Patents Assigned to VIA Technologies
  • Patent number: 9613621
    Abstract: A speech recognition method and an electronic apparatus are provided. The speech recognition method includes the following steps. A plurality of phonetic transcriptions of a speech signal is obtained according to an acoustic model. A phonetic spelling and intonation information matched to the phonetic transcriptions are obtained according to a phonetic transcription sequence and a syllable acoustic lexicon of the invention. According to the phonetic spellings and the intonation information, a plurality of phonetic spelling sequences and a plurality of phonetic spelling sequence probabilities are obtained from a language model. The phonetic spelling sequence corresponding to a largest one among the phonetic spelling sequence probabilities is selected as a recognition result of the speech signal.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: April 4, 2017
    Assignee: VIA Technologies, Inc.
    Inventors: Guo-Feng Zhang, Yi-Fei Zhu
  • Publication number: 20170075911
    Abstract: A sorting method of data documents is provided, adapted to an electronic device. The sort method includes the following steps: retrieving a plurality of keywords from contents of a plurality of data documents; retrieving a keyword ranking corresponding to the at least one first keyword by a search engine; searching a keyword category corresponding to the at least one first keyword; and inputting the at least one first keyword, the keyword ranking and the keyword category of each of the at least one first keyword into a sort algorithm thereby outputting a predicting ranking of the first data document to sort the first data document, wherein the sort algorithm is generated based on contents of a plurality of second data documents and a current ranking of each of the plurality of second data documents.
    Type: Application
    Filed: November 24, 2016
    Publication date: March 16, 2017
    Applicant: VIA Technologies, Inc.
    Inventors: Guo-Feng Zhang, Yi-Fei Zhu
  • Patent number: 9558262
    Abstract: A sorting method of data documents is provided, adapted to an electronic device. The sort method includes the following steps: retrieving a plurality of keywords from contents of a plurality of data documents; retrieving corresponding keyword rankings of the plurality of keywords by a search engine; searching corresponding keyword categories of the plurality of keywords; and generating a sort algorithm based on the plurality of keywords, the keyword ranking and the keyword category of each of the plurality of keywords, and a current ranking of each of the plurality of data documents, wherein the sort algorithm is used to calculate a predicting ranking of another data document and to sort the another data document.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: January 31, 2017
    Assignee: VIA Technologies, Inc.
    Inventors: Guo-Feng Zhang, Yi-Fei Zhu
  • Patent number: 9559676
    Abstract: An output buffer apparatus is provided. A clamp circuit outputs a clamp voltage through a transistor pair having a first configuration. A bias circuit outputs a bias voltage through a transistor pair having a second configuration. A rate control circuit for rising/falling edge buffers an input signal according to the clamp voltage and the bias voltage to generate a buffered signal.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: January 31, 2017
    Assignee: VIA Technologies, Inc.
    Inventor: Ming-Yu Hsieh
  • Publication number: 20170025343
    Abstract: A circuit substrate has the following elements. A stacked circuit structure has a first surface and a second surface opposite thereto surface. A first patterned inner conductive layer is disposed on the first surface and has multiple pads. A first patterned outer conductive layer is disposed on the patterned inner conductive layer and has multiple conductive pillars, wherein each of the first conductive pillar is located on the corresponding first pad. The first dielectric layer covers the first surface, the first patterned inner conductive layer and the first patterned outer conductive layer, and has multiple first concaves, wherein the first concave exposes the top and side of the corresponding first conductive pillar. A semiconductor package structure applied the above circuit substrate and a process for fabricating the same are also provided here.
    Type: Application
    Filed: October 3, 2016
    Publication date: January 26, 2017
    Applicant: VIA Technologies, Inc.
    Inventor: Chen-Yueh Kung
  • Patent number: 9532467
    Abstract: A circuit substrate includes a base layer, a first patterned conductive layer, a dielectric layer, a conductive block and a second patterned conductive layer. The first patterned conductive layer is disposed on the base layer and has a first pad. The dielectric layer is disposed on the base layer and covers the first patterned conductive layer, wherein the dielectric layer has an opening and the first pad is exposed by the opening. The conductive block is disposed in the opening and covers the first pad. The second patterned conductive layer is disposed on a surface of the dielectric layer and has a second pad, wherein the second pad and the conductive block are integrally formed.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: December 27, 2016
    Assignee: VIA Technologies, Inc.
    Inventor: Chen-Yueh Kung
  • Patent number: 9497864
    Abstract: A circuit substrate has the following elements. A stacked circuit structure has a first surface and a second surface opposite thereto surface. A first patterned inner conductive layer is disposed on the first surface and has multiple pads. A first patterned outer conductive layer is disposed on the patterned inner conductive layer and has multiple conductive pillars, wherein each of the first conductive pillar is located on the corresponding first pad. The first dielectric layer covers the first surface, the first patterned inner conductive layer and the first patterned outer conductive layer, and has multiple first concaves, wherein the first concave exposes the top and side of the corresponding first conductive pillar. A semiconductor package structure applied the above circuit substrate and a process for fabricating the same are also provided here.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: November 15, 2016
    Assignee: VIA Technologies, Inc.
