Abstract: A conductive strap configured to attach to a circuit board containing a component sensitive to electronmagnetic interference (EMI) and to slidably contact an enclosure having a conductive internal surface can reduce or eliminate EMI in an electronic device. The strap is positioned on the circuit board to shield the sensitive component from EMI. Slidable contact between the shielding strap and the enclosure internal surface renders the strap suitable for almost any enclosure configuration without any design modification.

Abstract: A capacitor structure for dissipating heat, for example, generated by high ripple currents. The capacitor includes an outer casing of substantially annular cross section comprising an outer side wall, a bottom and an interior tube integrally formed from a substantially continuous piece of thermally conductive material. A capacitor winding of substantially annular cross section is disposed within the outer casing which is sealed at a top. The capacitor winding may be in close thermal contact with the inner tube, the bottom and the outer side wall to improve heat dissipation.

Abstract: Two flat packages (110, 111) are arranged to achieve a mirrored footprint by employing guides (100), which are positioned within a mounting aperature a printed circuit board. The flat packages include leads (120, 121) which extend from an edge of the flat package. A semiconductor chip is encapsulated by the flat packages.

Abstract: This interface connection through a hole (2) in a high-temperature-resistant and vacuum-proof insulating part (1), particularly of ceramic, glass, or a single crystal, consists of a metallic lead (4, 17) inserted into the hole (2) and having a coefficient of thermal expansion less than that of the insulating part (1), wherein at least one end of the lead, if it is flush with at least one surface of the insulating part, is covered with active brazing material which high-vacuum-seals it to the insulating part, or, if it projects beyond at least one surface of the insulating part, is high-vacuum-sealed to the insulating part by means of ring-shaped active brazing material (5'), since in the liquid phase, the active brazing material moves into the gap between the wall of the hole (2) and the lead (4, 17) due to capillary action.

Abstract: The invention provides a multilayer ceramic chip capacitor which satisfies X7R property or a temperature response of its capacitance and shows a minimal change of capacitance with time under a DC electric field, a long accelerated life of insulation resistance (IR) and good DC bias performance and also provides a multilayer ceramic chip capacitor which is resistant to dielectric breakdown in addition to the above advantages. In a first form of the invention, dielectric layers contain BaTiO.sub.3 as a major component and MgO, Y.sub.2 O.sub.3, at least one of BaO and CaO, and SiO.sub.2 as minor components in a specific proportion. In a second form, the dielectric layers further contain MnO and at least one of V.sub.2 O.sub.5 and MoO.sub.3 as minor components in a specific proportion. In the first form, the dielectric layer has a mean grain size of up to 0.45 .mu.

Abstract: In its closed configuration, a portable workstation housing resembles a closed attache case. A lid, having opposed sidewalls and a top, and a planar base, having little or no peripheral lip, are separated by a narrow spine. The lid pivots through a range of up to 180 degrees relative to the base and upper portion of the spine. A lid support element is pivotable between a first position flush to the housing and a second position perpendicular to the lid which supports the weight of the lid when fully open. The base supports a portable computer by means of releasable fasteners. A fastener having a first sex of VELCRO is attached by adhesive to the bottom of the computer and a fastener having a second sex of VELCRO is attached to the base, allowing the computer to be held in place for use and transit. Similarly, a printer, disk drives, modems, ac-converters and other peripherals are held in place. A printer is typically carried by the lid.

Abstract: An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the optical sub-assemblies and are substantially smaller than the hole. A soldering bridge comprising several separate tabs equally spaced about the land and which project from the land into the hole and are very flexible in relation to the lead so that the lead can be placed in any radial position within the hole, but regardless of the position of the lead within the hole the projections of the soldering bridge project close enough to the lead so that during wave soldering a joint of desired configuration is produced. The soldering bridge can be integral with the land so that the bridge helps connect the solder to the land allowing the land to be smaller and thus providing for closer spacing between connection holes.

