Abstract: A wirebondless module package and method of fabrication including a molded preform of porous SiC with a cavity having therein an AlN substrate defining a plurality of pockets. The preform being infiltrated with Al and the Al being deposited in each of the pockets. A semiconductor die mounted on the Al in one of the pockets. A dielectric layer covering the Al and defining openings therethrough positioned to expose the aluminum and a connection to the die. A conductive material positioned on the dielectric layer in contact with the die and the Al so as to define terminals and interconnections between the die and the terminals.

Abstract: An RF shield for use on tightly packed printed circuit boards has a normally-closed lid that can be opened to provide repair access to shielded components and then reclosed. The shield is a five-sided metal can having a top surface (12) with a lid defined on one edge by a fold line (20) and on the other three edges by partial shear lines (22, 24, 26) through the thickness of the metal top surface. The shear lines define frangible connections between the lid and top surface (18) that can be severed to allow the lid to open. The fold line serves as a hinge about which the lid can pivot for opening. Upon closing the lid can be spot-soldered to hold it shut.

Abstract: A metallized film capacitor in which the metallization is made as thin as possible in order to increase the dielectric strength of the film. In the industry, typical metallization thicknesses range from approximately 1-4 ohms/sq, however, the present invention employs thicknesses which range from 5-300 ohms/sq. And, depending on which thickness is used, the effective dielectric strength of the film can be substantially increased. Additionally, the capacitor or various components thereof are exposed to a gas plasma for further increasing the dielectric breakdown voltage.

Abstract: A multi-layer, flexible printed circuit device having a relatively rigid electronic component mounting portion and a relatively pliable connection wiring portion. The electronic component mounting portion comprises multiple layers of bases including at least one rigid base, and circuit pattern layers. The pliable connection wiring portion is formed by extending pliable bases and circuit pattern layers at one end. The rigidity of the electronic component mounting portion may be maintained by means of the rigid base or bases comprising a thick panel made of the same material as the pliable bases. Alternatively, the copper films of the circuit pattern layers may be made relatively thick or a base material with high rigidity may be used.

Abstract: A motherboard assembly which has an integrated circuit socket that can be mated with either a single integrated circuit package or a multiple integrated circuit package module. The motherboard has a socket connector which can receive the external pins of an integrated circuit package. The motherboard also has an auxiliary connector that can mate with a corresponding connector-mounted to a daughterboard. Mounted to the daughterboard are a first integrated circuit package and a second integrated circuit package. Each package may contain a multi-processing microprocessor. The first integrated circuit package has a plurality of pins that mate with the socket connector. The daughterboard can be coupled to the motherboard by pressing the external pins of the first integrated circuit package into the socket connector and mating the auxiliary connectors. The present invention allows a plurality of processors to be plugged into a single socket without occupying a significant amount of space on the motherboard.

Abstract: A metallized film capacitor in which the metallization is made as thin as possible in order to increase the dielectric strength of the film. In the industry, typical metallization thicknesses range from approximately 1-4 ohms/sq, however, the present invention employs thicknesses which range from 5-300 ohms/sq. And, depending on which thickness is used, the effective dielectric strength of the film can be substantially increased.

Abstract: A system for packaging circuit components is disclosed. The system includes a substrate having a plurality of openings to accommodate mounting various circuit components and the circuit components mounted therein. The substrate has first, second, third and fourth contacts providing mechanical and electrical connection to the various components. An opening is provided for accommodating a first auxiliary component such as a battery wherein the battery terminals attach to the first and second contacts. Another opening is provided in the substrate to accommodate a second auxiliary component such as a crystal resonator having leads which attach to the third and fourth contacts. The substrate preferably has another opening for accommodating an integrated circuit chip package, the chip package having conventional leads for mounting to a circuit board and terminals for connecting to the substrate contacts.

Abstract: A capacitor element for a solid electrolytic capacitor is provided which comprises a sintered chip of metal powder, the chip having a first end and a second end opposite to the first end. The chip includes a tapered body whose cross-sectional area reduces from the first end to the second end, and a cathode layer covering the chip excepting at least the first end.

Abstract: The present invention involves a metallized wound capacitor having increased dielectric breakdown voltage which includes first and second dielectric webs. A first electrode having first and second portions, where the first portion is between 5-300 Ohms/square, is metallized on the first face of the first web, to a width less than the width of the first web. A second electrode having first and second portions is metallized on the first face of the second web to a width less than the width of the second web. The first and second electrodes extend from opposing dielectric web longitudinal edges leaving respective bare margins along opposing edges on the respective webs. Each second portion has a width equal to the opposing bare margin less a predetermined tolerance and is thicker than its respective first portion.

Abstract: A capacitive biofeedback sensor including a polyurethane dielectric sandwiched between two wire mesh or carbon impregnated silicone rubber conductors. The sensor is placed within a patient's shoe, boot, ankle, brace, crutch, hand grip, wheelchair, etc., and provides biofeedback to help patients relearn function or prevent complications that impede function.

Abstract: A multi compartment electromagnetic energy shield (100) arranged for assembly to a mounting surface (203) of a carrier (201), the multi compartment electromagnetic energy shield includes an enclosure (101) and a partition (103) having electromagnetic shielding properties. The enclosure includes a first surface (405) and a first and a second side wall (105, 107) each extending from the first surface (405) to the mounting surface (203) of the carrier (201) after the assembly to the mounting surface of the carrier. The partition (103)including a mounting edge (305) and being arranged and constructed to electromagnetically divide the enclosure into multiple compartments (111, 113). The partition further captivated by the first and the second side wall (105, 107) in a free floating manner such that the mounting edge coincides with the mounting surface (203) after assembly to the mounting surface of the carrier (201).

