Intel Patents

Intel Corporation designs and manufactures microprocessors and chipsets for computing and communications equipment manufacturers. Its products may be found in desktops, servers, tablets, smartphones and other devices.

Intel Patents by Type
  • Intel Patents Granted: Intel patents that have been granted by the United States Patent and Trademark Office (USPTO).
  • Intel Patent Applications: Intel patent applications that are pending before the United States Patent and Trademark Office (USPTO).
  • Publication number: 20240104022
    Abstract: An example of an apparatus may include a first cache organized as two or more portions, a second cache, and circuitry coupled to the first cache and the second cache to determine a designated portion allocation for data transferred from the first cache to the second cache, and track the designated portion allocation for the data transferred from the first cache to the second cache. Other examples are disclosed and claimed.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Aneesh Aggarwal, Georgii Tkachuk, Subhiksha Ravisundar, Youngsoo Choi, Niall McDonnell
  • Publication number: 20240107448
    Abstract: This disclosure describes systems, methods, and devices related to traffic indication map (TIM) piggybacking. A device may determine a frame including one or more TIMs indicating that the device has data to send in a first frequency band of a plurality of supported frequency bands. The device may cause to send the frame in a second frequency band of the plurality of supported frequency bands, wherein the first frequency band is different from the second frequency band, wherein the frame indicates a request for a first station device to be awake in the first frequency band to receive the data. The device may cause to send the data using the first frequency band.
    Type: Application
    Filed: September 29, 2023
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Laurent Cariou, Po-Kai Huang, Alexander Min, Minyoung Park, Rath Vannithamby
  • Publication number: 20240104226
    Abstract: Embodiments are directed to trusted local memory management in a virtualized GPU. An embodiment of an apparatus includes one or more processors including a trusted execution environment (TEE); a GPU including a trusted agent; and a memory, the memory including GPU local memory, the trusted agent to ensure proper allocation/deallocation of the local memory and verify translations between graphics physical addresses (PAs) and PAs for the apparatus, wherein the local memory is partitioned into protection regions including a protected region and an unprotected region, and wherein the protected region to store a memory permission table maintained by the trusted agent, the memory permission table to include any virtual function assigned to a trusted domain, a per process graphics translation table to translate between graphics virtual address (VA) to graphics guest PA (GPA), and a local memory translation table to translate between graphics GPAs and PAs for the local memory.
    Type: Application
    Filed: July 25, 2023
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Pradeep M. Pappachan, Luis S. Kida, Reshma Lal
  • Publication number: 20240104196
    Abstract: Technologies for memory management with memory protection extension include a computing device having a processor with one or more protection extensions. The processor may load a logical address including a segment base, effective limit, and effective address and generate a linear address as a function of the logical address with the effective limit as a mask. The processor may switch to a new task described by a task state segment extension. The task state extension may specify a low-latency segmentation mode. The processor may prohibit access to a descriptor in a local descriptor table with a descriptor privilege level lower than the current privilege level of the processor. The computing device may load a secure enclave using secure enclave support of the processor. The secure enclave may load an unsandbox and a sandboxed application in a user privilege level of the processor. Other embodiments are described and claimed.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Michael LeMay, Barry E. Huntley, Ravi Sahita
  • Publication number: 20240104915
    Abstract: Machine learning models can process a video and generate outputs such as action segmentation assigning portions of the video to a particular action, or action classification assigning an action class for each frame of the video. Some machine learning models can accurately make predictions for short videos but may not be particularly suited for performing action segmentation for long duration, structured videos. An effective machine learning model may include a hybrid architecture involving a temporal convolutional network and a bi-directional graph neural network. The machine learning model can process long duration structured videos by using a temporal convolutional network as a first pass action segmentation model to generate rich, frame-wise features. The frame-wise features can be converted into a graph having forward edges and backward edges. A graph neural network can process the graph to refine a final fine-grain per-frame action prediction.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Anthony Daniel Rhodes, Byungsu Min, Subarna Tripathi, Giuseppe Raffa, Sovan Biswas
  • Publication number: 20240103810
