Abstract: Rendering a graphical representation of an integrated circuit can include determining, using a processor, a tile of a device model at least partially within a viewport, determining, using the processor, an owning tile having a fly-over wire passing over the tile, determining, using the processor, a predetermined shape of the fly-over wire, and drawing, using the processor, the fly-over wire within the viewport based upon the shape.

Abstract: An example method of configuring a programmable integrated circuit (IC) in a computer system includes: selecting a first region of a programmable fabric of the programmable IC for implementation of a shell circuit, the shell circuit configured to interface with a bus of the computer system; selecting a second region of the programmable fabric for implementation of an application circuit, the application circuit configured to interface with the shell circuit; providing a fence region disposed between the first region and the second region, the fence region including a set of un-configured tiles of the programmable fabric; generating configuration data for a circuit design having the first region, the second region, and the fence region; and loading the configuration data to the programmable IC.

Abstract: A circuit for implementing a discharge path in an input/output circuit of an integrated circuit is described. The circuit comprises an input/output pad; a first node coupled to a power reference voltage; a first impedance element implemented between the first node and the input/output pad; a second node coupled to a ground reference voltage; and a second impedance element implemented between the second node and the input/output pad. A method of implementing a discharge path in an input/output circuit of an integrated circuit is also disclosed.

Abstract: The disclosure describes approaches for generating a physically unclonable function (PUF) value. Power is applied to a power control circuit, an SRAM, and a PUF control circuit. After initially powering-up the SRAM, the PUF control circuit signals the power control circuit to disable power to the SRAM. The power control circuit disables power to the SRAM, and then re-enables power to the SRAM after having power to the SRAM disabled for a waiting period. The PUF control circuit reads a PUF value from the SRAM by the PUF control circuit after the enabling of power.

Abstract: The disclosed circuit arrangements include a logic circuit, multiple bi-stable circuits, and control circuitry coupled to the bi-stable circuits. Each bi-stable circuit has a data input, a clock input, and an output coupled to the logic circuit. The control circuitry is programmable to selectively connect outputs of the bi-stable circuits or signals at the data inputs of the plurality of bi-stable circuits to inputs of the logic circuit. The control circuitry generates one or more delayed clock signals from the clock signal, and selectively provides one of the one or more delayed clock signals or the clock signal without delay to the clock input of each of the first plurality of bi-stable circuits.

Abstract: Apparatus and method for communication is disclosed. In an apparatus, at least one transmission circuit is configured to provide an output alignment marker representing an exclusive disjunction of an orthogonal sequence and an input alignment marker. A multiplexer is configured to multiplex the output alignment marker with payload data for transmission via a communication lane of a plurality of communication lanes.

Abstract: Leakage current estimation for a circuit can include generating a cell leakage library including cell-level leakage current geometry data for different states of cells of a cell library, wherein the cells are specified as transistor-level netlists, and determining, using a processor, gate-level leakage current geometry data for gates of a gate-level netlist for the circuit based upon states of the gates for a selected operating state of the circuit and the cell-level leakage current geometry data. Total leakage current geometry data can be determined, using the processor, for the gate-level netlist by aggregating the gate-level leakage current geometry data.

Abstract: An example digital-to-time converter (DTC) includes: a delay chain circuit having a plurality of delay cells coupled in sequence, the delay chain circuit including a first input to receive a first clock signal and a second input to receive a second clock signal; and a DEM controller coupled to the delay chain circuit to provide a plurality of control signals to the plurality of delay cells, respectively.

Abstract: An example test circuit for an integrated circuit (IC) having a plurality of scan chains includes: a first circuit and a second circuit; and a scan chain router coupled between the first circuit and the plurality of scan chains and coupled between the second circuit and the plurality of scan chains, the scan chain router responsive to an enable signal to: (1) couple the first circuit to each of the plurality of scan chains; or (2) couple the second circuit to one or more concatenated scan chains, where each concatenated scan chain includes a concatenation of two or more of the plurality of scan chains.

Abstract: The disclosed circuit arrangements include a logic circuit, multiple bi-stable circuits, and control circuitry coupled to the bi-stable circuits. Each bi-stable circuit has a data input, a clock input, and an output coupled to the logic circuit. The control circuitry is programmable to selectively connect outputs of the bi-stable circuits or signals at the data inputs of the plurality of bi-stable circuits to inputs of the logic circuit. The control circuitry generates one or more delayed clock signals from the clock signal, and selectively provides one of the one or more delayed clock signals or the clock signal without delay to the clock input of each of the first plurality of bi-stable circuits.

Abstract: Disclosed approaches for fixing a hold time violation in a circuit design include determining a first hold budget that is an amount to fix a first hold time violation on a first path of the circuit design. For each connection of a first plurality of connections on the first path, a respective projected setup slack of the connection in allocating the first hold budget to fixing the first hold time violation on the connection is determined. For each connection of the first plurality of connections, a respective connection hold budget based on the first hold budget and the respective projected setup slack is determined. Each connection of the first plurality of connections is adjusted according to the respective connection hold budget.

