Intel Patents
Intel Corporation designs and manufactures microprocessors and chipsets for computing and communications equipment manufacturers. Its products may be found in desktops, servers, tablets, smartphones and other devices.
Intel Patents by Type- Intel Patents Granted: Intel patents that have been granted by the United States Patent and Trademark Office (USPTO).
- Intel Patent Applications: Intel patent applications that are pending before the United States Patent and Trademark Office (USPTO).
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Patent number: 12242315Abstract: A thermal management scheme, for a multichip module, that is aware of various dies in a stack (horizontal and/or vertical) and heat generated from them, local hot spots in a victim die, and hot spots in aggressor die(s). Each victim die receives telemetry information from thermal sensors located in aggressor dies as well as local thermal sensors in the victim die. The telemetry information is used to enable a virtual sensing scheme where temperature for a target die (e.g., a victim die) and/or its intellectual property (IP) domain is estimated or calculated. The estimated or calculated temperature is then used for performance management of the victim and/or aggressor dies in the stack.Type: GrantFiled: March 16, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Somvir Singh Dahiya, Stephen Gunther, Julien Sebot, Randy Osborne, Scot Kellar, Joshua Een
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Patent number: 12242889Abstract: Methods, apparatus, systems and articles of manufacture are disclosed that optimize workflows. An example apparatus includes an intent determiner to determine an objective of a user input, the objective indicating a task to be executed in an infrastructure, a configuration composer to compose a plurality of workflows based on the determined objective, a model executor to execute a machine learning model to create a confidence score relating to the plurality of workflows, and a workflow selector to select at least one of the plurality of workflows for execution in the infrastructure, the selection of the at least one of the plurality of workflows based on the confidence score.Type: GrantFiled: April 17, 2023Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Thijs Metsch, Joseph Butler, Mohammad Mejbah Ul Alam, Justin Gottschlich
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Patent number: 12242973Abstract: Systems, apparatuses and methods may provide for technology that parses, at runtime, a deep learning graph in topological order to identify a plurality of nodes, marks a first set of nodes in the plurality of nodes as unsupported by target hardware, and marks a second set of nodes in the plurality of nodes as supported by the target hardware, wherein the first set of nodes and the second set of nodes are marked based on one or more attributes defining operation functionality, and wherein the one or more attributes include one or more of an input node parameter, a dimension, or a shape.Type: GrantFiled: August 13, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Chandrakant Khandelwal, Ritesh Kumar Rajore, Laxmi Ganesan, Sai Jayanthi, Yamini Nimmagadda
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Patent number: 12242748Abstract: Examples described herein relate to accessing an initiator as a Non-Volatile Memory Express (NMVe) device. In some examples, the initiator is configured with an address space, configured in kernel or user space, for access by a virtualized execution environment. In some examples, the initiator to copy one or more storage access commands from the virtualized execution environment into a queue for access by a remote direct memory access (RDMA) compatible network interface. In some examples, the network interface to provide Non-Volatile Memory Express over Fabrics (NVMe-oF) compatible commands based on the one or more storage access commands to a target storage device. In some examples, the initiator is created as a mediated device in kernel space or user space of a host system. In some examples, configuration of a physical storage pool address of the target storage device for access by the virtualized execution environment occurs by receipt of the physical storage pool address in a configuration command.Type: GrantFiled: June 23, 2020Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Shaopeng He, Yadong Li, Ziye Yang, Changpeng Liu, Banghao Ying, Robert O. Sharp
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Patent number: 12244601Abstract: A system includes an orchestrator to receive a first request for resources for a workload of a tenant and to select a first node cluster in a first compute domain to be provisioned for the workload. The system also includes a first security manager to run in a trusted execution environment of one or more processors to receive attestation results for a second node cluster from a second security manager in a second compute domain, and to establish the first node cluster and the second node cluster as a trusted group of node clusters for the workload based, at least in part, on determining that a first compute node in the first node cluster meets one or more security requirements of a workload execution policy associated with the workload and that the attestation results indicate that a second compute node in the second node cluster meets the one or more security requirements.Type: GrantFiled: December 2, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Anahit Tarkhanyan, Reshma Lal, Jianping Xu, Christine E. Severns-Williams