    Abstract: An apparatus to facilitate supporting vector multiply add with double accumulator access in a graphics environment is disclosed. The apparatus includes a processor comprising processing resources, the processing resources comprising multiplier circuitry to: receive operands for a matrix multiplication operation, wherein the operands comprising two source matrices to be multiplied as part of the matrix multiplication operation; and issue a multiply and add vector (MADV) instruction for the multiplication operation utilizing a double accumulator access output, wherein the MADV instruction to multiply two vectors of the two source matrices in a single floating point (FP) pipeline of the processor.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Jiasheng Chen, Supratim Pal, Changwon Rhee, Hong Jiang, Kevin Hurd, Shuai Mu
  • Publication number: 20240106644
    Abstract: A system and method of enhancing the mitigation of side channel attacks on platform interconnects using endpoint HW based detection, synchronization, and re-keying include generating a set of keys for link encryption based on a high entropy seed, storing the set of keys in a deterministic order in a register, detecting that a re-key programmable threshold is met during link encryption with a device, identifying a synchronization point associated with the device, where the synchronization point indicates the device is ready to switch a current key used for link encryption, and synchronizing a rekeying event with the device.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Aditya Katragada, Geoffrey Strongin, Prakash Iyer, Rajesh Banginwar, Poh Thiam Teoh, Gary Wallichs
  • Publication number: 20240105452
    Abstract: Techniques are provided to form semiconductor devices that include one or more gate cuts having a layer of polymer material at edges of the gate cut. The polymer layer may be provided as a byproduct of the etching process used to form the gate cut recess through the gate structure, and can protect any exposed portions of the source or drain regions from certain subsequent processes. The gate structure may be interrupted between two transistors with a gate cut that extends through an entire thickness of the gate structure and includes a dielectric material to electrically isolate the portions of the gate structure on either side of the gate cut. The edges of the gate cut may be lined with a polymer layer that is also on any exposed portions of the source or drain regions that were exposed during the etching process used to form the gate cut recess.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Reza Bayati, Matthew J. Prince, Alison V. Davis, Chun C. Kuo, Andrew Arnold, Ramy Ghostine, Li Huey Tan
  • Publication number: 20240105453
    Abstract: Techniques are provided herein to form semiconductor devices that include one or more gate cuts having a very high aspect ratio (e.g., an aspect ratio of 5:1 or greater, such as 10:1). In an example, a semiconductor device includes a conductive material that is part of a transistor gate structure around or otherwise on a semiconductor region. The semiconductor region can be, for example, a fin of semiconductor material that extends between a source region and a drain region, or one or more nanowires or nanoribbons of semiconductor material that extend between a source region and a drain region. The gate structure may be interrupted between two transistors with a gate cut that extends through an entire thickness of the gate structure. A particular plasma etching process may be performed to form the gate cut with a very high height-to-width aspect ratio so as to enable densely integrated devices.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Reza Bayati, Matthew J. Prince, Alison V. Davis, Ramy Ghostine, Piyush M. Sinha, Oleg Golonzka, Swapnadip Ghosh, Manish Sharma
  • Publication number: 20240104413
    Abstract: Technologies for a hybrid digital/analog processor for a quantum computer are disclosed. In the illustrative embodiment, a hybrid digital/analog processor may be able to process digital instructions as well as analog instructions. The digital instructions may be, e.g., read from or write to memory or registers, perform an arithmetic operation, perform a branch, etc. The analog instructions may be to, e.g., provide an analog voltage to a particular electrode of a qubit, provide an analog pulse to a qubit, measure a reflection of an analog signal from a qubit, etc. The integration of analog operations in the hybrid digital/analog processor can improve performance by, e.g., lowering latency and lowering power usage.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Todor Mladenov, Sahar Daraeizadeh, Anne Matsuura
  • Publication number: 20240104916
    Abstract: Systems, apparatuses and methods may provide for technology that processes an inference workload in a first subset of layers of a neural network that prevents or inhibits data dependent branch operations, conducts an exit determination as to whether an output of the first subset of layers satisfies one or more exit criteria, and selectively bypasses processing of the output in a second subset of layers of the neural network based on the exit determination. The technology may also speculatively initiate the processing of the output in the second subset of layers while the exit determination is pending. Additionally, when the inference workloads include a plurality of batches, the technology may mask one or more of the plurality of batches from processing in the second subset of layers.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Haim Barad, Barak Hurwitz, Uzi Sarel, Eran Geva, Eli Kfir, Moshe Island
  • Publication number: 20240104744
    Abstract: A mechanism is described for facilitating real-time multi-view detection of objects in multi-camera environments, according to one embodiment. A method of embodiments, as described herein, includes mapping first lines associated with objects to a ground plane; and forming clusters of second lines corresponding to the first lines such that an intersection point in a cluster represents a position of an object on the ground plane.
