Abstract: A memory device includes a plurality of memory cells and programming circuitry configured to select a group of memory cells, receive a first data word and program memory cells of the selected group based on the data word. The memory device includes a program circuit configured to receive at least one second data word, and, for each second data word, send a program current in parallel to discriminated memory cells based on the corresponding second data word during a corresponding program phase. The memory device further includes an optimization circuit configured to generate the at least one second data word from the first data word. The number of discriminated memory cells of the second data word is maximized compatibly with a maximum predetermined limit of the total program current provided by the program circuit.

Abstract: Imaging device comprising at least one photosite comprising a charge storage semiconductor zone, a charge collection semiconductor zone and transfer means designed to permit charge transfer between the charge storage zone and the charge collection zone, characterized in that the charge storage semiconductor zone comprises a lower semiconductor zone and a conduction channel buried beneath the upper surface of the photosite and connecting said lower semiconductor zone to the charge collection zone.

Abstract: Capacitance sensing circuits and methods are provided. A dual mode capacitance sensing circuit includes a capacitance-to-voltage converter having an amplifier and an integration capacitance coupled between an output and an inverting input of the amplifier, and a dual mode switching circuit responsive to mutual mode control signals for a controlling signal supplied from a capacitive touch matrix to the capacitance-to-voltage converter in a mutual capacitance sensing mode and responsive to self mode control signals for controlling signals supplied from the capacitive touch matrix to the capacitance-to-voltage converter in a self capacitance sensing mode, wherein the capacitance sensing circuit is configurable for operation in the mutual capacitance sensing mode or the self capacitance sensing mode.

Abstract: An apparatus for performing metrology of a wafer. The apparatus may include a substrate with a plurality of microprobes. A plurality of light sources may direct light onto each of the microprobes. Light reflected from the microprobes may be detected by a plurality of photodetectors thereby generating a detection signal associated with each of the microprobes. A controller may send a driving signal to each of the plurality of microprobes and determine a height profile and a surface charge profile of the wafer based on each of the detection signals.

Abstract: It is proposed a method for the projection of a sequence of images onto a projection surface by a handheld device having an embedded projector, said method comprising, for an input image to be projected of said sequence of images: a step of evaluation wherein a spatial position variation is evaluated with respect to a reference spatial position of said handheld device; and said spatial position variation is defined by a spatial orientation variation and a spatial vector variation; said spatial vector variation being determined by 3 independent coordinates; and at least one of said 3 independent coordinates is provided by a stereoscopic sensor; a step of compensation wherein a compensated image is generated from said input image to be projected depending on said spatial position variation; and a step of projecting onto said projection surface said compensated image.

Abstract: A method for manufacturing a wafer on which are formed resonators, each resonator including, above a semiconductor substrate, a stack of layers including, in the following order from the substrate surface: a Bragg mirror; a compensation layer made of a material having a temperature coefficient of the acoustic velocity of a sign opposite to that of all the other stack layers; and a piezoelectric resonator, the method including the successive steps of: a) depositing the compensation layer; and b) decreasing thickness inequalities of the compensation layer due to the deposition method, so that this layer has a same thickness to within better than 2%, and preferably to within better than 1%, at the level of each resonator.

Abstract: A method of protecting a circuit from attacks aiming to discover secret data used during the execution of a cryptographic calculation by the circuit, by, executing a transformation calculation implementing a bijective transformation function, receiving as input a secret data, and supplying a transformed data, executing a cryptographic calculation receiving as input a data to process and the transformed data, and executing an inverse transformation calculation receiving as input the result of the cryptographic calculation, and supplying a result that the cryptographic calculation would have supplied if it had been applied to the data to process and directly to the secret data, the data to process belong to a stream of a multiplicity of data, the transformed data being supplied as input to the cryptographic calculation for all the data of the stream.

Abstract: An additional cyclic redundancy check (CRC) is inserted in IEEE 802.11 beacon or data frames prior to the end of the frame, at a location following information sufficient for the receiving station to determine whether the frame is from an overlapping basic service set or intended for a different station and to extract other necessary or useful information such as a time of the next full beacon. Upon detecting the CRC, the receiving STA can terminate reception of the frame early to conserve power, and then enter a low power operational mode to further conserve power.

Abstract: An integrated tool to reduce defects in manufacturing a semiconductor device by reducing queue times during a manufacturing process. The integrated tool may include at least one a polishing tool comprising at least one polishing module and at least one deposition tool comprising at least one deposition chamber. At least one pump-down chamber may connect the polishing tool to the deposition tool. The at least one pump-down chamber includes a passage through which the semiconductor device is passed. Defects in the semiconductor device are reduced by reducing the queue time at various stages of the fabrication process.

Abstract: A wafer handling station includes a housing defining a chamber, and a wafer cassette assembly positionable in the chamber. The wafer cassette assembly includes a vertical support, and cassette members carried by the vertical support in spaced relation. Each cassette member includes a base coupled to the vertical support, wafer contact pads on an upper surface of the base and configured to support a wafer thereon, and a pair of wafer brackets carried by the base and configured to engage respective edges of the wafer to laterally confine the wafer.

Abstract: An electromagnetic transponder includes an antenna circuit, a load, and a charge pump transistor having a current path coupled between the antenna circuit and the load. During operation, a retromodulated signal is transmitted at a first level by biasing the charge pump transistor during a first time period such that an impedance of the antenna circuit has a first impedance value and current flows from the antenna circuit to the load. A retromodulated signal at a second level is transmitted by biasing the charge pump transistor during a second time period such that the impedance of the antenna circuit has a second impedance value different than the first impedance value and current flows from the antenna circuit to the load. The retromodulated signals are transmitted at the first and second levels in a sequence determined to transmit information from the electromagnetic transponder.