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Patent number: 12242319Abstract: An interface card includes a circuit board, a device mounted on the circuit board, and a PMIC mounted on the circuit board. The PMIC includes a PMIC processor communicatively coupled to a host processor of a host system. The PMIC processor is configured to receive an input voltage signal from a power supply that is external to the interface card. The PMIC processor generates at least one output voltage signal based on the input voltage signal. The at least one output voltage signal is supplied to the device. A power enable signal originating from the host processor is detected. The power enable signal is detected at a GPIO connector of the PMIC. The PMIC processor deactivates generation of the at least one output voltage signal based on the power enable signal.Type: GrantFiled: September 23, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Shailendra Singh Chauhan, Arunthathi Chandrabose
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Patent number: 12243148Abstract: A method comprising: dividing a 3D space into a voxel grid comprising a plurality of voxels; associating a plurality of distance values with the plurality of voxels, each distance value based on a distance to a boundary of an object; selecting an approximate interpolation mode for stepping a ray through a first one or more voxels of the 3D space responsive to the first one or more voxels having distance values greater than a threshold; and detecting the ray reaching a second one or more voxels having distance values less than the first threshold; and responsively selecting a precise interpolation mode for stepping the ray through the second one or more voxels.Type: GrantFiled: October 14, 2020Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Vivek De, Ram Krishnamurthy, Amit Agarwal, Steven Hsu, Monodeep Kar
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Patent number: 12243155Abstract: Methods, systems and apparatuses may provide for technology that identifies first graphics data that is associated with spatially proximate positions. The technology identifies second graphics data that is associated with spatially proximate positions, and interleaves the first and the second graphics data across a plurality of storage tiles.Type: GrantFiled: June 24, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Prasoonkumar Surti, Ronald Silvas, Karol A. Szerszen
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Patent number: 12243806Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a base substrate. The base substrate may have a plurality of through substrate vias. In an embodiment, a first die is over the base substrate. In an embodiment a first cavity is disposed into the base substrate. In an embodiment, the first cavity is at least partially within a footprint of the first die. In an embodiment, a first component is in the first cavity.Type: GrantFiled: December 27, 2023Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Ravindranath Mahajan, Debendra Mallik, Sujit Sharan, Digvijay Raorane
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Patent number: 12243825Abstract: An electronic substrate may be fabricated to include a fine pitch dielectric layer having an upper surface, a coarse pitch dielectric layer on the upper surface of the fine pitch dielectric layer, and at least one hybrid conductive via extending through the fine pitch dielectric layer and the coarse pitch dielectric layer. The hybrid conductive via is fabricated such that a portion thereof that extends through the fine pitch dielectric layer is smaller than a portion extending through the coarse pitch dielectric layer, which results in a stepped configuration, wherein a portion of the hybrid conductive via abuts the upper surface of the fine pitch dielectric layer. In an embodiment of the present description, an integrated circuit package may be formed with the electronic substrate, wherein at least two integrated circuit devices may be attached to the electronic substrate, such that the bridge provides device-to-device interconnection therebetween.Type: GrantFiled: May 21, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Srinivas Pietambaram, Rahul Manepalli
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Patent number: 12245052Abstract: A computing node to implement an RL management entity in an NG wireless network includes a NIC and processing circuitry coupled to the NIC. The processing circuitry is configured to generate a plurality of network measurements for a corresponding plurality of network functions. The functions are configured as a plurality of ML models forming a multi-level hierarchy. Control signaling from an ML model of the plurality is decoded, the ML model being at a predetermined level (e.g., a lowest level) in the hierarchy. The control signaling is responsive to a corresponding network measurement and at least second control signaling from a second ML model at a level that is higher than the predetermined level. A plurality of reward functions is generated for training the ML models, based on the control signaling from the MLO model at the predetermined level in the multi-level hierarchy.Type: GrantFiled: September 23, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Vasuki Narasimha Swamy, Hosein Nikopour, Oner Orhan, Shilpa Talwar
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Patent number: 12243856Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a mold over and around a first die and a first via. The semiconductor package has a conductive pad of a first redistribution layer disposed on a top surface of the first die and/or a top surface of the mold. The semiconductor package includes a second die having a solder ball coupled to a die pad on a bottom surface of the second die, where the solder ball of the second die is coupled to the first redistribution layer. The first redistribution layer couples the second die to the first die, where the second die has a first edge and a second edge, and where the first edge is positioned within a footprint of the first die and the second edge is positioned outside the footprint of the first die.Type: GrantFiled: June 30, 2023Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: David O'Sullivan, Georg Seidemann, Richard Patten, Bernd Waidhas
