Patents Assigned to VIA Technologies
  • Patent number: 10372533
    Abstract: A non-volatile memory (NVM) apparatus and an empty page detection method thereof are provided. The NVM apparatus includes a NVM and a controller. The controller reads the content of a memory page of the NVM. The controller performs Low Density Parity Check (LDPC) decoding for at least one codeword of the memory page to obtain a decoded codeword and a check-result vector. The controller determines that the memory page is not an empty page when the LDPC decoding for the codeword is successful. The controller counts an amount of the bits being 1 (or 0) in the check-result vector when the LDPC decoding for the codeword is fail. Based on the amount of the bits being 1 (or 0) in the check-result vector, the controller determines whether the memory page is an empty page.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: August 6, 2019
    Assignee: VIA Technologies, Inc.
    Inventors: Ying Yu Tai, Jiangli Zhu
  • Patent number: 10353529
    Abstract: The invention provides a cloud-computing graphic server. In one embodiment, the cloud-computing graphic server is coupled to a client host via a network, and includes a plurality of back-end graphic servers and at least one front-end graphic server. The graphic server is coupled to the back-end graphic servers via a high-speed network, receives a request from the client host via the network, determines a plurality of application programs required by the request, and selects a plurality of used back-end graphic servers respectively corresponding to the application programs from the back-end graphic servers. The used back-end graphic servers execute the application programs according to instructions from the front-end graphic server to generate a plurality of graphic surfaces, and the front-end graphic server blends the graphic surfaces to obtain a windows surface datastream and sends the windows surface datastream back to the client host for display via the network.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: July 16, 2019
    Assignee: VIA TECHNOLOGIES, INC.
    Inventor: Yaozhong Xu
  • Patent number: 10318463
    Abstract: An interface controller coupling the main body of an external electronic device to a host, and the electronic device using the interface controller and a control method for the external electronic controller are disclosed. The interface controller has a control unit and a non-volatile memory. The control unit is configured to transmit a termination-on signal to the host when link information retrieved from the main body has been written into the non-volatile memory. When the host issues a link information request in response to the termination-on signal, the control unit uses the link information stored in the non-volatile memory to respond to the link information request.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: June 11, 2019
    Assignee: VIA TECHNOLOGIES, INC.
    Inventors: Chia-Ying Kuo, Yi-Lin Lai
  • Patent number: 10318202
    Abstract: A non-volatile memory (NVM) apparatus and a data de-duplication method thereof are provided. The NVM apparatus includes a NVM and a controller. The controller performs an error checking and correcting (ECC) method to convert a raw data into an encoded data. The controller performs the data de-duplication method to reduce a number of times that the same encoded data is repeatedly written into the NVM. The controller generates the feature information corresponding to the raw data by reusing the ECC method. When the feature information is found in a feature list, the encoded data corresponding to the raw data will not be written into the NVM. When the feature information is not found in the feature list, the feature information is added into the feature list, and the encoded data corresponding to the raw data is written into the NVM.
    Type: Grant
    Filed: July 4, 2017
    Date of Patent: June 11, 2019
    Assignee: VIA Technologies, Inc.
    Inventors: Tingjun Xie, Ying Yu Tai, Jiangli Zhu
  • Patent number: 10305462
    Abstract: A high speed internal hysteresis comparator is provided. Impedance supply units are disposed at control terminals of transistors of an active load of a differential amplifier of the high-speed hysteresis comparator, such that a gain when the transistors operate in an active region and a responding speed of the high-speed hysteresis comparator are increased.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: May 28, 2019
    Assignee: VIA Technologies, Inc.
    Inventors: Wei-Yu Wang, Yu-Chung Wei
  • Patent number: 10303536
    Abstract: A non-volatile memory device including a non-volatile memory and a controller is provided. The non-volatile memory includes a plurality of closed blocks and a plurality of open blocks. The controller derives a ratio value according to the write workload of the non-volatile memory between a first time point and a second time point and then performs a patrol read on a portion of the closed blocks according to the ratio value.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: May 28, 2019
    Assignee: VIA TECHNOLOGIES, INC.