Abstract: A fused surface mounting type solid electrolytic capacitor is provided which includes a capacitor element, a safety fuse wire, and a package enclosing the capacitor element together with the fuse wire. The capacitor element includes a capacitor chip and an anode wire projecting downwardly from the chip toward the bottom surface of the package. The safety fuse wire is electrically connected to the chip and bent to extend downwardly toward the bottom surface of the package. An anode-side terminal electrode is formed on the package to extend from a first side surface of the package to the bottom surface in electrical conduction with the anode wire, while a cathode-side terminal electrode is formed on the package to extend from a second side surface of the package to the bottom surface in electrical conduction with the safety fuse wire.

Abstract: An electrode for an energy storage device uses a protonated polymer that is imbedded with an electroactive metal and coated onto activated carbon. Protonated poly(4-vinylpyridine) is coated onto particles of activated carbon that have high surface area, and the coating is then imbedded with a metal that exhibits electroactive behavior. In one embodiment, ruthenium is plated onto the poly(4-vinylpyridine) to create the electrode. Optionally, a coating of an ionically conductive negatively charged polymer is applied over the ruthenium-imbedded coating. The improved electrode is used to make a capacitor.

Abstract: Disclosed is a monolithic ceramic capacitor comprising dielectric ceramic layers and inner electrodes wherein each dielectric ceramic layer comprises an essential component having a compositional formula of (1-.alpha.-.beta.)(BaO).sub.m TiO.sub.2 +.alpha.Y.sub.2 O.sub.3 +.beta.(CO.sub.1-x Ni.sub.x)O (where the alkali metal content of BaTiO.sub.3 is not more than 0.03% by weight, 0.0025.ltoreq..alpha..ltoreq.0.03, 0.0025.ltoreq..beta..ltoreq.0.06, 0<.beta./.alpha..ltoreq.6, 0<x.ltoreq.1, 1.000.ltoreq.m.ltoreq.1.035), and a side component consisting of, relative to 100 mols of the essential component, from 0.5 to 3.0 mols of MgO and from 0.05 to 2.0 mols of MnO, and from 0.2 to 3.0 parts by weight 100 parts by weight of the sum of the main component and the side component, of oxide glass of Li.sub.2 O--RO--(Ti,Si)O.sub.2 (where R indicates at least one of Ba, Sr, Ca and Mg). Also disclosed is such a monolithic ceramic capacitor where the Co is replaced by Zn and x is less than 1.

Abstract: A high energy coaxial cable is disclosed which is flexible to the extent of allowing a bend radius as short as 11 1/2 inches. The cable will conduct up to 500 kiloamperes and is reinforced to resist the high magnetic forces within the cable caused by the high current conducted. The cable is therefore useful in coupling high current between parts which experience relative movement such as a stationary power supply and a recoiling gun breech.

Abstract: An EMI seal or gasket blocks electromagnetic radiation between electrically conductive bodies and encompasses an area using a number of adjacent segments, each generally formed as an elongated seal with a resilient core. An electrically conductive surface bears against the conductive bodies and extends at least partway around the respective segment. The segments are attached to one another along lengthwise seams, preferably using conductive tape on one of the opposite sides of the seal. The conductive surface is preferably provided by a metallized fabric affixed to a resilient foamed polymer core, which can be molded in the fabric or otherwise formed or cut and attached, e.g., adhesively. The conductive fabric or other surface material extending substantially around the segments provides more conducting paths across the gap between the conductive bodies than a non-segmented seal of comparable size, thereby improving shielding efficiency.

Abstract: A chip-formed solid electrolytic capacitor having a structure wherein a projecting anode lead is not provided for an anode member. The solid electrolytic capacitor is fabricated by the following manner: First, an electrically insulating resin such as a fluororesin is impregnated into an end face of a porous electrode member to form an insulating resin impregnated portion, and an electrode lead member is bonded to the anode member at the insulating resin impregnated portion. An anodic oxidation film, a solid electrolyte layer and a cathode layer successively are formed on the anode member. Then, an electrically insulating outer package is applied so that the cathode layer on a face of the anode member opposing to the face on which the electrode lead member is mounted is exposed.