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Patent number: 12242391Abstract: A processor includes a decode unit to decode an instruction that is to indicate a page of a protected container memory, and a storage location outside of the protected container memory. An execution unit, in response to the instruction, is to ensure that there are no writable references to the page of the protected container memory while it has a write protected state. The execution unit is to encrypt a copy of the page of the protected container memory. The execution unit is to store the encrypted copy of the page to the storage location outside of the protected container memory, after it has been ensured that there are no writable references. The execution unit is to leave the page of the protected container memory in the write protected state, which is also valid and readable, after the encrypted copy has been stored to the storage location.Type: GrantFiled: October 9, 2023Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Carlos V. Rozas, Mona Vij, Rebekah M. Leslie-Hurd, Krystof C. Zmudzinski, Somnath Chakrabarti, Francis X. McKeen, Vincent R. Scarlata, Simon P. Johnson, Ilya Alexandrovich, Gilbert Neiger, Vedvyas Shanbhogue, Ittai Anati
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Patent number: 12243875Abstract: Embodiments disclosed herein include forksheet transistor devices having a dielectric or a conductive spine. For example, an integrated circuit structure includes a dielectric spine. A first transistor device includes a first vertical stack of semiconductor channels spaced apart from a first edge of the dielectric spine. A second transistor device includes a second vertical stack of semiconductor channels spaced apart from a second edge of the dielectric spine. An N-type gate structure is on the first vertical stack of semiconductor channels, a portion of the N-type gate structure laterally between and in contact with the first edge of the dielectric spine and the first vertical stack of semiconductor channels. A P-type gate structure is on the second vertical stack of semiconductor channels, a portion of the P-type gate structure laterally between and in contact with the second edge of the dielectric spine and the second vertical stack of semiconductor channels.Type: GrantFiled: January 10, 2024Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Seung Hoon Sung, Cheng-Ying Huang, Marko Radosavljevic, Christopher M. Neumann, Susmita Ghose, Varun Mishra, Cory Weber, Stephen M. Cea, Tahir Ghani, Jack T. Kavalieros
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Patent number: 12244807Abstract: Techniques related to adaptive quantization matrix selection using machine learning for video coding are discussed. Such techniques include applying a machine learning model to generate an estimated quantization parameter for a frame and selecting a set of quantization matrices for encode of the frame from a number of sets of quantization matrices based on the estimated quantization parameter.Type: GrantFiled: November 30, 2020Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: James Holland, Sang-hee Lee, Ximin Zhang, Zhan Lou
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Patent number: 12243496Abstract: Often when there is a glare on a display screen the user may be able to mitigate the glare by tilting or otherwise moving the screen or changing their viewing position. However, when driving a car there are limited options for overcoming glares on the dashboard, especially when you are driving for a long distance in the same direction. Embodiments are directed to eliminating such glare. Other embodiments are related to mixed reality (MR) and filling in occluded areas.Type: GrantFiled: May 24, 2023Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Arthur J. Runyan, Richmond Hicks, Nausheen Ansari, Narayan Biswal, Ya-Ti Peng, Abhishek R. Appu, Wen-Fu Kao, Sang-Hee Lee, Joydeep Ray, Changliang Wang, Satyanarayana Avadhanam, Scott Janus, Gary Smith, Nilesh V. Shah, Keith W. Rowe, Robert J. Johnston
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Patent number: 12242753Abstract: Methods and apparatus for reduced network load with receiver-managed offset (RMO) PUT or GET messages. An RMO PUT message including an RMO key, data, and a length is sent from an initiator to a target, where the RMO key is extracted by a Network Interface controller (NIC), SmartNIC, or Infrastructure Processing Unit and used to identify an address or address offset of a memory buffer in a target memory at which to write the data. An RMO GET message is sent from an initiator to a target and includes an RMO key, a source buffer on the target, and a length. The target processes the RMO GET, reads the length of data from its source buffer, and returns a message to the initiator including the RMO key, the read data, and the length. The RMO key is extracted and used to identify an address or address offset of a memory buffer in a memory on the initiator in which to write the read data.Type: GrantFiled: September 24, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: David Keppel, David M. Ozog
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Patent number: 12243545Abstract: A method and system of neural network dynamic noise suppression is provided for audio processing.Type: GrantFiled: December 24, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Adam Kupryjanow, Lukasz Pindor
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Patent number: 12242412Abstract: A data scaling module for USB4 that embodies display driver (DD) and connection manager (CM) operations. Periodic and aperiodic transfer requests are monitored. The periodic BW activity on periodic peripherals, such as display panels (DPs) is monitored, and determinations as to reduced periodic activity on a DP are made. Responsive to receiving a high aperiodic bandwidth request, the original refresh rate for the DP is reduced. The newly freed USB4 BW is provided for the aperiodic task. At completion of the aperiodic task, the DD increases the refresh rate to its original value.Type: GrantFiled: March 31, 2023Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Rajaram Regupathy, Reuven Rozic, Dmitriy Berchanskiy, Nirmala Bailur, Vrukesh V. Panse, Saranya Gopal