    Inventor: Chen-Yueh Kung
  • Patent number: 9466295
    Abstract: A natural language dialog system and a method capable of correcting a speech response are provided. The method includes following steps. A first speech input is received. At least one keyword included in the first speech input is parsed to obtain a candidate list having at least one report answers. One of the report answers is selected from the candidate list as a first report answer, and a first speech response is output according to the first report answer. A second speech input is received and parsed to determine whether the first report answer is correct. If the first report answer is incorrect, another report answer other than the first report answer is selected from the candidate list as a second report answer. According to the second report answer, a second speech response is output.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: October 11, 2016
    Assignee: VIA Technologies, Inc.
    Inventor: Guo-Feng Zhang
  • Patent number: 9444165
    Abstract: A pin arrangement adapted to a FPC connector is provided. The pin arrangement includes a pin lane. The pin lane includes a pair of ground pins, a pair of differential pins and at least one not-connected (NC) pin. The differential pins are located between the pair of ground pins. The at least one NC pin is located between the pair of differential pins or between one of the pair of ground pins and one of the pair of differential pins adjacent thereto. By adding the at least one NC pin between the pair of differential pins and/or between the differential pin and the ground pin adjacent thereto, a distance between each of the pair of the differential pins and/or between the differential pin and the ground pin is increased, and thus a differential characteristic impedance of the pair of differential pins is raised to reduce the impact of impedance mismatch.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: September 13, 2016
    Assignee: VIA Technologies, Inc.
    Inventor: Sheng-Yuan Lee
  • Patent number: 9423958
    Abstract: A system and a method for managing an expansion read-only memory (ROM), and a management host thereof are provided. The management host is connected with a computer host through a bridge. The management host establishes an address lookup table to assign a virtual function and an expansion ROM corresponding to the virtual function. When a request is issued by the computer host to obtain a size of the expansion ROM, the management host provides data in a shadow register block corresponding to the expansion ROM to the computer host according to the address lookup table. The computer host assigns a memory block in the computer host to the expansion ROM according to the data in the shadow register block. When a request is issued by the computer host to obtain data of the expansion ROM through the bridge, the management host provides the data of the expansion ROM to the computer host according to the memory block.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: August 23, 2016
    Assignee: VIA Technologies, Inc.
    Inventor: Kuan-Jui Ho
  • Patent number: 9425066
    Abstract: A circuit substrate includes a dielectric layer and a plurality of conductive structures. The dielectric layer has a plurality of conductive openings, a first surface, and a second surface opposite to the first surface. Each of the conductive openings connects the first surface and the second surface. The conductive openings are respectively filled with the conductive structures. Each of the conductive structures is integrally formed and includes a pad part, a connection part, and a protruding part. Each of the connection parts is connected to the corresponding pad part and the corresponding protruding part. Each of the protruding parts has a curved surface that protrudes from the second surface. A process for fabricating the circuit substrate is also provided.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: August 23, 2016
    Assignee: VIA Technologies, Inc.
    Inventors: Chen-Yueh Kung, Wen-Yuan Chang
  • Patent number: 9418964
    Abstract: A chip package structure includes a carrier and a chip group. The chip group includes a pair of first chips that are identical IC chips. The pair of first chips are disposed on the carrier in opposite directions and parallel to each other, and electrically connected with the carrier.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: August 16, 2016
    Assignee: VIA Technologies, Inc.
    Inventors: Wen-Yuan Chang, Yeh-Chi Hsu, Wei-Chih Lai
  • Patent number: 9419783
    Abstract: A phase detecting apparatus and a phase adjusting method are provided. Determine whether to output a phase adjusting control signal according to a first data sampling value, a second data sampling value and a third data sampling value that are successively generated, so as to adjust a phase of a sampling clock signal used to sample a data signal.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: August 16, 2016
    Assignee: VIA Technologies, Inc.
    Inventors: Wei-Yu Wang, Cheng-Ming Ying
  • Patent number: 9338879
    Abstract: A through-hole layout structure is suitable for a circuit board. The through-hole layout structure includes a pair of first differential through-holes, a pair of second differential through-holes, a first ground through-hole, a second ground through-hole, and a third ground through-hole, which are all arranged on a first line. The first ground through-hole is located between the pair of first differential through-holes and the pair of second differential through-holes. The pair of first differential through-holes is located between the first ground through-hole and the second ground through-hole. The pair of second differential through-holes is located between the first ground through-hole and the third ground through-hole.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: May 10, 2016
    Assignee: VIA Technologies, Inc.