    Type: Application
    Filed: October 23, 2023
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Qiang Li, Xiaofeng Tong, Yikai Fang, Chen Ling, Wenlong Li
  • Publication number: 20240105655
    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a conductive pad having a first surface and an opposing second surface; a conductive via coupled to the first surface of the conductive pad; a microelectronic component having a conductive contact, the conductive contact of the microelectronic component electrically coupled, by an interconnect, to the second surface of the conductive pad, wherein a material of the interconnect includes nickel or tin; and a liner between the interconnect and the second surface of the conductive pad, and wherein a material of the liner includes nickel, palladium, or gold. In some embodiments, a bottom surface of the liner is curved outward towards the conductive pad. In some embodiments, the liner also may be on side surfaces of the interconnect.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Brandon C. Marin, Kristof Kuwawi Darmawikarta, Srinivas V. Pietambaram, Gang Duan, Suddhasattwa Nad, Jeremy Ecton
  • Publication number: 20240105585
    Abstract: An embodiment of a capacitor in the back-side layers of an IC die may comprise any type of solid-state electrolyte material disposed between electrodes of the capacitor. Another embodiment of a capacitor anywhere in an IC die may include one or more materials selected from the group of indium oxide, indium nitride, gallium oxide, gallium nitride, zinc oxide, zinc nitride, tungsten oxide, tungsten nitride, tin oxide, tin nitride, nickel oxide, nickel nitride, niobium oxide, niobium nitride, cobalt oxide, and cobalt nitride between electrodes of the capacitor. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: September 28, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Abhishek Anil Sharma, Pushkar Ranade, Tahir Ghani, Wilfred Gomes, Sagar Suthram, Anand Murthy
  • Publication number: 20240105589
    Abstract: An IC device includes a metal layer that includes staggered metal lines. The metal lines are in two or more levels along a direction. There may be one or more metal lines in each level. At least some of the metal lines are aligned along the direction so that widths of the metal lines may be maximized for a given total width of the metal layer. The alignment of the metal lines may be achieved through DSA of a diblock copolymer. The metal layer may be connected to vias in two or more levels. The vias may be also connected to another metal layer or a semiconductor device in a FEOL section of the IC device. A via and the metal line connected to the via may be formed through a same recess and deposition process to eliminate interface between the via and metal line.
    Type: Application
    Filed: September 28, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Shao Ming Koh, Patrick Morrow, June Choi, Sukru Yemenicioglu, Nikhil Jasvant Mehta
  • Publication number: 20240105596
    Abstract: IC devices with angled interconnects are disclosed herein. An interconnect, specifically a trench or line interconnect, is referred to as an “angled interconnect” if the interconnect is neither perpendicular nor parallel to any edges of front or back faces of the support structure, or if the interconnect is not parallel or perpendicular to interconnect in another region of an interconnect layer. Angled interconnects may be used to decrease the area of pitch transition regions. Angled interconnects may also be used to decrease the area of pitch offset regions.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Abhishek A. Sharma, Tahir Ghani, Wilfred Gomes, Anand S. Murthy, Shem Ogadhoh, Pushkar Sharad Ranade, Sagar Suthram, Elliot Tan
  • Publication number: 20240105248
    Abstract: An integrated circuit (IC) die includes a substrate and an array of memory cells formed in or on the substrate with a memory cell of the array of memory cells that includes a storage circuit that comprises a hysteretic-oxide material. A ternary content-addressable memory (TCAM) may utilize hysteretic-oxide memory cells. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: September 28, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Abhishek Anil Sharma, Tahir Ghani, Sagar Suthram, Anand Murthy, Wilfred Gomes, Pushkar Ranade
  • Publication number: 20240105677
    Abstract: An integrated circuit device includes a first IC die with a first front surface, a first back surface, and a first side surface along opposed edges of the first front surface and the first back surfaces of the first IC die, a second IC die with a second front surface, a second back surface, and a second side surface along opposed edges of the second front surface and second back surface of the second IC die, a substrate coupled to the first side surface of the first IC die and the second side surface of the second IC die, and fill material between one of the first front surface and the first back surface of the first IC die and one of the second front surface and second back surface of the second IC die. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: September 28, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Abhishek Anil Sharma, Tahir Ghani, Sagar Suthram, Anand Murthy, Wilfred Gomes, Pushkar Ranade
