Abstract: Apparatus and associated methods relate to a glitch detection circuit monitoring a duration that a selected fractional supply voltage is below a predetermined voltage threshold. The selected fractional supply voltage may be at the predetermined threshold when the supply voltage is between a valid circuit-supply voltage and a power-on circuit-reset (POR). A glitch detect signal may be generated, for example, when the monitored duration is greater than a predetermined duration threshold. A test glitch generator may generate a test glitch, for example, having selectable voltage and duration, which may be selectably applied to the glitch detection circuit to verify operation.

Abstract: Examples generally provide a stacked silicon interconnect product and method of manufacture. The stacked silicon interconnect product includes a silicon substrate-less interposer comprising a plurality of metallization layers, wherein at least one metallization layer includes a plurality of metal segments separated by dielectric material. The stacked silicon interconnect product also includes a first die coupled to a first side of the silicon substrate-less interposer via a first plurality of microbumps. The stacked silicon interconnect product further includes a second die coupled to a second side of the silicon substrate-less interposer via a second plurality of microbumps, the second die communicatively coupled to the first die through a metallization layer of the plurality of metallization layers.

Abstract: Examples herein describe techniques for forming 3D stacked devices which include a redundant logical layer. The 3D stacked devices include a plurality of semiconductor chips stacked in a vertical direction such that each chip is bonded to a chip above, below, or both in the stack. In one embodiment, each chip is the same—e.g., has the same circuitry arranged in the same configuration in the chip. The 3D stacked device provides a redundant logic layer by dividing the chips into a plurality of slivers which are interconnected by inter-chip bridges. For example, the 3D stacked device may include three stacked chips that are divided into three different slivers where each sliver includes a portion from each of the chips. So long as only one of portions in a sliver is nonfunctional, the inter-chip bridges permit the other portions in the sliver to receive and route data.

Abstract: An example preprocessor circuit for formatting image data into a plurality of streams of image samples includes: a plurality of memory banks configured to store the image data; multiplexer circuitry coupled to the memory banks; a first plurality of registers coupled to the multiplexer circuitry; a second plurality of registers coupled to the first plurality of registers, outputs of the second plurality of registers configured to provide the plurality of streams of image samples; and control circuitry configured to generate addresses for the plurality of memory banks, control the multiplexer circuitry to select among outputs of the plurality of memory banks, control the first plurality of registers to store outputs of the second plurality of multiplexers, and control the second plurality of registers to store outputs of the first plurality of registers.

Abstract: Multi-domain creation and isolation within a heterogeneous System-on-Chip (SoC) may include receiving a hardware description file specifying a plurality of processors and a plurality of hardware resources available within a heterogeneous SoC and creating, using computer hardware, a plurality of domains for the heterogeneous SoC, wherein each domain includes a processor selected from the plurality of processors and a hardware resource selected from the plurality of hardware resources. The method may include assigning, using the computer hardware, an operating system to each domain and generating, using the computer hardware, a platform that is configured to implement the plurality of domains within the heterogeneous SoC.

Abstract: Apparatus and associated methods relate to a dynamic quantizer circuit including a tail voltage supply magnitude (VTAIL) distinct from a general supply voltage (Avcc/Avss), VTAIL providing power to a tail clock buffer to generate tail clock signals to tail devices. In an illustrative example, a compensation processor may control a regulator producing a determined VTAIL value in response to one or more parametric signals, for example, the Avcc voltage value, a circuit temperature and a transistor speed process (TSP). The TSP signal may be determined, for example, by process-dependent circuit devices. The compensation processor may be, for example, configured to lower VTAIL in response to detecting a worst-case RMS noise corner, or to raise VTAIL in response to detecting a worst-case clock-to-q corner. Various adjustable VTAILs may be configured to continuously optimize RMS noise, offset and speed performance with low power consumption in various quantizers over process, voltage and/or temperature.

Abstract: In an example, a voltage-controlled oscillator (VCO) includes: an oscillator having a supply input; and a voltage regulator, coupled to the supply input. The voltage regulator includes: a first transistor and a second transistor providing a first source-coupled transistor pair, and a third transistor and a fourth transistor providing a second source-coupled transistor pair; an active load coupled to drains of the first, second, third, and fourth transistors; a first current source coupled to sources of the first and second transistors, and a second current source coupled to sources of the third and fourth transistors; a fifth transistor having a source and a drain coupled to the source and the drain, respectively, of the first transistor; and a sixth transistor having a source and a drain coupled to the source and the drain, respectively, of the third transistor.

Abstract: Examples of the present disclosure provide example Chip Scale Packages (CSPs). In some examples, a structure includes a first integrated circuit die, a shim die that does not include active circuitry thereon, an encapsulant at least laterally encapsulating the first integrated circuit die and the shim die, and a redistribution structure on the first integrated circuit die, the shim die, and the encapsulant. The redistribution structure includes one or more metal layers electrically connected to the first integrated circuit die.