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Patent number: 12242336Abstract: Systems and devices can include a physical layer (PHY) that includes a logical PHY to support multiple interconnect protocols. The logical PHY can include a first set of cyclic redundancy check (CRC) encoders corresponding to a first interconnect protocol, and a second set of CRC encoders corresponding to a second interconnect protocol. A multiplexer can direct data to the first set or the second set of CRC encoders based on a selected interconnect protocol. The logical PHY can include a first set of error correcting code (ECC) encoders corresponding to the first interconnect protocol and a second set of ECC encoders corresponding to the second interconnect protocol. The multiplexer can direct data to the first set or the second set of ECC encoders based on the selected interconnect protocol. In embodiments, different CRC/ECC combinations can be used based on the interconnect protocol and the link operational conditions.Type: GrantFiled: August 25, 2023Date of Patent: March 4, 2025Assignee: Intel CorporationInventor: Debendra Das Sharma
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Patent number: 12242414Abstract: Methods and apparatus relating to data initialization techniques. In an example, an apparatus comprises a processor to read one or more metadata codes which map to one or more cache lines in a cache memory and invoke a random number generator to generate random numerical data for the one or more cache lines in response to a determination that the one more metadata codes indicate that the cache lines are to contain random numerical data. Other embodiments are also disclosed and claimed.Type: GrantFiled: March 14, 2020Date of Patent: March 4, 2025Assignee: INTEL CORPORATIONInventors: Abhishek R. Appu, Aravindh Anantaraman, Elmoustapha Ould-Ahmed-Vall, Valentin Andrei, Nicolas Galoppo Von Borries, Varghese George, Altug Koker, Mike Macpherson, Subramaniam Maiyuran, Joydeep Ray, Vasanth Ranganathan
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Patent number: 12242721Abstract: Disclosed Methods, Apparatus, and articles of manufacture to profile page tables for memory management are disclosed. An example apparatus includes a processor to execute computer readable instructions to: profile a first page at a first level of a page table as not part of a target group; and in response to profiling the first page as not part of the target group, label a data page at a second level that corresponds to the first page as not part of the target group, the second level being lower than the first level.Type: GrantFiled: March 26, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Aravinda Prasad, Sandeep Kumar, Sreenivas Subramoney, Andy Rudoff
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Patent number: 12242846Abstract: An apparatus to facilitate supporting 8-bit floating point format operands in a computing architecture is disclosed. The apparatus includes a processor comprising: a decoder to decode an instruction fetched for execution into a decoded instruction, wherein the decoded instruction is a matrix instruction that operates on 8-bit floating point operands to cause the processor to perform a parallel dot product operation; a controller to schedule the decoded instruction and provide input data for the 8-bit floating point operands in accordance with an 8-bit floating data format indicated by the decoded instruction; and systolic dot product circuitry to execute the decoded instruction using systolic layers, each systolic layer comprises one or more sets of interconnected multipliers, shifters, and adder, each set of multipliers, shifters, and adders to generate a dot product of the 8-bit floating point operands.Type: GrantFiled: March 27, 2024Date of Patent: March 4, 2025Assignee: INTEL CORPORATIONInventors: Naveen Mellempudi, Subramaniam Maiyuran, Varghese George, Fangwen Fu, Shuai Mu, Supratim Pal, Wei Xiong
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Patent number: 12242342Abstract: A memory controller having an error checking and correction (ECC) circuitry can detect an error in data being read from memory and correct that error with a retry flow without needing to send another read to the memory for the data. The read data is stored in a read data buffer (RDB) at the memory controller when the read data is received from memory. The memory controller has an error detection path from the RDB to the host and an error correction path. Read data that has no errors can be sent directly to the host. Instead of flushing the RDB in response to the error detection, the memory controller executes a retry flow, where the RDB provides the read data to the error correction path for error correction.Type: GrantFiled: December 14, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Jing Ling, Wei P. Chen, Rajat Agarwal
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Patent number: 12244798Abstract: An example apparatus includes image processing circuitry to determine an uncovered region of a background image in a current video frame relative to the background image in a previous video frame, the uncovered region obscured in the previous video frame by a first foreground region of the previous video frame, and the uncovered region uncovered in the current video frame based on movement of a second foreground region in the current video frame relative to the first foreground region of the previous video frame, and encoder circuitry to generate an updated frame portion by encoding the second foreground region and dirty blocks of the background image corresponding to the uncovered region without encoding static blocks of the background image, the static blocks not corresponding to the uncovered region, and store the updated frame portion in the at least one memory.Type: GrantFiled: September 24, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Stanley Baran, Satish Kumar Bhrugumalla, Kristoffer Fleming, Charu Srivastava, James Holland, Jong Dae Oh