Abstract: A circuit is provided which incorporates a solid electrolytic capacitor between a power source and a load. The capacitor comprises: a capacitor element including a chip body and an anode wire projecting from the chip body; an anode lead electrically connected to the anode wire; a cathode lead paired with the anode lead and electrically connected to the chip body; an auxiliary lead separate from the anode and cathode leads; a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and part of the auxiliary lead; and a fuse wire for electrically connecting the auxiliary lead to the anode lead within the resin package. Each of the anode, cathode and auxiliary leads has an inner end located in the resin package, and an outer end projecting from the resin package. Further, the anode lead of the capacitor is electrically connected to the power source without intervention of any other electronic element.

Abstract: This patent describes a cable which is exceptionally suitable for high frequency signal transmission which includes at least two adjoined insulated conductors which are twisted together to form a pair. The pair(s) of adjoined insulated conductors are preferably encased within a thermoplastic, fluorocopolymer, or rubber type material. The embodiment may employ a metallic shield under the encasement. The variation of center to center conductor spacing within a pair as described above should be less than a value equal to about 0.03 times the statistical average of the center to center conductor spacing. The preferred cable has an average impedance of 90 to 110 ohms with a tolerance of .+-.5% when measured at high frequencies along any 1000 ft. of cable. Additionally, the two adjoined insulated conductors should have an adhesion strength of no more than 5 lbs. force.

Abstract: A method of forming an integrated circuit capacitor is disclosed comprising the steps of providing a substrate, forming a conductive region at the substrate, and forming an insulating layer on the conductive region and the substrate. The method further comprises the steps of removing selective portions of the insulating layer to expose a selective area of the conductive region thereby forming a storage node contact window and forming a first conductive layer on the insulating layer and within the storage node contact window wherein the first conductive layer is in electrical communication with the conductive region. Next a cavity is formed in the first conductive layer. Subsequently, selected portions of the first conductive layer are removed leaving at least a remaining portion of the first conductive layer in which the cavity is formed thereby isolating the remaining portion of the first conductive layer from surrounding circuit elements.

Abstract: A package for a semiconductor device. The device is packaged using tape-automated bonding (TAB) to bond an integrated circuit chip to a package substrate of any type. The land pads on the substrate are staggered such that they are arranged in two rows with adjacent pads alternating. In this way, the effective overall pitch of the land pads is smaller than that of each row.

Abstract: An opening is formed in a region of a circuit board opposite a vibration region E of a piezoelectric element. The piezoelectric element is mounted to the circuit board, and electrical connections extend between and support the piezoelectric element from the circuit board by a solder. The soldered connection portions are surrounded by a bonding agent. An opening in the circuit board prevents any excess bonding agent from invading the vibration region E of the piezoelectric element, and the bonding agent assists in dispersing stresses exerted on the circuit board thereby minimizing the stresses transferred to the piezoelectric element.

Abstract: A housing (1) for an electrical device for bodycare, in particular for a tooth cleaning device, is described in which electrical components (8), in particular a charger, surrounded by a casting compound (14) are arranged. The components (8) are connected by an electrical cable (10) which is placed through a cable orifice in the housing (1). The cable orifice (11) is arranged in an external wall (12) of the housing (1) and represents the only orifice in the housing (1) to the electrical components (8). To produce the housing (1), the casting compound (14) is introduced through the cable orifice (11) into the housing (1) by means of a loading device (13).

Abstract: The invention relates to a single contact spring, especially for RF-screening of electronic devices, for latch-locking into sheet-metal apertures. The invention envisages, in a first embodiment, that the single contact spring includes a latch cage (14) and a resilient contact part (2) configured as a contact cup (6), the latch cage (1) is generally configured in a trough shape and, in its lower part, trapezoidally in cross-section, being open at its two front ends and being provided on its two longitudinal sides with two opposing cutouts (16). The top edge of the longitudinal side is angled-off outward and the contact cup (6) is held by means of an angled-off, resilient carrier part (14) fastened to one of the front ends. The advantage of this spring is that it can be mounted in one mounting direction and can be laterally traversed. The contact cup can also, in a further embodiment, be configured in a roof shape.

Abstract: An improved HF shielding feature is provided for electrical enclosures having a box-like base and a sealing cover wherein a tongue projects integrally from the upper periphery of the base into a groove formed integrally in under periphery of the cover. The tongue has a compression surface spaced apart from the base periphery, a first outside wall depends from such tongue compression surface to an outside portion of the base periphery and a first inside wall depends from the tongue compression surface to an inside portion of the base periphery. The groove has a second compression surface spaced apart from the tongue compression surface, a second outside wall depends from the groove compression surface to an outside section of the cover periphery and a second inside wall depends from the groove compression surface to an inside section of the cover periphery.

Abstract: An improved capacitor including a plurality of plastic frame mounted electrode and separator inserts. The plastic frame mounted electrode and separator inserts are oriented in alternating succession, and have a carbon paste placed therebetween. The capacitor includes terminal electrodes through which electric charge may flow. The capacitor also includes a pair of rigid endblocks.