Abstract: Capacitance sensing circuits and methods are provided. The capacitance sensing circuit includes a capacitance-to-voltage converter configured to receive a signal from a capacitance to be sensed and to provide an output signal representative of the capacitance, an output chopper configured to convert the output signal of the capacitance-to-voltage converter to a sensed voltage representative of the capacitance to be sensed, an analog accumulator configured to accumulate sensed voltages during an accumulation period of NA sensing cycles and to provide an accumulated analog value, an amplifier configured to amplify the accumulated analog value, and an analog-to-digital converter configured to convert the amplified accumulated analog value to a digital value representative of the capacitance to be sensed. The analog accumulator may include a low pass filter having a frequency response to filter wideband noise.

Abstract: Pre-migration of metal ions is achieved in a controlled manner to form a migrated metalover which an inhibitor is applied to prevent further migration. In a semiconductor circuit, pre-migration of metal ions is achieved by exposing a joined metal system to water, oxygen and an electrical field in a controlled manner. Conductors, joined to electrically isolating materials, are exposed to electrical fields in such a manner as to form one or more anodes to corresponding cathodes, thus liberating metal ions. The metal ions are then allowed to migrate in a controlled manner from the anode toward the cathode to form a pre-migrated metal. Finally, an inhibitor is applied on top of the pre-migrated metal to prevent further migration.

Abstract: A semiconductor processing device and a method of operating the same. The method may include measuring at least one property of a semiconductor wafer and determining a recipe for processing the semiconductor wafer based on the at least one property. The semiconductor wafer may be processed with a plurality of chemical mechanical polishing (CMP) modules based on the determined recipe, wherein the recipe comprises a value of at least one parameter for use by each of the plurality of CMP modules. The measurements may be made in situ or by an inline metrology device. The recipe and various parameters associated with the recipe may be determined by a controller of the semiconductor processing device.

Abstract: A driver circuit includes a differential input, a differential output, a bias node, a first T-coil having a first node coupled to the negative output node and a second node coupled to a source of supply voltage, a second T-coil having a first node coupled to the positive output node and a second node coupled to the source of supply voltage, a first transistor having a current path coupled between the center tap of the first T-coil and a first intermediate node, a second transistor having a current path coupled between the center tap of the second T-coil and a second intermediate node, a third transistor having a current path coupled between the first intermediate node and ground, and a fourth transistor having a current path coupled between the second intermediate node and ground.

Abstract: An electronic device including a set of functional block, and a biasing block for generating a set of bias voltages for the functional blocks. The electronic device further includes a holding block coupled between the biasing block and the functional blocks for providing each bias voltage to at least one corresponding functional block, for each bias voltage the holding block including a capacitive element for storing the bias voltage, and a switch element switchable between an accumulation condition wherein provides the bias voltage from the biasing block to the capacitive element and to the at least one corresponding functional block, and a release condition wherein isolates the capacitive element from the biasing block and provides the bias voltage from the capacitive element to the at least one corresponding functional block, and a control block for alternately switching the switching elements between the accumulation condition and the release condition.

Abstract: A control apparatus for LED diodes includes a dimmer TRIAC electrically connected in series between a power supply and a LED lighting converter. The converter comprises a transformer, with a primary winding coupled with an input terminal and a secondary winding coupled with an output terminal, and a switch coupled to the primary winding to regulate the current through the primary winding and regulate the output voltage. The apparatus comprises a control device adapted to control said switch determining the on period and the off period of the switch to maintain constant the output current to supply said LED diodes. The apparatus comprises a detector connected to the secondary winding of the transformer and adapted to detect the conduction angle of the TRIAC; the control device is adapted to regulate the output current to supply said LED diodes in response to the TRIAC conduction angle detected by the detector.

Abstract: Transponder comprising a resonant circuit, comprising an antenna and a capacitor, and at least one memory, wherein it comprises at least one contact zone for receiving a portion of human body, so that the positioning of a portion of human body on a contact zone modifies the electric circuit of the transponder, capable of switching from a first state in which it does not allow the memory to be read and/or written to a second state in which it allows the memory to be read and/or written when the resonant circuit of the transponder is contactlessly powered by a reader and in that it comprises an indicator which makes it possible to indicate that the positioning of a portion of human body on the contact zone of the transponder is or has been recognized.

Abstract: A method of fabricating an image sensor includes the steps of: forming at least two photosites in a semiconductor substrate; forming a trench between the photosites; forming a thin liner on at least the sidewalls of the trench; depositing a conductive material having a first refractive index in the trench; and forming a region surrounded by the conductive material and having a second refractive index lower than the first index of refraction within the conductive material in the trench.

Abstract: Motion estimation systems and methods are disclosed. An apparatus may include a processing unit to acquire video images and to arrange the video images into a plurality of sequential video frames, and a motion estimation unit that receives the sequential video frames and determines a set of repetitive pattern neighbor candidate vectors for repetitive pattern content in a first frame. The set of repetitive pattern neighbor candidate vectors may be reduced by sorting the set to eliminate spurious repetitive pattern neighbor candidate vectors. The reduced set may be provided to a second adjacent frame. A method may include acquiring a plurality of sequential video frames having a repetitive pattern content, and determining a set of repetitive pattern neighbor candidate vectors for the repetitive pattern content in a first frame of the sequential video frames. The set of repetitive pattern neighbor candidate vectors may be sorted by determining at least one spurious repetitive pattern neighbor candidate vector.