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Patent number: 12242861Abstract: Methods, apparatus, systems, and articles of manufacture to load data into an accelerator are disclosed. An example apparatus includes data provider circuitry to load a first section and an additional amount of compressed machine learning parameter data into a processor engine. Processor engine circuitry executes a machine learning operation using the first section of compressed machine learning parameter data. A compressed local data re-user circuitry determines if a second section is present in the additional amount of compressed machine learning parameter data. The processor engine circuitry executes a machine learning operation using the second section when the second section is present in the additional amount of compressed machine learning parameter data.Type: GrantFiled: January 18, 2024Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Arnab Raha, Deepak Mathaikutty, Debabrata Mohapatra, Sang Kyun Kim, Gautham Chinya, Cormac Brick
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Patent number: 12242851Abstract: Methods and apparatus relating to verifying a compressed stream fused with copy or transform operation(s) are described. In an embodiment, compression logic circuitry compresses input data and stores the compressed data in a temporary buffer. The compression logic circuitry determines a first checksum value corresponding to the compressed data stored in the temporary buffer. Decompression logic circuitry performs a decompress-verify operation and a copy operation. The decompress-verify operation decompresses the compressed data stored in the temporary buffer to determine a second checksum value corresponding to the decompressed data from the temporary buffer. The copy operation transfers the compressed data from the temporary buffer to a destination buffer in response to a match between the first checksum value and the second checksum value. Other embodiments are also disclosed and claimed.Type: GrantFiled: September 9, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Vinodh Gopal, James D. Guilford, Daniel F. Cutter
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Patent number: 12242859Abstract: Particular embodiments described herein provide for an electronic device that includes two or more displays and a BIOS. On startup, before the premem state and MRC initialization of the boot process, the BIOS causes power to be enabled to two or more displays. A display engine determines if a hot plug for each display is asserted and for each display where the hot plug was not asserted, the path to the display where the hot plug was not asserted is closed. In an example, the BIOS communicates the signal to power enable the first display and the second display after general-purpose input/output initialization during the boot process. After the premem stage and MRC initialization are completed, the first display and the second display are both configured to begin to display pixels.Type: GrantFiled: June 26, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Arthur Jeremy Runyan, Ratheesh Purushothaman Nair, Shailendra Singh Chauhan, Digant H. Solanki
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Patent number: 12242875Abstract: Providing multiple virtual processors (VPs) for a trusted domain (TD) includes creating a virtual processor control structure (VPCS) for one or more of a plurality of VPs of the TD of a processor in a computing system, the TD including a trust domain control structure (TDCS), the plurality of VPs having views into addresses of private memory of the TD, the VPCS for a VP including a secure extended page table (SEPT) for the VP; and for the VP, initializing the VPCS for the VP by copying selected entries of the TDCS to the SEPT of the VPCS, pointing a SEPT pointer to the VPCS, and setting an entry point for starting execution of the VP by the processor.Type: GrantFiled: September 24, 2021Date of Patent: March 4, 2025Assignee: INTEL CORPORATIONInventor: Bin Xing
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Patent number: 12243125Abstract: Systems, apparatuses and methods may provide for technology that determines a stencil value and uses the stencil value to control, via a stencil buffer, a coarse pixel size of a graphics pipeline. Additionally, the stencil value may include a first range of bits defining a first dimension of the coarse pixel size and a second range of bits defining a second dimension of the coarse pixel size. In one example, the coarse pixel size is controlled for a plurality of pixels on a per pixel basis.Type: GrantFiled: November 22, 2023Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Karthik Vaidyanathan, Prasoonkumar Surti, Hugues Labbe, Atsuo Kuwahara, Sameer KP, Jonathan Kennedy, Murali Ramadoss, Michael Apodaca, Abhishek Venkatesh
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Patent number: 12243429Abstract: Techniques are disclosed to increase the safety of vehicles travelling in a vehicle platoon. These techniques include the utilization of a comprehensive safety framework such as a safety driving model (SDM) for the platoon control systems. In contrast to the conventional approaches, the use of the SDM model allows for platoon vehicle control systems to consider the acceleration/deceleration capabilities of the vehicles to calculate minimum safe longitudinal distances between the platoon vehicles. The disclosed techniques may utilize the periodicity of platoon messages as well as other parameters to improve upon platoon vehicle control and safety.Type: GrantFiled: May 3, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Arvind Merwaday, Leonardo Gomes Baltar, Kathiravetpillai Sivanesan, May Wu, Suman A. Sehra