  • Publication number: 20240107078
    Abstract: Methods, articles, and systems of image processing comprise obtaining image data of frames of a video sequence. The method also includes determining multiple reference frames of a current frame in the video sequence. The multiple reference frames each have at least one motion compensated (MC) block of image data. Also, the method then includes generating a weight that factors noise, distortion variance, and dispersion distribution between the same MC block position and the current block. Thereafter, the method includes generating denoised filtered image data comprising applying one of the weights to the image data of the motion compensated (MC) block.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Minzhi Sun, Ximin Zhang, Yi-jen Chiu
  • Publication number: 20240105508
    Abstract: Disclosed herein are integrated circuit (IC) devices with contacts using nitridized molybdenum. For example, a contact arrangement for an IC device may include a semiconductor material and a contact extending into a portion of the semiconductor material. The contact may include molybdenum. The molybdenum may be in a first layer and a second layer, where the second layer may further include nitrogen. The first layer may have a thickness between about 5 nanometers and 16 nanometers, and the second layer may have a thickness between about 0.5 nanometers to 2.5 nanometers. The contact may further include a fill material (e.g., an electrically conductive material) and the second layer may be in contact with the fill material. The molybdenum may have a low resistance, and thus may improve the electrical performance of the contact. The nitridized molybdenum may prevent oxidation during the fabrication of the contact.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Jitendra Kumar Jha, Justin Mueller, Nazila Haratipour, Gilbert W. Dewey, Chi-Hing Choi, Jack T. Kavalieros, Siddharth Chouksey, Nancy Zelick, Jean-Philippe Turmaud, I-Cheng Tung, Blake Bluestein
  • Publication number: 20240105852
    Abstract: Top-gate thin film transistor (TFTs) structures. Thin film transistors when in the top-gate configuration suffer from contact resistance. An example TFT includes a semiconductor layer doped with one or more dopant elements. A gate dielectric layer is on the semiconductor layer, and a gate electrode is on the gate dielectric layer. The semiconductor layer is doped with the one or more dopant elements beneath the gate dielectric layer. The TFT may further include one or more contacts and/or one or more gate spacers, and the semiconductor layer may further be doped with the one or more dopant elements beneath the contact(s) and/or gate spacer(s).
    Type: Application
    Filed: December 8, 2023
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Abhishek A. Sharma, Sean T. Ma, Van H. Le, Jack T. Kavalieros, Gilbert Dewey
  • Publication number: 20240105718
    Abstract: Methods for fabricating an integrated circuit (IC) device with a protection liner between doped semiconductor regions are provided. An example IC device includes a channel material having a first face and a second face opposite the first face, a first doped region and a second doped region in the channel material, extending from the second face towards the first face by a first distance; and an insulator structure in a portion of the channel material between the first and second doped regions, the insulator structure extending from the second face towards the first face by a second distance greater than the first distance. The insulator structure includes a first portion between the second face and the first distance and a second portion between first distance and the second distance. The insulator structure includes a liner material on sidewalls of the first portion but absent on sidewalls of the second portion.
    Type: Application
    Filed: September 22, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Tao Chu, Guowei Xu, Minwoo Jang, Yanbin Luo, Feng Zhang, Ting-Hsiang Hung, Chia-Ching Lin
  • Publication number: 20240105700
    Abstract: An embodiment of an integrated circuit (IC) device may include a plurality of layers of wide bandgap (WBG)-based circuitry and a plurality of layers of silicon (Si)-based circuitry monolithically bonded to the plurality of layers of WBG-based circuitry, with one or more electrical connections between respective WBG-based circuits in the plurality of layers of WBG-based circuitry and Si-based circuits in the plurality of layers of Si-based circuitry. In some embodiments, a wafer-scale WBG-based IC is hybrid bonded or layer transfer bonded to a wafer-scale Si-based IC. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: September 28, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Abhishek Anil Sharma, Tahir Ghani, Anand Murthy, Wilfred Gomes, Sagar Suthram, Pushkar Ranade
  • Publication number: 20240105854
    Abstract: Transistor structures may include a metal oxide contact buffer between a portion of a channel material and source or drain contact metallization. The contact buffer may improve control of transistor channel length by limiting reaction between contact metallization and the channel material. The channel material may be of a first composition and the contact buffer may be of a second composition.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Gilbert Dewey, Abhishek Sharma, Van Le, Jack Kavalieros, Shriram Shivaraman, Seung Hoon Sung, Tahir Ghani, Arnab Sen Gupta, Nazila Haratipour, Justin Weber
