Abstract: A blank cut and scored for forming an electromagnetic interference shield is disclosed. The blank includes a rectangular bottom section and has first, second, third and fourth rectangular wall sections, wherein each wall section is joined to a separate side of the rectangular bottom section. Each of the first, second, third and fourth corner sections is formed by coaxial lines extending from the sides of the first, second, third and fourth rectangular wall sections and abut a corner of the rectangular bottom section. A perimeter area is contiguous with the first, second, third and fourth wall sections and first, second, third and fourth corner sections. In each corner section, a line diagonally bisects the corner section from the corner of the rectangular bottom section. First, second, third and fourth corner lines diagonally bisect each respective corner section from the corner of the rectangular bottom section through the abutting corner section into the perimeter area.

Abstract: There is disclosed a double-layer capacitor having electrodes formed of a current collector positioned against a non-woven web of non-activated carbon fibers impregnated with carbon particles and positioned on either side of a porous layer within a container including a suitable electrolyte and having a conductor connected to each current collector of each electrode wherein the carbon fibers are of a surface area of less than 100 m.sup.2 /g, preferably less than 5 m.sup.2 /g.

Abstract: An expanding joint is disclosed for increasing the size of an initially substantially planar member, upon stretching. The joint includes a discontinuous incision having a sinusoidal pattern extending transversely on an axis extending normal to the direction of stretching and being arranged in alternating concave and convex portions. Each of the concave and convex portions are discretely separated from the portions by an isthmus such that the incision widens upon application of tension in a direction substantially normal to the axis.

Abstract: A chip-on chip type semiconductor device is provided in which semiconductor chips provided in a package cannot be displaced during a transfer molding process so as to eliminate a short circuit. At least two lead frames are provided in and extend from the package so that the first semiconductor chip and the second semiconductor chip can be electrically connected to external devices. A die stage is provided between the first semiconductor chip and the second semiconductor chip. A bonding wire is provided for wiring between the first semiconductor chip and the lead frames, and TAB leads connect the second semiconductor chip to the lead frames. The lead frames may extend between the first and second semiconductor devices instead of the die stage. The lead frames may include one having a portion extending in a direction perpendicular to the longitudinal direction of the lead frames between the first and second semiconductor chips.

Abstract: A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board. A cap extends around and encloses and seals electrical elements of the electrical module.

Abstract: A video cassette recorder is structured to have the skirt plates within its chassis frame, which extend toward the bottom cover and the main printed circuit board situated between the skirt plates at a location farther from the plate portion of the chassis frame than from its deck, with the pattern surface of the main printed circuit board facing the bottom cover.

Abstract: The invention comprises a shielding gasket for electrically sealing between a first and a second conductive panel. The gasket includes a resilient core having a securing side for securing to the first conductive panel, and an engaging side for engaging the second conductive panel. The core extends in a longitudinal direction and has a height. An electrically conductive sheath at least partially surrounds the core. A strip of adhesive is disposed along the securing side, the strip extends in the longitudinal direction along the core. An extension is along the securing side. The extension protrudes beyond the adhesive strip and runs along the longitudinal direction of the core, parallel to the adhesive, whereby the extension provides electrical contact to the first conductive panel at the same time as the adhesive secures.

Abstract: A cover assembly for restraining an object in an enclosure has a cover frame defining an opening at an open end of the enclosure, a cover to cover the opening, a restraining mechanism securing the cover to the cover frame to restrict movement of the cover relative to the cover frame when the cover is in a closed position and thereby restrain the object in the enclosure, and a latch to secure the cover to the cover frame to also restrict movement of the cover relative to the cover frame when the cover is in a closed position. A method for restraining the object in the enclosure includes securing the cover to the cover frame to cover the opening, securing the cover to the cover frame to restrict movement of the cover relative to the cover frame, and unsecuring the cover from the cover frame with a force having a first component force which unsecures the cover from the cover frame and a second component force which moves the cover relative to the cover frame.

Abstract: A solid electrolytic chip capacitor in which L-shaped portions of the anode terminal and cathode terminal form slanting surfaces which project beyond the projecting side surfaces of the resin sheathing.

Abstract: In an HF-tight component carrier, a longitudinal groove having a V-shaped profile is proposed for sealing the cover from the upper module rails. A spring member, having a V-shaped cross section is inserted into this longitudinal groove in a fitting and clamping manner. The cover is equipped with edge strips which engage the longitudinal groove. The spring member is provided with a planar rear leaf including a spring tongue and an acutely-angled spring leaf with a claw.

Abstract: A housing of a hand-held blender includes a wall fabricated from a first plastic material having at least one outer surface. The housing is further provided in at least one area with at least one second plastic material whose hardness is lower than the hardness of the first plastic material. The second plastic material is molded onto the inner surface of the wall by injection molding, such that a first area of the at least one area projects from the inner surface of the wall at least in individual sections, forming bearing areas. These bearing areas serve as supports for drive, control and switching devices. With this arrangement, the housing affords particular ease of manufacture while at the same time performing a damping function, improving the manipulation and reducing the noise level of a hand-held mixer while in operation.