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Patent number: 12243157Abstract: An apparatus to facilitate inferred object shading is disclosed. The apparatus comprises one or more processors to receive rasterized pixel data and hierarchical data associated with one or more objects and perform an inferred shading operation on the rasterized pixel data, including using one or more trained neural networks to perform texture and lighting on the rasterized pixel data to generate a pixel output, wherein the one or more trained neural networks uses the hierarchical data to learn a three-dimensional (3D) geometry, latent space and representation of the one or more objects.Type: GrantFiled: March 20, 2024Date of Patent: March 4, 2025Assignee: INTEL CORPORATIONInventors: Selvakumar Panneer, Mrutunjayya Mrutunjayya, Carl S. Marshall, Ravishankar Iyer, Zack Waters
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Patent number: 12243611Abstract: An integrated circuit (IC) die comprises a sensor, which includes a pulse generator and a pulse expander. The pulse generator comprises gate circuits coupled to each other in an in-series arrangement. An input of the pulse generator is coupled to receive a voltage and the pulse generator is to generate a first signal based on the voltage. The pulse generator is to generate a first pulse of the first signal based on an event wherein radiation from a laser is incident upon the pulse generator. The pulse expander is coupled to receive the first signal from the pulse generator and to generate a second signal based on the first signal, wherein a second pulse of the second signal is based on the first pulse. A first duration of the first pulse is less than a second duration of the second pulse.Type: GrantFiled: July 1, 2022Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Minki Cho, Daniel Nemiroff, Carlos Tokunaga, James W. Tschanz, Kah Meng Yeem, Yaxin Shui
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Patent number: 12243590Abstract: In one embodiment, an apparatus comprises a memory comprising a group of memory cells coupled to a wordline; and a controller configured to skip programming of one or more pages of the group of memory cells responsive to a sequential write operation; and program the one or more pages of the group of memory cells responsive to one or more random write commands.Type: GrantFiled: November 17, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Shantanu R. Rajwade, Christian Mion, Pranav Kalavade, Rohit S. Shenoy, Xin Sun, Kristopher Gaewsky
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Patent number: 12244326Abstract: A FEC codec for generating a check byte for a message. The FEC codec includes a port encoder having a storage unit, a Galois field multiplier, and a sum unit. The storage unit stores a first staged result, which is accumulated based on previous sets of input byte of the message for all clock cycles from a first clock cycle to a clock cycle immediately prior to the current clock cycle. The Galois field multiplier performs a Galois field multiplication of the first staged result and a power of the alpha to generate a Galois field product. The sum unit performs a Galois field addition on an internal input based on a consolidated byte for the current clock cycle and the Galois field product to generate a second staged result for subsequent use to generate the check byte. Other embodiments may be described and/or claimed.Type: GrantFiled: July 19, 2023Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Debendra Das Sharma, Swadesh Choudhary
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Patent number: 12243192Abstract: An apparatus to facilitate video motion smoothing is disclosed. The apparatus comprises one or more processors including a graphics processor, the one or more processors including circuitry configured to receive a video stream, decode the video stream to generate a motion vector map and a plurality of video image frames, analyze the motion vector map to detect a plurality of candidate frames, wherein the plurality of candidate frames comprise a period of discontinuous motion in the plurality of video image frames and the plurality of candidate frames are determined based on a classification generated via a convolutional neural network (CNN), generate, via a generative adversarial network (GAN), one or more synthetic frames based on the plurality of candidate frames, insert the one or more synthetic frames between the plurality of candidate frames to generate up-sampled video frames and transmit the up-sampled video frames for display.Type: GrantFiled: June 22, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Satyam Srivastava, Saurabh Tangri, Rajeev Nalawadi, Carl S. Marshall, Selvakumar Panneer
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Patent number: 12243812Abstract: Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages, and the resulting silicon bridges and semiconductor packages, are described. In an example, a semiconductor structure includes a substrate having a lower insulating layer disposed thereon. The substrate has a perimeter. A metallization structure is disposed on the lower insulating layer. The metallization structure includes conductive routing disposed in a dielectric material stack. First and second pluralities of conductive pads are disposed in a plane above the metallization structure. Conductive routing of the metallization structure electrically connects the first plurality of conductive pads with the second plurality of conductive pads. An upper insulating layer is disposed on the first and second pluralities of conductive pads. The upper insulating layer has a perimeter substantially the same as the perimeter of the substrate.Type: GrantFiled: November 3, 2023Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Dae-Woo Kim, Sujit Sharan
