stage during reading and programming of the memory, and to the output of the third supply stage during erasing of the memory.

Abstract: Several peripheral entities are provided, with each peripheral entity being clocked by its own internal clock signal and being able to access a single-access memory. A priority entity is defined from among the peripheral entities, and the other peripheral entities are defined as auxiliary entities. A repetitive time frame is formulated, regulated by the internal clock signal of the priority entity, and subdivided into several groups of time windows that are allocated to the peripheral entities. One of the peripheral entities is a microprocessor that is disabled for a fixed duration after each memory access request.

Abstract: The semiconductor device comprises a semiconductor substrate (SB) having locally at least one zone (ZL) terminating in the surface of the substrate and entirely bordered, along its lateral edges and its bottom, by an insulating material so as to be completely isolated from the rest of the substrate. The horizontal isolating layer may be a layer of constant thickness or a crenellated layer.

Abstract: A fuse-redundancy circuit for use in an integrated circuit and method for operating the same. The fuse-redundancy circuit comprises at least two fuses, at least two fuse-control devices, and a status-checking circuit. Each one of the at least two fuse-control devices is operable to control an electric current flowing through a corresponding one of the at least two fuses. The status-checking circuit operable to generate a status signal having (i) a first state when at least one of the at least two fuses is blown, and (ii) a second state otherwise.

Abstract: A bias circuit integrated on a silicon wafer includes first, second and third branches. The first branch includes a first PMOS transistor in series with a first NMOS transistor. The second branch includes a second PMOS transistor, a second NMOS transistor and an electric resistor in series. The gate of the first NMOS transistor is connected to the gate of the second NMOS transistor. The first branch and the second branch are arranged as a current mirror. The third branch includes a third PMOS transistor in series with a third NMOS transistor. The third PMOS and NMOS transistors are arranged to maintain a drain voltage of the first PMOS transistor that is substantially identical to a drain voltage of the second PMOS transistor.

Abstract: Several audio/video streams are recorded in an interleaved manner on logical tracks of variable sizes. These audio/video streams are selected on the basis of an allocation table contained in a random access memory, and which describes the state of occupancy of the logical tracks. The logical tracks include elementary storage portions formed of integer numbers of sectors of the disk. A chaining of the various portions is performed during recording using the index numbers of the preceding and succeeding portions, as well as indications of unknown relationships which will be updated subsequently.

Abstract: A multilayer semiconductor device includes at least one structure for transmitting electrical signals, and in particular, microwave signals. The device includes at least one electrically conductive enclosure that includes a bottom plate and a top plate in two different layers. Lateral walls connect the bottom and top plates. Electrically conductive connecting strips extend into the enclosure and are in an intermediate layer, and are electrically insulated from the enclosure. The enclosure has at least one passage through which extends electrical connections of the connecting strips, which are also electrically insulated from the enclosure.

Abstract: A fuel cell for an electrical load circuit includes a first monocrystalline silicon substrate and a positive half-cell formed therein, and a second monocrystalline silicon substrate and a positive half-cell formed therein. Each half-cell includes a microporous catalytic electrode permeable to a gas and connectable to the electrical load circuit. A cell area is defined on a surface of each respective monocrystalline silicon substrate, and includes a plurality of parallel trenches formed therein for receiving the gas to be fed to the respective microporous catalytic electrode. A cation exchange membrane separates the two microporous catalytic electrodes. Each half-cell includes a passageway for feeding the respective gas to the corresponding microporous catalytic electrode.

Abstract: An integrated circuit on a silicon substrate includes at least one polysilicon line and at least one antistatic contact connecting the polysilicon line to the silicon substrate. The antistatic contact includes a thin oxide layer between the polysilicon line and the silicon substrate. The thin oxide layer is of a sufficiently small thickness so that a current flows across it by the tunnel effect when the polysilicon line is brought, relatively to the substrate, to a voltage greater or less than determined thresholds.

Abstract: A device for the comparison of two resistors is based upon analog information carried by currents. The device includes a measurement circuit for extracting the currents from the two resistors to be compared, and copies the currents to a parallel analog-digital converter that carries out the division of the extracted currents. The device converts the ratio of the extracted currents into a digital code that is the image of the ratio of the two resistors. The ratio is constantly re-updated as a function of environmental parameters of the circuit, such as the operating temperature. Also disclosed is a system for correcting the value of integrated compensated resistors. The system implements a device of this kind that does not use a reference voltage generator.