  • Publication number: 20240105860
    Abstract: An integrated circuit (IC) die includes a plurality of varactor devices, where at least one varactor of the plurality of varactor devices comprises a first electrode, a second electrode, and a multi-layer stack of ferroelectric material (e.g., ferroelectric variable capacitance material) disposed between the first and second electrodes. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: September 28, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Abhishek Anil Sharma, Tahir Ghani, WIlfred Gomes, Anand Murthy, Sagar Suthram, Pushkar Ranade
  • Patent number: 11940797
    Abstract: Techniques for navigating semi-autonomous mobile robots are described. A semi-autonomous mobile robot moves within an environment to complete a task. A navigation server communicates with the robot and provides the robot information. The robot includes a navigation map of the environment, interaction information, and a security level. To complete the task, the robot transmits a route reservation request to the navigation server, the route reservation request including a priority for the task, a timeslot, and a route. The navigation server grants the route reservation if the task priority is higher than the task priorities of conflicting route reservation requests from other robots. As the robot moves within the environment, the robot detects an object and attempts to classify the detected object as belonging to an object category. The robot retrieves an interaction profile for the object, and interacts with the object according to the retrieved interaction profile.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Lior Storfer, Tamara Gaidar, Ido Lapidot
  • Patent number: 11943207
    Abstract: Methods, systems, and use cases for one-touch inline cryptographic data security are discussed, including an edge computing device with a network communications circuitry (NCC), an enhanced DMA engine coupled to a memory device and including a cryptographic engine, and processing circuitry configured to perform a secure exchange with a second edge computing device to negotiate a shared symmetric encryption key, based on a request for data. An inline encryption command for communication to the enhanced DMA engine is generated. The inline encryption command includes a first address associated with a storage location storing the data, a second address associated with a memory location in the memory device, and the shared symmetric encryption key. The data is retrieved from the storage location using the first address, the data is encrypted using the shared symmetric encryption key, and the encrypted data is stored in the memory location using the second address.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Kshitij Arun Doshi, Uzair Qureshi, Lokpraveen Mosur, Patrick Fleming, Stephen Doyle, Brian Andrew Keating, Ned M. Smith
  • Patent number: 11940888
    Abstract: A data processing system includes technology for detecting and tolerating faults. The data processing system comprises an electronic control unit (ECU) with a processing core and a fault-tolerant elliptic curve digital signature algorithm (ECDSA) engine. The fault-tolerant ECDSA engine comprises multiple verification state machines (VSMs). The data processing system also comprises nonvolatile storage in communication with the processing core and ECU software in the nonvolatile storage. The ECU software, when executed, enables the data processing system to operate as a node in a distributed data processing system, including receiving digitally signed messages from other nodes in the distributed data processing system. The ECU further comprises a known-answer built-in self-test unit (KA-BISTU). Also, the ECU software comprises fault-tolerant ECDSA engine (FTEE) management software which, when executed by the processing core, utilizes the KA-BISTU to periodically test the fault-tolerant ECDSA engine for faults.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: March 26, 2024
    Assignee: INTEL CORPORATION
    Inventors: Santosh Ghosh, Marcio Juliato, Manoj R. Sastry
  • Patent number: 11940855
    Abstract: Three components are used to adjust the CPU peak power based on the USB TYPE-C device states. These components include operating system (OS) Peak Power Manager, USB TYPE-C Connector Manager, and USB TYPE-C Protocol Device Driver. The USB TYPE-C Connector Manager sends a synchronous request to the OS Peak Power Manager when a USB TYPE-C power sink device is attached or detached, and the USB TYPE-C Protocol Device Driver sends a synchronous request to the Peak Power Manager when the power sink transitions device state. The Peak Power Manager takes power budget from the CPU when the USB TYPE-C connector is attached to a power sink and is active (e.g., high power device state), and gives back the power budget to the CPU for performance when the USB TYPE-C connector is either detached or the attached and power sink device is idle (lowest device state).