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Patent number: 12243037Abstract: Logic to register a personal point of sale (POS) device. Logic may communicate with the registration processor to establish a secure communication channel. Logic may access a basic input output system to obtain platform information. Logic may transmit the platform information to the registration processor to identify a certification associated with the device. Logic may communicate with a payment instrument via a card reader. Logic may transmit an encrypted message from the card reader to the registration processor to bind the payment instrument to the device. Logic may receive a communication from the device comprising platform information. Logic may perform a security protocol to establish a secure communication channel with the device. Logic may determine an existence of the certification for the device in the database based upon the platform information. And logic may register the platform in response to locating the certification of the platform.Type: GrantFiled: March 17, 2022Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Farid Adrangi, Sanjay Bakshi, Amit S. Bodas
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Patent number: 12243792Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.Type: GrantFiled: December 21, 2020Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Omkar G. Karhade, Xiaoxuan Sun, Nitin A. Deshpande, Sairam Agraharam
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Patent number: 12243828Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate including a first conductive pathway electrically coupled to a power source; a mold material on the package substrate including a first microelectronic component embedded in the mold material, a second microelectronic component embedded in the mold material, and a TMV, between the first and second microelectronic components, the TMV electrically coupled to the first conductive pathway; a redistribution layer (RDL) on the mold material including a second conductive pathway electrically coupled to the TMV; and a third microelectronic component on the RDL and electrically coupled to the second conductive pathway, wherein the second conductive pathway electrically couples the TMV, the first microelectronic component, and the third microelectronic component.Type: GrantFiled: June 23, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Bernd Waidhas, Carlton Hanna, Stephen Morein, Lizabeth Keser, Georg Seidemann
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Publication number: 20250070926Abstract: For example, a wireless communication device may be configured to generate a wide bandwidth Long Training Field (LTF) configured for channel sounding over a wide channel bandwidth of at least 320 Megahertz (MHz). For example, the wide bandwidth LTF may include a plurality of Orthogonal Frequency Division Multiplexing (OFDM) symbols over the wide channel bandwidth. For example, the wireless communication device may be configured to transmit a Null Data Packet (NDP) over the wide channel bandwidth. For example, the NDP may include a non-High-Throughput (non-HT) Short Training Field (L-STF), a non-HIT LTF (L-LTF) after the L-STF, a non-HT Signal (L-SIG) field after the L-LTF, a Repeated L-SIG (RL-SIG) field after the L-SIG field, and the wide bandwidth LTF after the RL-SIG field.Type: ApplicationFiled: September 30, 2022Publication date: February 27, 2025Applicant: Intel CorporationInventors: Qinghua Li, Xiaogang Chen, Po-Kai Huang, Yonathan Segev, Laurent Cariou, Cheng Chen
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Publication number: 20250072069Abstract: Techniques to form semiconductor device conductive interconnections. In an example, an integrated circuit includes a recessed via and a conductive bridge between a top surface of the recessed via and an adjacent source or drain contact. A transistor device includes a semiconductor material extending from a source or drain region, a gate structure over the semiconductor material, and a contact on the source or drain region. Adjacent to the source or drain region, a deep via structure extends in a vertical direction through an entire thickness of the gate structure. The via structure includes a conductive via that is recessed below a top surface of the conductive contact. A conductive bridge extends between the contact and the conductive via such that the conductive bridge contacts a portion of the contact and at least a portion of a top surface of the conductive via.Type: ApplicationFiled: August 24, 2023Publication date: February 27, 2025Applicant: Intel CorporationInventors: Leonard P. Guler, Desalegne B. Teweldebrhan, Shengsi Liu, Saurabh Acharya, Marko Radosavljevic, Richard Schenker
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Publication number: 20250069902Abstract: Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, a method for forming an IC package support may include forming a first dielectric material having a surface; forming a first conductive via in the first dielectric material, wherein the first conductive via has tapered sidewalls with an angle that is equal to or less than 80 degrees relative to the surface of the first dielectric material; forming a second dielectric material, having a surface, on the first dielectric material; and forming a second conductive via in the second dielectric material, wherein the second conductive via is electrically coupled to the first conductive via, has tapered sidewalls with an angle that is greater than 80 degrees relative to the surface of the second dielectric material, and a maximum diameter between 2 microns and 20 microns.Type: ApplicationFiled: November 13, 2024Publication date: February 27, 2025Applicant: Intel CorporationInventors: Kristof Kuwawi Darmawikarta, Robert May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov
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Publication number: 20250069539Abstract: In one embodiment, a display panel may have multiple regions that are controlled by independent driver circuitries to allow for independent refreshing of different regions. Circuitry, e.g., in a graphics source or in the display, can determine, based on a partial frame update, which panel regions to refresh and refresh those regions, e.g., while not refreshing other regions of the panel.Type: ApplicationFiled: June 10, 2024Publication date: February 27, 2025Applicant: Intel CorporationInventors: Perazhi Sameer Kalathil, Vishal Ravindra Sinha, Krishna Kishore Nidamanuri, Mallari C. Hanchate, Vivek Paranjape, Kunjal S. Parikh, Roland P. Wooster
