Abstract: An example method of capturing an error distribution data for a serial channel includes: receiving a signal from the serial channel at a receiver in an integrated circuit (IC), the signal encoding data using pulse amplitude modulation (PAM) scheme having more than two levels; determining a plurality of symbols from the signal, each of the plurality of symbols encoding a plurality of bits; comparing the plurality of symbols with a plurality of expected symbols to detect a plurality of symbol errors; generating the error distribution data by accumulating numbers of the plurality of symbol errors across a plurality of bins based error type; and transmitting the error distribution data from the receiver to a computing system for processing.

Abstract: An example apparatus includes a first transistor coupled between a supply node and a first node, a current mirror having a first side and a second side, and a second transistor coupled between the first node and the first side of the current mirror. The input buffer further includes a third transistor coupled between the first node and the second side of the current mirror, and a first capacitor coupled between a source and a drain of the second transistor.

Abstract: Methods and apparatus are described for providing and using programmable ICs suitable for meeting the unique desires of large hardware emulation systems. One example method of classifying a programmable IC having impaired circuitry generally includes determining a partitioning of programmable logic resources into two or more groups for classifying the programmable IC, testing the programmable IC to determine at least one location of the impaired circuitry in the programmable logic resources of the programmable IC, and classifying the programmable IC based on the at least one location of the impaired circuitry in relation to the partitioning of the programmable logic resources.

Abstract: A receiver circuit for receiving data is described. The receiver circuit comprises a phase detector configured to receive an input data signal; a frequency path circuit configured to receive an output of the phase detector; and a false lock detection circuit configured to receive the output of the phase detector and an output of the frequency path circuit; wherein the false lock detection circuit detects a false lock of the receiver circuit to the input data signal based upon an output of the phase detector and provides a frequency offset to the frequency path circuit. A method of receiving data is also described.

Abstract: A data storage system includes a bridging device. The bridging device is configured to receive, from a host through a network, a host data block size. A sub-block size is determined based on the host data block size. One or more storage devices are configured to include a plurality of storage sub-blocks each having the sub-block size. A first write command to write first host data including a first number of host data blocks to the one or more storage devices is received. The bridging device compresses the first host data to generate first compressed data, and write the first compressed data to a second number of storage sub-blocks of the one or more storage devices.

Abstract: Techniques for singulating dies from a respective workpiece and for incorporating one or more singulated die into a stacked device structure are described herein. In some examples, singulating a die from a workpiece includes chemically etching the workpiece in a scribe line. In some examples, singulating a die from a workpiece includes mechanically dicing the workpiece in a scribe line and forming a liner along a sidewall of the die. The die can be incorporated into a stacked device structure. The die can be attached to a substrate along with another die that is attached to the substrate. An encapsulant can be between each die and the substrate and laterally between the dies.

Abstract: Embodiments herein describe a SoC that includes a programmable NoC that can be reconfigured to support different interface communication protocols. In one embodiment, the NoC includes ingress and egress logic blocks which permit hardware elements in the SoC (e.g., processors, memory, programmable logic blocks, etc.) to transmit and receive data using the NoC. The ingress and egress logic blocks may first be configured to support a particular communication protocol for interfacing with the hardware elements. However, at a later time, the user may wish to reconfigure the ingress and egress logic blocks to support a different communication protocol. In response, the SoC can reconfigure the NoC such that the ingress and egress logic blocks support the new communication protocol used by the hardware elements. In this manner, the programmable NoC can support multiple communication protocols used to interface with other hardware elements in the SoC.

Abstract: A circuit for accessing memory elements in an integrated circuit device is described. The circuit comprises a first plurality of memory elements; first line drivers, each of the first line drivers configured to provide a signal to a memory element of the first plurality of memory elements; first line driver buffers configured to control the signals provided by the first line drivers to the first plurality of memory elements; a second plurality of memory elements; second line drivers, each of the second line drivers configured to provide a signal to a memory element of the second plurality of memory elements; second line driver buffers configured to control the signals provided by the second line drivers to the second plurality of memory elements; and wherein one or both of the first line driver buffers and the second line driver buffers are configured to be selectively disabled.

Abstract: Active-on-active microelectronic devices are described. For example, a first die is on a second die with a bottom surface of a first substrate facing a top surface of a second substrate, respectively, to provide a die stack. The first and second dies each have metal layers in ILD layers to provide a first stack structure and a second stack structure, respectively. The first stack structure is interconnected to an upper end of a TSV of the first die. A metal layer of the second stack structure near a bottom surface of the first substrate is interconnected to a lower end of the TSV. A power distribution network layer of the second stack structure is located between lower and upper layers of the metal layers thereof. A transistor located at least in part in the second substrate is interconnected to the power distribution network layer to receive supply voltage or ground.

Abstract: A chip package and method of fabricating the same are described herein. The chip package includes a high speed data transmission line that has an inter-die region through which a signal transmission line couples a first die to a second die. The signal transmission line has a resistance greater than an equivalent base resistance (EBR) of a copper line, which reduces oscillation within the transmission line.