Abstract: A capacitor (58) for an integrated circuit having a conductive trench (50), disposed below a bottom electrode layer (52), that electrically connects the bottom electrode layer to a semiconductor substrate (14, 16). The conductive trench eliminates the need for a top-side contact to the bottom electrode layer. The semiconductor substrate is, for example, connected to ground.

Abstract: An enclosure for an electronic device forms a barrier to electro-magnetic radiation. A typical cross-section of the enclosure comprises three parallel layers. The outer and inner surface layers are of a polymeric base material in which is suspended an electrically conductive fill material, giving the surface layers relatively high electrical conductivity. The middle layer is of a polymeric base material, in which is suspended fill material having high magnetic permeability, giving the middle layer relatively high magnetic permeability. In the preferred embodiment, the enclosure is constructed using a co-injection molding process. Nickel-coated graphite (high conductivity) in a polymeric base is injected into a mold from the outer co-injection nozzle, while carbonyl iron powder (high permeability) in a polymeric base is injected into the mold from the inner co-injection nozzle.

Abstract: A data card is provided which has an electrically conductive rail (70, 72 FIG. 2 ) extending along its opposite sides and part of its rear, and connected to the ground plane (60) of a circuit board (46) of the card, to provide EMI (electromagnetic interference) shielding along the perimeter of the card. The rail has top and bottom edge portions (94, 96 FIG. 6) that are each bent into a U shape to extend around top and bottom ridges at the side of the card body to lock the rail in place. One edge portion includes a projecting tab (110) which is bent to extend inwardly and engage the ground plane (60) of the circuit board. The molded card body has a through hole (114) in its side portion, and the tab can extend into that hole before extending inwardly to the circuit board ground plane.

Abstract: The fixing process according to the invention of a winding to one or more electronic circuits permits elimination of an important manufacturing step of the processes according to the prior art, whether the positioning, then the gluing or the precise fixing of the winding or of the core to be wound on the electronic circuit or circuits. By a suitable arrangement of the electronic circuit or circuits and of the possible core, independently of one another, on a holding tool according to the invention, a semi-finished product is obtained, also according to the invention, made up of said circuit or circuits and said winding, the mechanical connection between them being ensured solely by the copper wires producing, moreover, the electrical connecting between the two elements. The finished component according to the invention will be obtained by disposing the preceding semi-finished product on a support ensuring a permanent mechanical connection between the two elements.

Abstract: A multichip module packaging structure provided over a mother board. A multichip module substrate is mounted over the mother board through a frame member. The frame member is provided to extend successively on a peripheral region of a bottom surface of the substrate and further extend downward from the bottom surface of the substrate. The frame member also has a top portion bonded with the bottom surface of the substrate and a bottom portion bonded with the top surface of the mother substrate so as to form a three dimensional space surrounded by the frame member, the substrate and the mother board. A plurality of semiconductor integrated circuit chips are provided on the bottom surface of the substrate so that the chips are accommodated within the three dimensional space.

Abstract: A stowable wrist support assembly for a portable computer of the type having a bottom housing with top and bottom surfaces connected by a vertical peripheral side surface and having a keyboard on the top surface extending to a front edge and a top housing pivotally mounted to a back edge of the bottom housing, the support assembly comprises a generally thin flat panel having generally planar top support surface, a rear edge formed with a lip for detachably engaging and latching behind a shoulder proximate the front edge of the lower housing, and a panel support member extending downward from beneath the panel for engaging a lower front edge of the lower housing for supporting the panel in an outward position substantially in the plane of the keyboard.

Abstract: A door assembly for an EMI shielded room includes door structure defining an inner space parallel to the door faces. Plates are mounted in the space for movement toward and away from the door edges. Support and guide assemblies precisely regulate the plate movement. A pneumatic bladder spaced inward from the door edges forces the plates to move outward and return springs retract the plates when the bladder is vented. The outer borders of the plates carry bumpers that force flexible contact members into engagement with the jamb and threshold of a doorway.

Abstract: A sewn material for shielding against electromagnetic waves is provided without increasing the number of stitch perforations created when sewing electrically conductive threads to a base material. Two electrically conductive threads are sewn on at least one edge of a strip of elastomeric base material in an over-edge chain stitch that extends across the edge surface of the base material. Portions of the threads are partly exposed on the edge surface and other portions of the threads are sewn through the base material, thereby providing dual shield layers for shielding against electromagnetic waves entering from the side of the base material.

Abstract: A capacitor in a semiconductor device and a manufacturing method for the capacitor are provided using a triple film including a Ti layer, a TiN layer, and a Ta layer. The capacitor has a first insulating film formed on the surface of a semiconductor substrate, the first insulating film having a center hole and at least one step between the center hole and the rest of the first insulating film, a spacer formed on the inner wall of the contact hole, a first conductive layer filling the contact hole, a triple film formed on the center of the first insulating film, a second conductive layer formed on the triple film, a second insulating film formed on the resultant structure, and a third conductive layer formed on the second insulating film. The Ta layer is placed in between the second conductive layer and both the Ti layer and the TiN layer to prevent the production of a metal oxide and nitrogen gas from a reaction between oxygen and the Ti and TiN layers.