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Ashwin Umapathy, Chee Lim Nge, Timothy Smith, Dmitriy Berchanskiy, Vinay Raghav
  • Patent number: 11941394
    Abstract: A processor includes a decode unit to decode an instruction indicating a source packed data operand having source data elements and indicating a destination storage location. Each of the source data elements has a source data element value and a source data element position. An execution unit, in response to the instruction, stores a result packed data operand having result data elements each having a result data element value and a result data element position. Each result data element value is one of: (1) equal to a source data element position of a source data element, closest to one end of the source operand, having a source data element value equal to the result data element position of the result data element; and (2) a replacement value, when no source data element has a source data element value equal to the result data element position of the result data element.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Christopher J. Hughes, Jong Soo Park
  • Patent number: 11940907
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed for sparse tensor storage for neural network accelerators. An example apparatus includes sparsity map generating circuitry to generate a sparsity map corresponding to a tensor, the sparsity map to indicate whether a data point of the tensor is zero, static storage controlling circuitry to divide the tensor into one or more storage elements, and a compressor to perform a first compression of the one or more storage elements to generate one or more compressed storage elements, the first compression to remove zero points of the one or more storage elements based on the sparsity map and perform a second compression of the one or more compressed storage elements, the second compression to store the one or more compressed storage elements contiguously in memory.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: March 26, 2024
    Assignee: INTEL CORPORATION
    Inventors: Martin-Thomas Grymel, David Bernard, Niall Hanrahan, Martin Power, Kevin Brady, Gary Baugh, Cormac Brick
  • Patent number: 11940944
    Abstract: A computer platform is disclosed. The computer platform comprises a non-volatile memory to store fuse override data; and a system on chip (SOC), coupled to the non-volatile memory, including a fuse memory to store fuse data and security micro-controller to receive the fuse override data and perform a fuse override to overwrite the fuse data stored in the fuse memory with the fuse override data.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Bharat Pillilli, Saravana Priya Ramanathan, Reshma Lal
  • Patent number: 11941169
    Abstract: One embodiment of a virtual reality apparatus comprises: a graphics processing engine comprising a plurality of graphics processing stages, the graphics processing engine to render a plurality of image frames for left and right displays of a head mounted display (HMD); and foveation control hardware logic to independently control two or more of the plurality of graphics processing stages based on feedback received from an eye tracking module of the HMD, the feedback indicating a foveated region selected based on a current or anticipated direction of a user's gaze, the foveation control hardware logic to cause the two or more of the graphics processing stages to process the foveated region differently than other regions of the image frames.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Ingo Wald, Brent E. Insko, Prasoonkumar Surti, Adam T. Lake, Peter L. Doyle, Daniel Pohl
  • Patent number: 11941181
    Abstract: A mechanism to provide visual feedback regarding computing system command gestures. An embodiment of an apparatus includes a sensing element to sense a presence or movement of a user of the apparatus, a processor, wherein operation of the processor includes interpretation of command gestures of a user to provide input to the apparatus; and a display screen, the apparatus to display one or more icons on the display screen, the one or more icons being related to the operation of the apparatus. The apparatus is to display visual feedback for a user of the apparatus, visual feedback including a representation of one or both hands of the user while the one or both hands are within a sensing area for the sensing element.
    Type: Grant
    Filed: June 9, 2022
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Rajiv Mongia, Achintya Bhowmik, Mark Yahiro, Dana Krieger, Ed Mangum, Diana Povieng
  • Patent number: 11941391
    Abstract: A microcode (uCode) hot-upgrade method for bare metal cloud deployment and associated apparatus. The uCode hot-upgrade method applies a uCode patch to a firmware storage device (e.g., BIOS SPI flash) through an out-of-band controller (e.g., baseboard management controller (BMC)). In conjunction with receiving a uCode patch, a uCode upgrade interrupt service is triggered to upgrade uCode for one or more CPUs in a bare-metal cloud platform during runtime of a tenant host operating system (OS) using an out-of-bound process. This innovation enables cloud service providers to deploy uCode hot-patches to bare metal servers for persistent storage and live-patch without touching the tenant operating system environment.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Mohan J. Kumar, Sarathy Jayakumar, Chuan Song, Ruixia Li, Xiaojin Yuan, Haiyue Wang, Chong Han
  • Patent number: 11940287
    Abstract: Provided is a device and a method for route planning. The route planning device (100) may include a data interface (128) coupled to a road and traffic data source (160); a user interface (170) configured to display a map and receive a route planning request from a user, the route planning request including a line of interest on the map; a processor (110) coupled to the data interface (128) and the user interface (170). The processor (110) may be configured to identify the line of interest in response to the route planning request; acquire, via the data interface (128), road and traffic information associated with the line of interest from the road and traffic data source (160); and calculate, based on the acquired road and traffic information, a navigation route that matches or corresponds to the line of interest and meets or satisfies predefined road and traffic constraints.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: March 26, 2024
