Abstract: In an embodiment, a method for establishing a communication connection for a radio communication terminal device in an area that is served by a plurality of base stations is provided. The method may include determining the load situation of each base station of the plurality of base stations; selecting a base station out of the plurality of base stations depending on the load situation of each base station of the plurality of base stations; and establishing a communication connection between the radio communication terminal device and the selected base station. Determining the load situation of each base station of the plurality of base stations may include evaluation of a computational model for the load situation of the respective base station.
Type:
Application
Filed:
June 8, 2009
Publication date:
December 9, 2010
Applicant:
Infineon Technologies AG
Inventors:
Markus Dominik Mueck, Sabine Van Niekerk
Abstract: In an embodiment, a circuit is provided comprising a multi-phase oscillator configured to output a plurality of output signals having the same frequency and different phase offsets. A feedback value is generated based on at least two of said output signals. A reference value is generated based on a reference clock and a predetermined value. The reference value and the feedback value are combined.
Abstract: A current conductor for an electrical device including an electrically conducting central section having a first side and a second side. The central section is configured to receive at least one inserted electrical component. Two electrical conducting shield sections are each disposed on one of the first side and the side and configured to shield against an electric field. The shield sections cover the central section and the at least one inserted electrical component.
Type:
Grant
Filed:
January 24, 2007
Date of Patent:
December 7, 2010
Assignee:
ABB Technology AG
Inventors:
Robert Espeseth, Ole Granhaug, Silvio Stangherlin, Gerhard Salge, Jan-Henrik Kuhlefelt, Thor Endre
Abstract: Current regulators and related method for regulating a current through a load. The current regulator may include, for example, a first circuit configured to determine an amount of current that flows through the load; and a second circuit configured to cause a voltage to be applied across the load, the voltage having a duty cycle that depends on the amount of the current flowing through the load.
Type:
Grant
Filed:
August 21, 2007
Date of Patent:
December 7, 2010
Assignee:
Infineon Technologies AG
Inventors:
Heimo Hartlieb, Axel Reithofer, Klaus Strohmayer
Abstract: An electronic access control device with an actuator that requires little energy to change between the coupled and decoupled states. The actuator can have levers that interact to bias the control actuator in the decoupled state. The actuator can be changed between coupled and decoupled states by magnetizing and demagnetizing an armature that interacts with the levers. The electronic lock can include a security apparatus that prohibits the electronic lock from changing between the coupled and decoupled states when an external magnetic field is applied.
Type:
Grant
Filed:
April 4, 2007
Date of Patent:
December 7, 2010
Assignee:
SimonsVoss Technologies AG
Inventors:
Herbert Meyerle, Norbert Voss, Ludger Voss, James S. Marschalek, Warren A. Simonsen, Stefan Parhofer
Abstract: A frequency tuning circuit includes a connection for coupling to a signal tap of an element which has a resonant frequency. The tuning circuit contains a controllable-capacitance capacitance array for tuning of a signal frequency of the element. The capacitance array has a multiplicity of capacitances which can be connected to a control connection via a signal. In this case, the capacitance array is coupled to the connection. A control input is used to supply a digital control word. Furthermore, the tuning circuit contains a sigma-delta modulator whose input side is coupled to the control input and whose output side is coupled to the control connection of the capacitance array. This makes it possible to produce a tuning word by means of which the effective resolution of the capacitance array can be increased.
Abstract: An electrical device and method is disclosed. One embodiment provides a substrate, a sensor chip disposed completely above a plane section of a surface of the substrate. A structurally homogeneous material layer is disposed above the substrate and the sensor chip. A cavity is formed between the substrate and the material layer. The sensor chip is disposed inside the cavity.
Abstract: This application relates to a semiconductor device, the semiconductor device comprising a metal carrier, an insulating foil partially covering the metal carrier, a first chip attached to the metal carrier over the insulating foil, and a second chip attached to the metal carrier over a region not covered by the insulating foil.
Type:
Grant
Filed:
August 5, 2008
Date of Patent:
December 7, 2010
Assignee:
Infineon Technologies AG
Inventors:
Joachim Mahler, Ralf Wombacher, Ralf Otremba
Abstract: Lithography masks and methods of lithography for manufacturing semiconductor devices are disclosed. Forbidden pitches are circumvented by dividing a main feature into a set of two or more sub-features. The sum of the widths of the sub-features and the spaces between the sub-features is substantially equal to the width of the main feature. The set of two or more sub-features comprise a plurality of different distances between an adjacent set of two or more sub-features. At least one of the plurality of distances comprises a pitch that is resolvable by the lithography system, resulting in increased resolution for the main features, improved critical dimension (CD) control, and increased process windows.
