Abstract: An integrated circuit device comprises a first transistor having a gate coupled to an output of a first operational amplifier, a second transistor having a threshold voltage proportional to a threshold voltage of the first transistor, the second transistor having a gate coupled to an inverting input of a second operational amplifier, an output of the second operational amplifier coupled to an inverting input of the first operational amplifier, a first resistor coupled between the second transistor gate and the inverting input of the second operational amplifier, and a second resistor coupled between the output of the second operational amplifier and the inverting input of the second operational amplifier, a ratio of the second resistor to the first resistor selected based upon a ratio of a production distribution of a transistor source voltage offset to a production distribution of a transistor threshold voltage mismatch.

Abstract: An efficient software download to a configurable communication device is disclosed herein. The method of efficiently downloading software begins with a step of receiving a request to configure a communication device to run a communication application. The communication device being configured has a plurality of function blocks with a fixed portion of hardware and a flexible portion of hardware, wherein the same plurality of function blocks is capable of operating a plurality of communication applications. In a next step, the capability of the fixed portion and the flexible portion of hardware of the communication device is evaluated for a capability of implementing the communication application. Next, configuration information only for the flexible portion of hardware of the communication device is transmitted to the communication device to enable it to operate the communication application.

Abstract: Embodiments related to configurable differential lines are disclosed herein.

Abstract: Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.

Abstract: A power supply for a contactless device having a power supply circuit configured to provide an internal power supply voltage, an emergency capacitor circuit having an emergency capacitor, configured to provide a source current during an external field pause, and a power supply regulator configured to regulate the internal power supply voltage and the source current, wherein the emergency capacitor circuit is electrically coupled in parallel with the power supply circuit.

Abstract: The invention relates to an electric circuit arrangement for generating or receiving an output signal or switched condition definitive for the effective locking condition of a door system, especially a motor vehicle door system. The object of the invention is to provide a circuit arrangement with which an output signal definitive for the locking condition of a door system can be furnished, the generation of which signal takes the intentions of a user or the instantaneous situation into account in improved manner.

Abstract: The present disclosure relates to a folding box for carrying, wherein a cover is constructed of an upper plane and a lower plane. A first handle can be folded from the upper plane and a second handle can be folded out of the lower plane in opposite directions so that the two undersides of the handles lie directly opposite one another in the folded-out position and together form the carrying handle for carrying the folding box for carrying. The punch-out of the handle from the lower plane of the cover can form an opening into the interior of the folding box for carrying, the opening being closeable by a closing lid punched out at the upper plane of the cover.

Abstract: This disclosure relates to a divide-by-N frequency divider system and frequency dividing method. The system includes a ring oscillator having M stages, where M is an integer, and a zero mean current component coupled to one or more of the stages to provide a zero mean current flow path.

Abstract: One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive electrodes are separated by an enclosed chamber filled with an electrically conductive material. The electrically conductive material can freely vary its position within the chamber. The capacitance of the device will vary as position of the conductive material changes due to external mechanical motion (ex: rotation, vibration, etc.) of the device. Other embodiments of this device are also disclosed.

Abstract: A three-positions disconnector comprising, for each phase an insulating casing which comprises a first and a second cavity separated by an insulated partition wall, a through hole being present in said partition wall between said first and second cavity. The first cavity houses: a first fixed contact electrically connected to a corresponding branch conductor (of a bus-bar system; at least a portion of a movable contact pivotally mounted on a support positioned in the first cavity and electrically connected to a first electrical terminal positioned in said second cavity. The disconnector further comprises, for each phase, a second fixed contact suitable for ground connection.

Abstract: A method of manufacturing a semiconductor device or a substrate is described. The method includes providing a chip attached to a carrier or providing a substrate. A foil is held over the chip and the carrier or the substrate. A laser beam is directed onto the foil, and substance at the foil is ablated and deposited on the chip and the carrier or on the substrate.