    Assignee: INTEL CORPORATION
    Inventors: Yuqing Hou, Xiaolong Liu, Ignacio J. Alvarez, Xiangbin Wu
  • Patent number: 11943340
    Abstract: In some examples, for process-to-process communication, such as in function linking, a virtual channel can be provisioned to provide virtual machine to virtual machine communications. In response to a transmit request from a source virtual machine, the virtual channel can cause a data copy from a source buffer associated with the source virtual machine without decryption or encryption. The virtual channel provisions a key identifier for the copied data. The destination virtual machine can receive an indication data is available and can cause the data to be decrypted using a key accessed using the key identifier and source address of the copied data. In addition, the data can be encrypted using a second, different key for storage in a destination buffer associated with the destination virtual machine. In some examples, the key identifier and source address is managed by the virtual channel and is not visible to virtual machine or hypervisor.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Bo Cui, Cunming Liang, Jr-Shian Tsai, Ping Yu, Xiaobing Qian, Xuekun Hu, Lin Luo, Shravan Nagraj, Xiaowen Zhang, Mesut A. Ergin, Tsung-Yuan C. Tai, Andrew J. Herdrich
  • Patent number: 11941437
    Abstract: Systems, apparatuses and methods provide technology for batch-level parallelism, including partitioning a graph into a plurality of clusters comprising batched clusters that support batched data and non-batched clusters that fail to support batched data, establishing an execution queue for execution of the plurality of clusters based on cluster dependencies, and scheduling inference execution of the plurality of clusters in the execution queue based on batch size. The technology can include identifying nodes of the graph as batched or non-batched, generating a batched cluster comprising a plurality of batched nodes based on a relationship between two or more of the batched nodes, and generating a non-batched cluster comprising a plurality of non-batched nodes based on a relationship between two or more of the non-batched nodes. The technology can also include generating a set of cluster dependencies, where the cluster dependencies are used to determine an execution order for the clusters.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Mustafa Cavus, Yamini Nimmagadda
  • Patent number: 11941400
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed for intentional programming for heterogeneous systems. An example non-transitory computer readable storage medium includes instructions that, when executed, cause processor circuitry to at least identify a first code block having a first algorithmic purpose based on a second code block having a second algorithmic purpose, the second algorithmic purpose corresponding to the first algorithmic purpose, translate the first code block into executable domain specific language code, and output the executable domain specific language code.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Adam Herr, Derek Gerstmann, Justin Gottschlich, Mikael Bourges-Sevenier, Sridhar Sharma
  • Patent number: 11941409
    Abstract: Systems, methods, and apparatuses relating to circuitry to implement a multiprocessor boot flow for a faster boot process are described. In one embodiment, a system includes a hardware processor comprising a processor core, a cache coupled to the hardware processor, storage for hardware initialization code, and a controller circuit to initialize a portion of the cache as memory for usage by the hardware initialization code before beginning execution of the hardware initialization code after a power on of the system.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Subrata Banik, Asad Azam, Jenny M. Pelner, Vincent Zimmer, Rajaram Regupathy
  • Patent number: 11941395
    Abstract: Systems, methods, and apparatuses relating to 16-bit floating-point matrix dot product instructions are described.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Alexander F. Heinecke, Robert Valentine, Mark J. Charney, Menachem Adelman, Christopher J. Hughes, Evangelos Georganas, Zeev Sperber, Amit Gradstein, Simon Rubanovich
  • Patent number: 11941534
    Abstract: A system is provided that includes a bit vector-based distance counter circuitry configured to generate one or more bit vectors encoded with information about potential matches and edits between a read and a reference genome, wherein the read comprises an encoding of a fragment of deoxyribonucleic acid (DNA) encoded via bases G, A, T, C. The system further includes a bit vector-based traceback circuitry configured to divide the reference genome into one or more windows and to use the plurality of bit vectors to generate a traceback output for each of the one or more windows, wherein the traceback output comprises a match, a substitution, an insert, a delete, or a combination thereof, between the read and the one or more windows.
    Type: Grant
    Filed: December 28, 2019
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Gurpreet Singh Kalsi, Anant V. Nori, Christopher Justin Hughes, Sreenivas Subramoney, Damla Senol
  • Patent number: 11943701
    Abstract: An access point (AP) station (STA) (AP STA) that is part of an AP multi-link device (MLD) may be configured as a reporting AP may encode a BSS Transition Management (BTM) request frame for transmission to one or more associated non-AP stations (STAs). The BTM request frame may include a neighbor report element encoded to include information about one or more neighbor APs. The neighbor report element may indicate whether the one or more neighbor APs identified in the neighbor report element are part of an AP MLD and, when a neighbor AP is indicated to be part of an AP MLD whether the reporting AP is part of the indicated AP MLD. The AP STA may decode a reassociation frame from one of the non-AP STAs for transition from one of the AP STAs of the AP MLD to one of the neighbor APs.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Laurent Cariou, Po-Kai Huang, Necati Canpolat, Carlos Cordeiro, Daniel F. Bravo, Arik Klein, Danny Ben-Ari, Robert J. Stacey