Abstract: Routing a circuit design for implementation within an integrated circuit can include determining a set of candidate paths from available paths of the integrated circuit for connecting source-sink pairs of the circuit design, wherein the set of candidate paths is initially a subset of the available paths, and generating, using a processor, an expression having a plurality of variables expressed as a conjunction of routing constraints representing legal routes of the source-sink pairs using only the candidate paths. A routing result for the circuit design can be determined by initiating execution of a SAT solver on the expression using the processor.

Abstract: Extracting transaction level information from an interface can include tracking transactions of an interface within an integrated circuit (IC) using a plurality of counters within the IC, wherein the counters generate counter data corresponding to the transactions. The method can include capturing signals of the interface as trace data for a trace window using an integrated logic analyzer within the IC, wherein a start of the trace window begins after a start of the tracking of the transactions using the plurality of counters. The method can also include using a host data processing system coupled to the IC, determining transaction level information for the interface using the counter data and the trace data for the trace window.

Abstract: A chip package assembly, a package substrate and methods for fabricating the same are disclosed herein. In one example, a chip package assembly includes a package substrate, an IC die and a stiffener. The package substrate includes a first dam projecting from a top surface of the package substrate. The IC die and the stiffener are mounted to the top surface of the package substrate. The stiffener includes a bottom surface that is disposed adjacent to the first dam. At least one surface mounted component is mounted to a region of the package substrate defined between the stiffener and the IC die. An adhesive coupling the stiffener to the package substrate is in contact with the first dam.

Abstract: Simulating a circuit design can include detecting, using a processor, an assignment for a signal of a circuit design during a delta cycle of a simulation of the circuit design and comparing, using the processor, a range of the assignment for the signal with a range of an existing event for the signal for the delta cycle. In response to determining that the range of the assignment for the signal and the range of the existing event meet a condition, the existing event is updated, using the processor, resulting in a merged event. The merged event is scheduled for execution for the delta cycle using the processor.

Abstract: Using pin planning for core sources includes identifying, using a processor, a first pin configuration and a second pin configuration for a core source of a behavioral description of a circuit design. The second pin configuration is generated by a pin planning operation. The first pin configuration of the core source can be compared with the second pin configuration of the core source using a processor. Responsive to detecting a difference between the first pin configuration and the second pin configuration, the core source can be automatically update, using the processor, based upon the second pin configuration.

Abstract: A peripheral interconnect for configuring slave endpoint circuits, such as may be in a configurable network, in a system-on-chip (SoC) is described herein. In an example, an apparatus includes a processing system on a chip, a circuit block on the chip, and a configurable network on the chip. The processing system and the circuit block are connected to the configurable network. The configurable network includes a peripheral interconnect. The peripheral interconnect includes a root node and a plurality of switches. The root node and the plurality of switches are connected in a tree topology. First branches of the tree topology are connected to respective slave endpoint circuits of the configurable network. The slave endpoint circuits of the configurable network are programmable to configure the configurable network.

Abstract: An example data processing engine (DPE) for a DPE array in an integrated circuit (IC) includes: a core; a memory including a data memory and a program memory, the program memory coupled to the core, the data memory coupled to the core and including at least one connection to a respective at least one additional core external to the DPE; support circuitry including hardware synchronization circuitry and direct memory access (DMA) circuitry each coupled to the data memory; streaming interconnect coupled to the DMA circuitry and the core; and memory-mapped interconnect coupled to the core, the memory, and the support circuitry.

Abstract: A device may include a plurality of data processing engines. Each of the data processing engines may include a core and a memory module. The plurality of data processing engines may be organized in a plurality of rows. Each core may be configured to communicate with other neighboring data processing engines of the plurality of data processing engines by shared access to the memory modules of the neighboring data processing engines.

Abstract: A circuit arrangement includes one or more input buffers disposed on a system-on-chip (SoC) and configured to receive and store streaming debug packets. One or more response buffers are also disposed on the SoC. A transaction control circuit is disposed on the SoC and is configured to process each debug packet in the one or more input buffers. The processing includes decoding an operation code in the debug packet, and determining from an address in the debug packet, an interface circuit of multiple interface circuits to access a storage circuit in a subsystem of multiple sub-systems on the SoC. The processing further includes issuing a request via the interface circuit to access the storage circuit according to the operation code, and storing responses and data received from the interface circuits in the one or more response buffers.

Abstract: A device may include a plurality of data processing engines, a subsystem, and an SoC interface block coupled to the plurality of data processing engines and the subsystem. The SoC interface block may be configured to exchange data between the subsystem and the plurality of data processing engines.

Abstract: A device may include a plurality of data processing engines. Each data processing engine may include a core and a memory module. Each core may be configured to access the memory module in the same data processing engine and a memory module within at least one other data processing engine of the plurality of data processing engines.

Abstract: A stacked wafer assembly and method for fabricating the same are described herein. In one example, a stacked wafer assembly includes a first wafer bonded to a second wafer. The first wafer includes a plurality of fully functional dies and a first partial die formed thereon. The second wafer includes a plurality of fully functional dies and a first partial die formed thereon. Bond pads formed over an inductor of the first partial die of the first wafer are bonded to bond pads formed on the first partial die of the second wafer to establish electrical connection therebetween.