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Publication number: 20250068588Abstract: Methods and apparatus relating to scalar core integration in a graphics processor. In an example, an apparatus comprises a processor to receive a set of workload instructions for a graphics workload from a host complex, determine a first subset of operations in the set of operations that is suitable for execution by a scalar processor complex of the graphics processing device and a second subset of operations in the set of operations that is suitable for execution by a vector processor complex of the graphics processing device, assign the first subset of operations to the scalar processor complex for execution to generate a first set of outputs, assign the second subset of operations to the vector processor complex for execution to generate a second set of outputs. Other embodiments are also disclosed and claimed.Type: ApplicationFiled: September 3, 2024Publication date: February 27, 2025Applicant: Intel CorporationInventors: Joydeep RAY, Aravindh ANANTARAMAN, Abhishek R. APPU, Altug KOKER, Elmoustapha OULD-AHMED-VALL, Valentin ANDREI, Subramaniam MAIYURAN, Nicolas GALOPPO VON BORRIES, Varghese GEORGE, Mike MACPHERSON, Ben ASHBAUGH, Murali RAMADOSS, Vikranth VEMULAPALLI, William SADLER, Jonathan PEARCE, Sungye KIM
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Publication number: 20250071037Abstract: Management of data transfer for network operation is described. An example of an apparatus includes one or more network interfaces and a circuitry for management of data transfer for a network, wherein the circuitry for management of data transfer includes at least circuitry to analyze a plurality of data elements transferred on the network to identify data elements that are delayed or missing in transmission on the network, circuitry to determine one or more responses to delayed or missing data on the network, and circuitry to implement one or more data modifications for delayed or missing data on the network, including circuitry to provide replacement data for the delayed or missing data on the network.Type: ApplicationFiled: November 14, 2024Publication date: February 27, 2025Applicant: Intel CorporationInventors: Daniel Biederman, Patrick Connor, Karthik Kumar, Marcos Carranza, Anjali Singhai Jain
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Publication number: 20250068473Abstract: Described herein is a graphics processor comprising a graphics processing cluster coupled with the memory interface, the graphics processing cluster including a plurality of processing resources, a processing resource of the plurality of processing resources including a register file including a first plurality of registers associated with a first hardware thread of a plurality of hardware threads of the processing resource and a second plurality of registers associated with a second hardware thread of the plurality of hardware threads of the processing resource and first circuitry configured to facilitate access to memory on behalf of the plurality of hardware threads and store metadata for memory access requests from the plurality of hardware threads.Type: ApplicationFiled: August 22, 2023Publication date: February 27, 2025Applicant: Intel CorporationInventors: Jorge Eduardo Parra Osorio, Jiasheng Chen, Supratim Pal, James Valerio
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Publication number: 20250068556Abstract: A system includes memory circuitry to store a secure shared memory buffer (SSMB) and instructions; and a processor to create the SSMB in the memory circuitry and assign ownership of the SSMB to an SSMB owner, the SSMB owner being a trusted execution environment virtual machine running on the computing system; configure access permissions for the SSMB by the SSMB owner to allow one or more SSMB users to access the SSMB, the one or more SSMB users being trusted execution environment virtual machines running on the computing system; allocate memory by the SSMB owner from the SSMB owner's private memory space in the memory circuitry for the SSMB; and allowing secure access by the one or more SSMB users to the SSMB in response to successfully verifying authorization of the one or more SSMB users based at least in part on the access permissions.Type: ApplicationFiled: September 28, 2022Publication date: February 27, 2025Applicant: Intel CorporationInventors: Arie AHARON, Jiewen YAO
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Publication number: 20250068457Abstract: An apparatus includes a host interface; a network interface; and a programmable circuitry communicably coupled to the host interface and the network interface, the programmable circuitry comprising one or more processors to implement network interface functionality and to: determine portions of a set of computer vision (CV) processes to be deployed on the programmable circuitry and a host device, wherein the host device to be communicably coupled to the programmable network interface device; access instructions to cause the portions of the set of the CV processes to be deployed on the host device and the programmable network interface device; and wherein a media processing portion of the set of the CV processes is to be deployed to the programmable circuitry, and wherein the programmable circuitry is to utilize media processing hardware circuitry hosted by the apparatus to perform the media processing portion.Type: ApplicationFiled: November 12, 2024Publication date: February 27, 2025Applicant: Intel CorporationInventors: Marcos Carranza, Karthik Kumar, Mariano Ortega De Mues, Mateo Guzman, Patrick Connor, Cesar Martinez-Spessot
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Patent number: D1065180Type: GrantFiled: December 29, 2022Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Andrew Hooper, Brandon Courtney, David M. Collins, Michael Hyde, Steven Mardis Bagley, Nadezhda Kutyreva, Phnam Bagley, Diana Hilson