Abstract: A discrete trap memory, comprising a silicon substrate layer, a bottom oxide layer on the silicon substrate layer, a Fullerene layer on the bottom oxide layer, a top oxide layer on the Fullerene layer, and a gate layer on the top oxide layer; wherein the Fullerene layer comprises spherical, elliptical or endohedral Fullerenes that act as charge traps.
Abstract: A method is provided for determining the electronic wear state of a valve arrangement for controlling a process medium flow. A valve element is arranged to move axially within a valve housing, is reset by a spring, and is moved by application of control pressure via an I/P converter. The I/P converter ensures a constant opening cross section at least over a portion of the switching stroke, in the case of which the time at which various positions of the valve element along the ventilating and/or venting distance are reached is determined by means of a position sensor system, and this time is used to mathematically derive the speeds of the valve element prevailing at these positions by means of an evaluation unit. The change profile of the speeds represents a measure of the wear state of the valve mechanism.
Abstract: The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor chip. The module housing has a bottom side and a top side spaced away from the bottom side in a positive vertical direction. In addition, the substrate has a bottom side facing away from an interior of the module housing. The substrate is arranged in an opening of the module housing configured in its bottom side and attached to the module housing by a resilient bonding agent for freedom of movement of the substrate parallel to the vertical direction in relation to the module housing. In the non-mounted condition of the power semiconductor module, the substrate assumes a resting position in relation to the module housing. To deflect the substrate from the resting position parallel to the vertical direction, a deflection force of 0.1 N to 100 N per mm is applied.
Type:
Application
Filed:
May 27, 2010
Publication date:
December 2, 2010
Applicant:
Infineon Technologies AG
Inventors:
Peter Kanschat, Olaf Hohlfeld, Thilo Stolze
Abstract: An exemplary switchgear assembly is disclosed with at least one moveable contact piece, in which the moveable contact is connected to a connection piece electrically with a flexible connection means. A connection between the connector strip and the connection piece of the pole part is provided. The connection can have relatively low electrical and thermal resistance. A flexible connection means is connected to the connection piece directly or with an intermediate piece, which can be connected to the connection piece, cohesively or at least unreleasably.
Type:
Application
Filed:
June 7, 2010
Publication date:
December 2, 2010
Applicant:
ABB Technology AG
Inventors:
Dietmar Gentsch, Christof Humpert, Till Ruemenapp
Abstract: On an inverter (1) for converting an electric direct voltage, in particular of a photovoltaic direct voltage source into an alternating voltage with a direct voltage input with two terminals (DC+, DC?) and one alternating voltage output with two terminals (AC1, AC2) and with one bridge circuit including semiconductor switching elements (S1-S6), said bridge circuit comprising one first bridge branch (Z1) including four switching elements (S1-S4) and one second bridge branch (Z2) including two additional switching elements (S5, S6) as well as a freewheeling circuit provided with additional diodes (D7, D8), the efficiency is further increased without high frequency interferences and capacitive leakage currents having the possibility to occur on the generator side.
Type:
Grant
Filed:
July 31, 2008
Date of Patent:
November 30, 2010
Assignee:
SMA Solar Technology AG
Inventors:
Sven Bremicker, Frank Greizer, Matthias Victor
Abstract: A baffle assembly for engaging a panel and a method of manufacturing the same are disclosed. A baffle assembly may include at least two baffles, each having a rigid carrier and an expandable material, which are linked by a connecting member which allows each baffle to pivot about the connecting member. The baffles may each include an attachment member configured to engage a first aperture and a second aperture, respectively, in a panel. A method of manufacturing a carrier for engaging a panel may include forming at least two baffles, and forming a connecting member between the baffles that allows the baffles to pivot about the connecting member.
Abstract: Various illustrative embodiments of methods for manufacturing a semiconductor device are described. These methods may include, for example, forming a first polysilicon layer above a substrate, wherein the first polysilicon layer comprises a doped portion, and forming a second polysilicon layer over a surface of the first polysilicon layer. Also, various illustrative embodiments of semiconductor devices are described that may be manufactured such as by the various methods described herein.