Abstract: A method of selecting routing resources in a multi-chip integrated circuit device is described. The method comprises placing a design on the multi-chip integrated circuit device; estimating a number of vias required to enable connections between chips of the multi-chip integrated circuit device that is placed with a portion of the design; identifying an area of a chip having a number of vias that is greater than a maximum number of vias for the area of the chip; selecting a partition window defining resources in the chip that is placed with the portion of the design, where in the partition window is selected to allow the number of vias to meet a maximum requirement of vias for the partition window; and re-placing the portion of the design within the partition window so that the number of vias in the area of the chip is within the maximum number of vias for the area.

Abstract: An integrated circuit having programmable logic fabric, as well as system and method for computer aided design using such integrated circuit, are disclosed. This integrated circuit includes: a configurable bypassable flip-flop circuit configured to transfer information from programmable internal routing to an input bus of a programmable logic circuit; a loopback branch connected to the input bus to bypass the programmable logic circuit; and a multiplexer having a first input port connected to the loopback branch, a second input port connected to an output bus of the programmable logic circuit, and an output port connected to routing switches of the programmable internal routing. The multiplexer is configured to electrically couple either the first input port or the second input port to the output port.

Abstract: Reducing dynamic power consumption for a circuit can include analyzing, using a processor, a netlist specifying the circuit to determine a block of combinatorial circuitry in a first signal path with at least a threshold amount of switching activity and detecting, using the processor, a second signal path coupled to the block of combinatorial circuitry by a sequential circuit element. The second signal path has a delay that meets a target signal path requirement. Using the processor, the netlist can be modified by subdividing the block of combinatorial circuitry into at least a first portion and a second portion and moving one of the portions from the first signal path to the second signal path, wherein the moving separates the first portion from the second portion by the sequential circuit element.

Abstract: Examples of the present disclosure generally relate to integrated circuits, such as a system-on-chip (SoC), that include a memory subsystem. In some examples, an integrated circuit includes a first master circuit in a first power domain on a chip; a second master circuit in a second power domain on the chip; and a first memory controller in a third power domain on the chip. The first master circuit and the second master circuit each are configured to access memory via the first memory controller. The first power domain and the second power domain each are separate and independent from the third power domain.

Abstract: Implementing a design for a heterogeneous computing platform can include storing, using a processor, profile data in a memory, wherein the profile data is generated from running the design for the heterogeneous computing platform and wherein the design includes a kernel adapted for hardware acceleration. Compliance of the design with a profile rule may be determined by comparing, using the processor, the profile data accessed from the memory with the profile rule. The profile rule can specify a design requirement for a hardware accelerated implementation of the kernel. Compliance of the design with the profile rule can be indicated, using the processor, based upon the comparing.

Abstract: An apparatus can include an interface circuit configured to receive an operating parameter and a control circuit coupled to the interface circuit and configured to store the operating parameter. The apparatus also can include a clock error detection circuit coupled to the control circuit. The clock error detection circuit can be configured to detect a clock error condition on a clock signal based upon the operating parameter and, responsive to detecting the clock error condition, generate a signal indicating an occurrence of the clock error condition.

Abstract: A clock divider circuit receives an input clock signal having a first frequency (f) and generates an output signal having a frequency equal to f/N, where N is an odd integer. The clock divider circuit includes an edge counter to count a number of consecutive edges of the input clock signal having a first plurality, and to assert a control signal when a threshold number (N) of consecutive edges has been counted. The clock divider circuit also includes a frequency multiplier to generate an intermediate clock signal having a frequency equal to 2f/N by doubling the frequency of the control signal based at least in part on transitions of the input clock signal, and a frequency divider to generate an output clock signal having a frequency equal to f/N by halving the frequency of the intermediate clock signal.

Abstract: In an example implementation, an integrated circuit (IC) includes: a plurality of transistors disposed in a plurality of locations on a die of the IC; conductors coupled to terminals of each of the plurality of transistors; a digital-to-analog converter (DAC), coupled to the conductors, to drive voltage signals to the plurality of transistors in response to a digital input; and an analog-to-digital converter (ADC), coupled to at least a portion of the conductors, to generate samples in response to current signals induced in the plurality of transistors in response to the voltage signals, the samples being indicative of at least one electrostatic characteristic for the plurality of transistors.

Abstract: Examples herein describe techniques for providing a customizable direct memory access (DMA) interface which can permit user logic to change or control how DMA read and writes are performed. In one example, a DMA engine may be hardened (e.g., include circuitry formed from a semiconductor material) which prevents the DMA engine from being reconfigured like programmable logic. Instead of changing the DMA engine, the user logic can change or customize the DMA interface between the user logic and the DMA engine. In this way, the manner in which the DMA engine performs DMA write and reads can be changed by the user logic. In one example, the DMA engine includes a bypass mode of operation where descriptors associated with DMA queues are passed through the DMA engine and to the user logic.

Abstract: Examples of the present disclosure provide out-of-range voltage detection and protection in integrated circuits (ICs). In some examples, an IC includes an envelope detector, a comparator, and a switch. The envelope detector is configured to generate an envelope signal of a signal and output the envelope signal on an output node of the envelope detector. A first input node of the comparator is coupled to the output node of the envelope detector. The comparator is configured to compare respective signals provided on the first and second input nodes of the comparator and generate a comparison signal in response to the comparison. The comparator is further configured to output the comparison signal on the output node of the comparator. The switch is connected between a protected node and a protection node and is configured to be selectively opened or closed based, at least in part, on the comparison signal.