Abstract: A heat sink having a clip bonded thereon for resiliently securing the heat sink to an electronic device package. The clip includes an integral standoff directly bonded to the heat sink for spacing the clip from the heat sink. Preferably the heat sink and clip are surface treated before use.

Abstract: Disclosed is a heat sink clip assembly for releaseably attaching a heat sink to a DIP or similar electronic device package. The clip assembly includes a non-conductive attachment clip which extends between the leads on the underside of the DIP and means for latching the attachment clip to a heat sink disposed adjacent the opposite side of the electronic device package with the heat sink in intimate thermal contact with the electronic device package.

Abstract: Disclosed is apparatus for mounting electronic device packages and heat sinks on printed circuit boards with the pin connectors of the electronic device package held in alignment with preformed locations on the printed circuit boards. The alignment apparatus includes means for securing the electronic device package in intimate thermal contact with the heat sink for rapid dissipation of heat therefrom.

Abstract: A fastener is provided for mounting a heat sink to the surface of a circuit board. The fastener includes a body having structure extending from the body for engaging the heat sink. The body further includes structure extending in a direction opposite the engaging structure for contacting the surface of the circuit board. The contacting structure includes a surface parallel to the surface of the circuit board and is coated with a solder-promoting material for surface mounting the heat sink to the circuit board.

Abstract: A self-securing heat sink for transistors and the like comprises a unitary member that is constructed from a malleable material having a high heat transfer coefficient. The unitary member includes a base portion, at least one heat radiating fin portion, and a clip portion that is capable of engaging a transistor to retain the heat sink securely on the transistor without necessitating the use of threaded fasteners, rivets, or the like.

Abstract: A compensating roll pin (10) is disclosed for use in securing a heat sink (12) to a circuit board (14). The roll pin (10) is formed by rolling a deformable material, such as annealed spring steel, into a generally cylindrical shape. The pin (10) has first and second end portions (22, 26) separated by a middle portion (24) of increased external diameter. The first end portion (22) can be inserted in the aperture (34) in the heat sink (12) and the middle portion (24) can be deformed within the aperture (34) to form a tight fit between the pin and heat sink. A substantial part of the middle portion (24) remains outside the aperture (34) in the heat sink. The second end portion (26) can be slidably inserted within the hole (38) in the circuit board (14) for an interference fit therebetween. The middle portion (24) forms a stop to prevent further insertion of the roll pin (10) within the circuit board (14) so that a gap of predetermined distance separates the heat sink and circuit board to enhance cooling.

Abstract: A heat sink is described that includes a base portion, and having a pair of heat radiating portions attached to the base portion. The heat radiating portions are each of sufficient width so that when bent along a line at roughly their midpoint, the unattached lower edges of such heat radiating portions will be disposed parallel to and in juxtaposition with the free edges of the base portion. Also, the method of manufacturing such heat sink includes, after punching the heat sinks from the sheet of material from which they are constructed, bending the heat radiating portions along the line extending generally through their midpoint and intersecting a corner of the base and then bending each of the heat radiating portions along an edge of the base to a position wherein the heat radiating portions are disposed at approximately 90 degrees to the base portion.

Abstract: A spring clip fastener (10) is provided for mounting a heat sink (40) and a semiconductor device package (42) to a circuit board (44). Spring clip fastener (10) includes a spring portion (12). Support members (14, 16) extend from the spring portion (12) for supporting the spring portion (12) above the surface of the circuit board (44). A shoulder (18, 20) is contained within the support members (14, 16), such that the spring portion (12) urges the semiconductor device package (42) against the heat sink (40). Feet (30, 32) extend from support members (22, 24) for engaging holes (46, 52) of the circuit board (44). Feet (30, 32) are coated with a solder-promoting material.

Abstract: Disclosed is means for mounting semiconductor device cases on mounting substrates such as circuit boards. The mounting means includes studs passing transversely through the body of the mounting means for mounting a semiconductor case or semiconductor case and heat sink on one side of the body. The opposite ends of the studs are coated with a solder-promoting material so that the studs may be soldered directly to the circuit board. The body may include electrically conductive pin receptacles for mating with pins extending from the semiconductor case. The pin receptacles have solderable shanks extending from the opposite side of the socket body. Stand-off bosses are also disclosed for spacing the mounting body from the surface of the circuit board and for spacing the heat sink from the surface of the mounting body.

Abstract: Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.

Abstract: Disclosed is a solderable stake for attaching a heat sink to a mounting board such as a circuit board or the like. The stake is a unitary body having a shank supporting a transverse base with parallel spaced apart fingers extending from the base cooperating with the base to define a channel. The stake body is tin-plated. The edge of the heat sink is inserted into the channel between the fingers and retained therein by the spring-clip action of the fingers. The assembly may be attached to the circuit board by conventional soldering simultaneously with soldering of other component leads and the like.

Abstract: An apparatus for loading circuit packages having a first support surface (36) for supporting a circuit package and a pressure pad (38) spaced apart from the support surface (36) for applying pressure to a circuit package is disclosed. A second support surface (48) which is substantially in line with the first support surface supports a circuit package for unloading. The support surfaces move in a direction substantially perpendicular to the plane of the surfaces so that circuit packages are inserted straight into their sockets and removed straight from their sockets. A gravity circuit package feeder (20) feeds circuit packages onto the first support surface. A circuit package stop (54) is located at the end of first support surface opposite the gravity feeder (20). The support surfaces are inclined to the horizontal so that a circuit package comes to rest against the circuit package stop.