Abstract: An integrated circuit interconnects are described herein that are suitable for forming integrated circuit chip packages. In one example, an integrated circuit interconnect is provided that includes a package substrate having a plurality of solder balls coupled to a plurality of contact pads. The package substrate includes a solder mask having a plurality of stepped openings, a plurality of contact pads, and circuitry disposed in the package substrate and coupled to the plurality of contact pads. The solder mask defines a top side of the package substrate. The stepped openings expose the contact pads through solder mask.

Abstract: In an example, an integrated circuit (IC) includes a receive circuit, a transmit circuit, and a control circuit. The receive circuit includes a receive data path and a receive control interface, the receive data path coupled to store received transmission control protocol (TCP) data for a plurality of TCP sessions in a respective plurality of receive buffers in an external memory circuit external to the IC. The transmit circuit includes a transmit data path and a transmit control interface, the transmit data path coupled to read TCP data to be transmitted for the plurality of TCP sessions from a respective plurality of transmit buffers in the external memory circuit. The control circuit is coupled to the receive control interface and the transmit control interface, the control circuit configured to maintain data structures to maintain TCP state information for the plurality of TCP sessions.

Abstract: Methods and apparatus are described relating to a probe assembly having a probe head securing mechanism that includes a lock ring housing and a lock ring disposed in the lock ring housing. In an example, a probe assembly includes a rigid substrate, a circuit board coupled to the rigid substrate, and a probe head securing mechanism. The probe head securing mechanism includes a lock ring housing and a lock ring disposed within the lock ring housing. The circuit board has a surface. The lock ring housing is coupled to the rigid substrate. The circuit board is disposed between the lock ring housing and the rigid substrate. The lock ring is rotatable relative to the lock ring housing. Rotation of the lock ring is configured to move the lock ring in a direction perpendicular to the surface of the circuit board.

Abstract: An example voltage reference circuit includes: a reference circuit comprising a first circuit configured to generate a proportional-to-temperature current and corresponding first control voltage and a second circuit configured to generate a complementary-to-temperature current and corresponding second control voltage; a first current source coupled to a first load circuit, the first current source generating a sum current of the proportional-to-temperature current and the complementary-to-temperature current in response to the first and second control voltages, the first load circuit generating a zero temperature coefficient (Tempco) voltage from the sum current; and a second current source coupled to a second load circuit, the second current source generating the sum current of the proportional-to-temperature current and the complementary-to-temperature current in response to the first and second control voltages, the second load circuit generating a negative Tempco voltage from the sum current and the compl

Abstract: Methods and apparatus are described for converting a pre-silicon Open Verification Methodology or Universal Verification Methodology (OVM/UVM) device under test (DUT) into a design implementable on a programmable integrated circuit (IC) and for converting the pre-silicon OVM/UVM stimulus from the driver and expected response from the scoreboard into timing aware stimulus-response vectors that can be applied through the tester onto the pads of the programmable IC that contains the implemented design. This approach can handle the clock and other input stimuli changing concurrently in the pre-silicon testbench, and the vectors generated therefrom will be in the proper form so as to work deterministically on the silicon on the tester.

Abstract: An integrated circuit device having a vertical connection interfaces for coupling stacked components are provided that improve communication between the stacked components. The techniques described herein allow for increased signal connection density while reducing potential for crosstalk. For example, a ground to signal ratio of connections between components in a vertical interface configured to carry ground signals relative to connections configured to carry data signals within a bank of connections has an edge to center gradient which reduces the amount of ground connections needed to meet crosstalk thresholds, while increasing the amount of signal connections available for communication between components across the vertical interface.

Abstract: Disclosed approaches of determining an estimated glitch toggle rate at an output of a logic circuit include inputting functional static probabilities of combinations of states of the plurality of inputs and a generated glitch toggle rate of the logic circuit. Each functional static probability indicates a probability of the states of the inputs of the combination. For each input of the plurality of inputs to the logic circuit, a Boolean Difference Function (BDF) of the input is generated. A maximum glitch rate, which is the estimated glitch toggle rate, is determined based on the generated glitch toggle rate and the functional static probabilities associated with selected combinations of states of the BDF.

Abstract: Implementing a partial reconfiguration design flow can include determining an interface net connecting static circuitry and a first reconfigurable module of a circuit design, performing, using a processor, a logical optimization on first circuitry of the static circuitry that is entirely external to the first reconfigurable module and on second circuitry entirely within the reconfigurable module, and excluding the interface net from processing using the logical optimization.

Abstract: The disclosure provides simple, low-cost but accurate systems and related methods for on-die temperature sensing typically using calibration and without the need for precision voltage references. In some implementations, the system utilizes two user selectable temperature sensing elements and two user selectable DACs to provide a digital code for the sensed temperature. In some implementations, the two sensing elements can be used to calibrate against each other. For example, calibration can be useful to account for silicon local/global variation. Typically, one of the temperature sensors is diode-based, while the other is resistor-based. However, those of skill in the art will recognize that, in accordance with the disclosure, more than two sensors can be provided that can be calibrated against one another.