Abstract: Described herein is a system and method of emulating characteristics of an output signal of a first analog-to-digital converter by a second analog-to-digital converter employing signal processing. A signal processing module may receive a digital signal from the first analog-to-digital converter and alter the digital signal to define an altered digital signal such that the altered digital signal emulates a second digital signal that is characteristic of the second analog-to-digital converter, the second analog-to-digital converter differing from the first analog-to-digital converter.

Abstract: System and method for creating stressed polycrystalline silicon in an integrated circuit. A preferred embodiment includes manufacturing an integrated circuit, including forming a trench in an integrated circuit substrate, forming a cavity within the integrated circuit substrate, wherein the cavity is linked to the trench, depositing a dielectric layer within the cavity, and depositing polycrystalline silicon over the dielectric layer, wherein an inherent stress is induced in the polycrystalline silicon that grows on the dielectric layer. The dielectric layer may be, for example, silicon aluminum oxynitride (SiAlON), mullite (3Al2O3.2SiO2), and alumina (Al2O3).

Abstract: A frequency regulator for varying a clock frequency of a power-supplied consumer operated in a clocked manner, wherein the frequency regulator is implemented to perform an overall variation of the clock frequency from an actual frequency to a set frequency, such that the overall variation is obtained by a plurality of clock changes, each with a different amount of change, wherein each of the respective amounts of change depends on a power change caused by the associated clock frequency change.

Abstract: A method of fabricating a semiconductor chip includes the providing an adhesive layer on the outer area of the active surface of a device wafer and attaching a rigid body to the active surface by the adhesive layer. The device wafer is thinned by treating the passive surface of the device wafer. A first backing tape is connected to the passive surface of the device wafer. The outer portion of the rigid body is separated from the central portion of the rigid body and the outer portion of the device wafer is separated from the central portion of the device wafer. The central portion of the rigid body, the outer portion of the device wafer and the outer portion of the rigid body are removed from the first backing tape. The device wafer may be diced into semiconductor chips.

Abstract: An apparatus for reading out a modulated time-continuous sensor output signal includes a loop filter, a sample-quantizer and a feedback circuit. The loop filter filters the sensor output signal to provide a filtered sensor output signal, and amplifies frequency proportions present in a frequency range. The sample-quantizer samples and quantizes the filtered sensor output signal to provide a time-discrete, quantized sensor output signal. The feedback circuit feeds a feedback signal based on the time-discrete, quantized sensor output signal back to the loop filter and provides a readout signal.

Abstract: A method of conducting an electrostatic discharge test on an integrated circuit is described. The method comprises configuring a test board assembly to emulate characteristics of a system in which the integrated circuit is to be used, coupling the integrated circuit to the test board assembly, and applying an electrostatic discharge test signal of system-level type to the test board assembly.

Abstract: Bearing device (1) with a first bearing part (2) and a second bearing part (3) which cooperate in bearing contact, wherein the first bearing part (2) and the second bearing part (3) is each provided with a surface layer (21, 31), wherein the hardness of the surface layer (21) of the first bearing part (2) is greater than the hardness of the surface layer (31) of the second bearing part (3).

Abstract: A data retention monitor for a memory cell including a voltage source and a voltage comparator. The voltage source is adapted to provide a selectable voltage to the memory cell. The selectable voltage includes a read voltage and a test voltage, with the test voltage being greater than the read voltage. The voltage comparator is adapted to compare a voltage of the memory cell with a reference voltage after the provision of the selectable voltage to the memory cell. The memory cell retains data when the memory cell voltage generated at least in part by the test voltage is substantially equal to the reference voltage.

Abstract: A method is provided that comprises determining an amount of a first current from an amount of a charge stored in a first capacitor. Also, an apparatus is provided that comprises a reference timer circuit configured to generate a first signal indicating an expiration of a time period, and a sense circuit comprising a first capacitor and configured to sense, responsive to the first signal, a charge stored in the first capacitor, and to generate a second signal representing the sensed charge.