    Inventors: Ying Yu Tai, Jiangli Zhu
  • Patent number: 10289559
    Abstract: A non-volatile memory apparatus including a non-volatile storage circuit, a main memory and a controller, and an operating method thereof are provided. Each of a plurality of logical block address groups includes a plurality of logical block addresses. Each of the logical block address groups is assigned with a group age parameter. The adjusting of the group age parameters is triggered by a writing instruction of a host. When an age parameter of the group age parameters exceeds a predetermined range, the controller performs a scanning operation to the non-volatile storage blocks of the non-volatile storage circuit corresponding to a corresponding logical block address group of the age parameter, so as to check an error-bit quantity. The controller decides whether the storage block data-moving operation is performed to the non-volatile storage block corresponding to the corresponding logical block address group based on the results of the scanning operation.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: May 14, 2019
    Assignee: VIA Technologies, Inc.
    Inventors: Sheng-Huei Huang, Yi-Lin Lai
  • Publication number: 20190123572
    Abstract: A start-up apparatus for a battery management circuit and a battery management system having the same are provided. The start-up apparatus for the battery management circuit includes a transformer, a switch circuit, a control circuit, and a rectifier circuit. The transformer includes a primary winding, an auxiliary winding, and a secondary winding. A first terminal of the primary winding is coupled to a first external power path. A first terminal of the switch circuit is coupled to a second terminal of the primary winding, and a second terminal of the switch circuit is coupled to a second external power path. The control circuit is coupled to the auxiliary winding for receiving power and controls a conduction state of the switch circuit. The rectifier circuit is coupled to the secondary winding of the transformer and supplies power to the battery management circuit.
    Type: Application
    Filed: June 13, 2018
    Publication date: April 25, 2019
    Applicant: VIA Technologies, Inc.
    Inventor: Tze-Shiang Wang
  • Publication number: 20190120875
    Abstract: A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.
    Type: Application
    Filed: December 17, 2018
    Publication date: April 25, 2019
    Applicant: VIA Technologies, Inc.
    Inventors: Chen-Yueh Kung, Wen-Yuan Chang, Wei-Cheng Chen
  • Publication number: 20190114317
    Abstract: A natural language recognizing apparatus including an input device, a processing device and a storage device is provided. The input device is configured to provide a natural language data. The storage device is configured to store a plurality of program modules. The program modules include a grammar analysis module. The processing device executes the grammar analysis module to analyze the natural language data through a formal grammar model, and generate a plurality of string data. When at least one of the string data conforms to a preset grammar condition, the processing device judges the at least one of the string data is an intention data, and the processing device outputs a corresponding response signal according to the intention data. In addition, a natural language recognizing method is also provided.
    Type: Application
    Filed: January 11, 2018
    Publication date: April 18, 2019
    Applicant: VIA Technologies, Inc.
    Inventors: Guo-Feng Zhang, Jing-Jing Guo
  • Patent number: 10263454
    Abstract: A charger and a power delivery control chip and a charging method thereof are provided. Resistance values of equivalent resistances corresponding to a power supply bus are calculated according to a charging current and voltage sensing signals respectively provided by chips of a first connector and a second connector. A charging voltage supplied to the power supply bus is adjusted according to a target charging voltage, a current charging current, and variations of the resistance values of the equivalent resistances corresponding to the power supply bus.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: April 16, 2019
    Assignee: VIA Technologies, Inc.
    Inventor: Tze-Shiang Wang
  • Publication number: 20190073262
    Abstract: An error checking and correcting (ECC) decoding method and apparatus are provided. A decoding circuit decodes a codeword using (or without using) reference information, wherein when the decoding circuit fails to decode a first codeword, the decoding circuit decodes a second codeword to produce decoded data. The decoding circuit checks whether a change has occurred from each codeword bit of the second codeword to a corresponding bit of the decoded data. In accordance with a bit position of the changed corresponding bit, the decoding circuit correspondingly changes the first codeword to a modified codeword, and/or correspondingly changes the reference information to modified information. The decoding circuit performs the ECC decoding again on the modified codeword (or the first codeword) using (or without using) the modified information.
    Type: Application
    Filed: November 9, 2017
    Publication date: March 7, 2019
    Applicant: VIA Technologies, Inc.