  • Patent number: 11941457
    Abstract: An apparatus to facilitate disaggregated computing for a distributed confidential computing environment is disclosed. The apparatus includes a source remote direct memory access (RDMA) network interface controller (RNIC); a queue to store a data entry corresponding to an RDMA request between the source RNIC and a sink RNIC; a data buffer to store data for an RDMA transfer corresponding to the RDMA request, the RDMA transfer between the source RNIC and the sink RNIC; and a trusted execution environment (TEE) comprising an authentication tag controller to: initialize a first authentication tag calculated using a first key known between a source consumer generating the RDMA request and the source RNIC; associate the first authentication tag with the data entry as integrity verification; initialize a second authentication tag calculated using a second key; and associate the second authentication tag with the data buffer as integrity verification for the data buffer.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: March 26, 2024
    Assignee: INTEL CORPORATION
    Inventors: Reshma Lal, Pradeep Pappachan, Luis Kida, Soham Jayesh Desai, Sujoy Sen, Selvakumar Panneer, Robert Sharp
  • Patent number: 11942516
    Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack; a first gate above the quantum well stack, wherein the first gate includes a first gate metal and a first gate dielectric; and a second gate above the quantum well stack, wherein the second gate includes a second gate metal and a second gate dielectric, and the first gate is at least partially between a portion of the second gate and the quantum well stack.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Nicole K. Thomas, Ravi Pillarisetty, Kanwaljit Singh, Hubert C. George, David J. Michalak, Lester Lampert, Zachary R. Yoscovits, Roman Caudillo, Jeanette M. Roberts, James S. Clarke
  • Patent number: 11943122
    Abstract: Disclosed embodiments are related to Management Data Analytics (MDA) relation with Self-Organizing Network (SON) functions and coverage issues analysis use case. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: October 2, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Yizhi Yao, Joey Chou
  • Patent number: 11942406
    Abstract: A semiconductor package may include a semiconductor package first side, an embedded bridge interconnect, a first via, and a second via. The bridge interconnect may include a bridge interconnect first side with a conductive pad and a bridge interconnect second side. The distance between the bridge interconnect first side and the semiconductor package first side may be less than a distance between the bridge interconnect second side and the semiconductor package first side. The first and second vias may each include a first end that is narrower than s second end. The semiconductor package first side may be closer to the first end of the first via than the second end of the first via, and closer to the second end of the second via than the first end of the second via. The first side of the semiconductor package may be configured to electrically couple to a die.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Kyu Oh Lee, Dilan Seneviratne, Ravindranadh T Eluri
  • Patent number: 11943022
    Abstract: Systems and methods of beamforming and improving mmWave communications for drones are described. Multiple RF chains are used to adapt the main beam to track changes without the use of pilot signals. To reduce interference, interfering signal power is eliminated by optimizing a non-Gaussian measure to extract the interferers. The AoA of signals from a target drone on neighbouring drones and location of the neighbouring drones and base stations are used to independently corroborate the location reported by the target drone. The base station provides additional synchronization signals below 6 GHz and restricts the search/measurement space in the vertical direction. The inherent sparse structure above 6 GHz is exploited by applying different beamformers on a sounding signal and estimating the AoA and impulse response. Variations of fully digital and hybrid beamforming architectures for multi-cell DL sync and CRS measurement are described.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Venkatesan Nallampatti Ekambaram, Yang-Seok Choi, Junyoung Nam, Feng Xue, Shu-ping Yeh, Hosein Nikopour, Shilpa Talwar, Jan Schreck, Nageen Himayat, Sagar Dhakal
  • Patent number: 11942393
    Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a substrate that includes a first region to be coupled with a die, and a second region separate and distinct from the first region that has a lower thermal conductivity than the first region, where the second region is to thermally insulate the first region when the die is coupled to the first region. The thermal insulation of the second region may be used during a TCB process to increase the quality of each of the interconnects of the die by promoting a higher temperature at the connection points to facilitate full melting of solder.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Wei Li, Edvin Cetegen, Nicholas S. Haehn, Mitul Modi, Nicholas Neal
  • Patent number: 11942412
    Abstract: To address the issue of shrinking volume that can be allocated for electrical components, a system can use an interposer with a flexible portion. A first portion of the interposer can electrically connect to a top side of a motherboard. A flexible portion of the interposer, adjacent to the first portion, can wrap around an edge of the motherboard. A peripheral portion of the interposer, adjacent to the flexible portion, can electrically connect to a bottom side of the motherboard. The peripheral portion can be flexible or rigid. The interposer can define a cavity that extends through the first portion of the interposer. A chip package can electrically connect to the first portion of the interposer. The chip package can be coupled to at least one electrical component that extends into the cavity when the chip package is connected to the interposer.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Bok Eng Cheah, Jackson Chung Peng Kong, Min Suet Lim, Tin Poay Chuah