    Inventor: Sheng-Yuan Lee
  • Patent number: 9323622
    Abstract: A recovering method is adapted to an encoding operation performed on a storage area of a storage device. The recovering method includes: reading a variable set, wherein the encoding operation comprises a plurality of sub-operations, and each of the sub-operations is corresponding to at least one flag variable in the variable set; determining whether any one of the sub-operations is interrupted according to the variable set; when one of the sub-operations is interrupted, recovering the sub-operation according to the at least one flag variable corresponding to the sub-operation; and carrying on the encoding operation according to a process recorded by the flag variables in the variable set.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: April 26, 2016
    Assignee: VIA Technologies, Inc.
    Inventors: Shou-Di Li, Guang-Hui Wu, Hai-Bin Shen
  • Patent number: 9324580
    Abstract: A process for fabricating a circuit substrate is provided. The process includes the following steps. A carrier is provided. A conductive layer and a dielectric layer are placed on the carrier, and the conductive layer is located between the carrier and the dielectric layer. The dielectric layer is patterned to form a patterned-dielectric layer having first openings partially exposing the conductive layer. Arc-shaped grooves are formed on the exposed part of the conductive layer. A first-patterned-photoresist layer having second openings respectively connecting the first openings is formed. Conductive structures are formed, wherein each of the conductive structures is integrally formed and includes a pad part, a connection part, and a protruding part; the second openings, the first openings and the arc-shaped grooves are respectively filled with the pad parts, the connection parts and the protruding parts. The first patterned photoresist layer, the carrier and the conductive layer are removed.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: April 26, 2016
    Assignee: VIA Technologies, Inc.
    Inventors: Chen-Yueh Kung, Wen-Yuan Chang
  • Patent number: 9292470
    Abstract: A microprocessor includes hardware registers that instantiate the Intel 64 Architecture R8-R15 GPRs. The microprocessor associates with each of the R8-R15 GPRs a respective unique MSR address. The microprocessor also includes hardware registers that instantiate the ARM Architecture GPRs. In response to an ARM MRRC instruction that specifies the respective unique MSR address of one of the R8-R15 GPRs, the microprocessor reads the contents of the hardware register that instantiates the specified one of the R8-R15 GPRs into the hardware registers that instantiate two of the ARM GPRs registers. In response to an ARM MCRR instruction that specifies the respective unique MSR address of one of the R8-R15 GPRs, the microprocessor writes into the hardware register that instantiates the specified one of the R8-R15 GPRs the contents of the hardware registers that instantiate two of the ARM Architecture GPRs registers. The hardware registers may be shared by the two Architectures.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: March 22, 2016
    Assignee: VIA Technologies, Inc.
    Inventor: Mark John Ebersole
  • Patent number: 9274577
    Abstract: An adaptive universal serial bus (USB) charging method and system are disclosed. In a low-power state, a USB device is charged with a non-USB charging mode. The non-USB charging mode is retained when no variation of a data signal coupled to the USB device is detected. When the data signal possesses variation for a first period, it is switched to a third proprietary charging mode.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: March 1, 2016
    Assignee: VIA Technologies, Inc.
    Inventors: Yi-Lin Lai, Bo-Ming Huang, Kuo-Yu Wu
  • Patent number: 9256554
    Abstract: A progress recording method and a corresponding recovering method adapted to an encoding operation performed on a storage area of a storage device are provided. The progress recording method includes the following steps. A variable set is initialized and stored. The encoding operation includes a plurality of sub-operations, and each of the sub-operations is corresponding to at least one flag variable in the variable set. The flag variables are used for recording execution progresses of the sub-operations. When each of the sub-operations is executed, the corresponding flag variable in the variable set is updated according to the execution progress of the sub-operation.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: February 9, 2016
    Assignee: VIA Technologies, Inc.
    Inventors: Shou-Di Li, Guang-Hui Wu, Hai-Bin Shen
  • Patent number: 9218280
    Abstract: A non-volatile memory (NVM) apparatus and an operation method thereof are provided. A mapping table in a main memory is divided into a plurality of sub-mapping tables according to logical address groups. When an access command of a host is processed by the NVM apparatus, at least one corresponding sub-mapping table is selected from the sub-mapping tables according to a logical address of the access command. If the at least one corresponding sub-mapping table is required to be rebuilt, then the at least one corresponding sub-mapping table is rebuilt, and the logical address of the access command is converter for accessing the NVM apparatus according to the at least one corresponding sub-mapping table which has been rebuilt.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: December 22, 2015
    Assignee: VIA Technologies, Inc.
    Inventors: Bo Zhang, Chen Xiu