Abstract: A thin-film bypass capacitor is fabricated by forming a plurality of through holes through the thickness of a nonconductive base substrate and filling the through holes with a conductive material to form ground vias and power vias. A sequence of back side metalization layers are applied to the back side surface of the base substrate. A sequence of bottom contact layers are applied to the front side surface of the base substrate. A bottom contact power terminal is formed in the bottom contact layer and is electrically isolated from remaining portions of the bottom contact layers by insulating plugs. A bottom contact metalization layer is applied to the surface of the bottom contact layers and the insulating plugs. A dielectric layer is formed on the surface of the bottom contact metalization layer. A ground metalization via and a power metalization via are formed at the surface of the dielectric layer.

Abstract: A conductive insert for protecting an externally mounted microelectronic device is disclosed. The conductive insert is designed to prevent ESD (Electrostatic Discharge) or RFI (Radio Frequency Interference) destruction or inoperability of the microelectronic device. The conductive insert includes a first exterior surface and a second interior surface. The second interior surface has a conductor material applied thereon for providing ESD or RFI protection to the externally mounted electronic device. To protect the externally mounted microelectronic device, the conductive insert mounts within a mounting plate for covering the externally mounted electronic device. Instead of having a conductive material applied to the interior surface, the conductive insert may be manufactured from a conductive material initially.

Abstract: There is provided a component for use in electronic packaging. The component is a composite having a graphite matrix which is infiltrated with a metal or a metal alloy and the external surfaces of the composite then coated with a metallic layer to provide environmental and mechanical protection. The packaging components are lightweight, have a coefficient of thermal expansion close to that of a silicon based integrated circuit device and further, have a high coefficient of thermal conductivity.

Abstract: Conductive thermoplastic adhesive masses are formed on conductor lines on a substrate. A chip has an integrated circuit, first and second chip surfaces, and conductor bumps connected to the integrated circuit and protruded from the first chip surface. The conductor bumps are glued to the conductor lines by the conductive thermoplastic adhesive masses. A thermoplastic adhesive layer is formed on the second chip surface. A sealing thermoplastic adhesive mass is formed on the substrate. A sealing cap has an under end surface, an internal wall surface, and an internal upper surface. The internal wall and upper surfaces define a hole which receives the chip with the internal upper surface glued to the second chip surface by the thermoplastic adhesive layer and with the under end surface glued to the substrate by the sealing thermoplastic adhesive mass.

Abstract: A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a center opening and a metal attachment ring for attaching a heat sink to either the top or bottom thereof with solder. A casing is further formed on the substrate outwardly of the aperture and the heat sink mounted thereacross, the casing being comprised of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted to the heat sink secured therein.

Abstract: An EMI gasket blocks electromagnetic radiation between electrically conductive bodies and encompasses an area using a number of adjacent segments, each generally formed as a resilient core section. An electrically conductive surface material bears against the conductive bodies and extends over the segments, the surface material preferably being formed of a metallized polymer sheet. The polymer sheet is coupled through between the opposite faces of the gasket along lengthwise seams where either the sheet is depressed into the seam or coupled by a conductive adhesive, such that the opposite faces of the gasket are electrically coupled between the segments. The conductive material extending through the gasket to couple the opposite faces provides conducting paths that improve shielding efficiency. The seal can be die cut, including cutting through the width of one or more segments, and remains intact, providing many of the benefits of both wide seals or gaskets and elongated narrow seals.

Abstract: An electrode material for an electrochemical capacitor and electrochemical capacitors utilizing the electrode material. The electrode material comprises electrically conductive carbon, a soluble salt, a non-aqueous liquid solvent, and a gel-former. Such a solid electrode material is especially well adapted for use in multi-layer capacitors in which such components can be made very thin, thereby providing a very low resistance for the device and permitting rapid discharge of the capacitor.