    Inventors: Ching-Yu Chen, Yi-Lin Lai, Chen-Te Chen
  • Patent number: 10223017
    Abstract: A memory apparatus and an energy-saving control method thereof are provided. The internal clock signal sent to a specific circuit group is stopped outputting when it is determined that no processing command is to be processed currently and current events are finished being processed, so as to reduce power consumption of a control chip.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: March 5, 2019
    Assignee: VIA Technologies, Inc.
    Inventors: Yi-Lin Lai, Chen-Te Chen
  • Patent number: 10224029
    Abstract: A method for using voiceprint identification to operate voice recognition and electronic device thereof are provided. The method includes the following steps: receiving a specific voice fragment; cutting the received specific voice fragment into a plurality of specific sub-voice clips; performing a voiceprint identification flow to the specific sub-voice clips, respectively; determining whether each of the specific sub-voice clips is an appropriate sub-voice clip according to a result of the voiceprint identification flow; and capturing the appropriate sub-voice clips and operating a voice recognition thereto.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: March 5, 2019
    Assignee: VIA TECHNOLOGIES, INC.
    Inventor: Guo-Feng Zhang
  • Patent number: 10216520
    Abstract: A compressing instruction queue for a microprocessor including a storage queue and a redirect logic circuit. The storage queue includes a matrix of storage locations including N rows and M columns for storing microinstructions of the microprocessor in sequential order. The redirect logic circuit is configured to receive and write multiple microinstructions per cycle of a clock signal into sequential storage locations of the storage queue without leaving unused storage locations and beginning at a first available storage location in the storage queue. The redirect logic circuit performs redirection and compression to eliminate empty locations or holes in the storage queue and to reduce the number of write ports interfaced with each storage location of the storage queue.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: February 26, 2019
    Assignee: VIA TECHNOLOGIES, INC.
    Inventors: Matthew Daniel Day, G. Glenn Henry, Terry Parks
  • Patent number: 10218127
    Abstract: A paddle card includes a circuit board, a pad group and first to fourth shielding planes. The circuit board has an upper surface and a lower surface opposite to each other. The pad group is adapted to connect wires of a cable or terminals of a plug, and includes a pair of upper differential pads on the upper surface and a pair of lower differential pads on the lower surface. The pair of upper differential pads is respectively configured corresponding to the pair of lower differential pads in an up and down manner. The first to fourth shielding planes are stacked at intervals between the upper and lower surfaces in sequence. An orthogonal projection of a second opening of the second shielding plane on a geometric plane that a pair of third openings of the third shielding plane is located in is separate from the pair of third openings.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: February 26, 2019
    Assignee: VIA Technologies, Inc.
    Inventor: Sheng-Yuan Lee
  • Patent number: 10216250
    Abstract: A memory apparatus and an energy-saving control method thereof are provided. The memory apparatus includes a plurality of non-volatile memory units and a control chip, and the control chip includes a specific circuit group, a memory control unit and an energy-saving control unit. The memory control unit controls an access to the non-volatile memory units. In a normal mode and during a period of accessing the non-volatile memory units by the control chip, if the non-volatile memory units are in a busy state, the energy-saving control unit controls the clock generation unit to stop outputting an internal clock signal to the specific circuit group, so as to reduce power consumption of the control chip.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: February 26, 2019
    Assignee: VIA Technologies, Inc.
    Inventors: Yi-Lin Lai, Chen-Te Chen
  • Patent number: 10216253
    Abstract: A universal serial bus and a control method thereof are provided. Different voltages are respectively provided to circuit groups when a universal serial bus hub is in a suspend state and a normal working state, so as to reduce leakage current.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: February 26, 2019
    Assignee: VIA Technologies, Inc.
    Inventors: Yi-Te Chen, Terrance Shiyang Shih, Hsiao-Chyi Lin
  • Patent number: D849107
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: May 21, 2019
    Assignee: VIA TECHNOLOGIES, INC.
    Inventor: Chih-Wei Huang
  • Patent number: D849108
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: May 21, 2019
    Assignee: VIA TECHNOLOGIES, INC.
    Inventor: Chih-Wei Huang