Abstract: A cold plate includes a first side with a first surface, and a second side, opposite the first side. A coolant cavity is formed between the first side and the second side. A recessed base is machined into the first surface of the first side. The recessed base is bonded to a base copper plate and is a thinnest portion of the first surface.

Abstract: Disclosed herein are integrated circuit (IC) packages with a heat generating electronic component and a fluid impingement cooling apparatus having a plurality of rotatable nozzles, as well as related devices and methods. In some embodiments, an IC device assembly may include a plurality of rotatable nozzles disposed in a nozzle plate, wherein the plurality of rotatable nozzles are rotatable individually; a microcontroller to identify a hotspot on a target surface of an IC device, wherein the hotspot has a temperature that is greater than a threshold temperature; and a motor coupled to the plurality of rotatable nozzles, wherein the motor causes one or more of the rotatable nozzles to rotate to impinge fluid on the hotspot.

Abstract: The invention relates to a medium or high voltage converter (2), preferably a modular multilevel converter, as well as to a power module (1), which comprises at least one power semiconductor module (4), at least one energy storage module (5), at least one cooling device (6), and wherein the cooling device (6) is formed as a cooling plate (7) which can be run through by a coolant, in particular flown through by a cooling liquid, and which has a smaller cooling plate thickness (10) as compared to a cooling plate length (8) and a cooling plate height (9) and the cooling plate (7) has at least one support region (12) defined by the cooling plate length (8) and the cooling plate thickness (10) and/or a part of the cooling plate height (9) of the cooling plate (7), for load transfer of the power module (1) onto a rack (3) of the medium or high voltage converter (2).

Abstract: A power connection/disconnection system for connecting/disconnecting an electric power module in a high-power modular uninterruptable power supply installation includes: a frame, a rigid support extending along a first direction, a set of connectors mounted on the support and including a ground connector and power connectors. The connectors are successively aligned along the first direction and each shaped to be electrically connected along a second direction orthogonal to the first direction with bars of a power connection box of the installation and a translation device configured to move, using an actuator, the support in the second direction. The ground connector extends higher along the second direction than the power connectors. The ground connector is intended to be electrically connected to a ground bar of the box.

Abstract: The disclosure relates to control electronics in a modular design, comprising an electronic base module and a plurality of functional modules, wherein: the base module provides at least one DC link voltage UZK at a voltage supply output for the voltage supply of the functional modules and the functional modules are electrically and mechanically connected to the base module and are supplied with the DC link voltage UZK by the base module; the base module and the functional modules each have a carrier having electronic components, the electronic components of the base module producing the DC link voltage UZK, at least one functional module being fastened to the carrier of the base module; and the electronic components of the base module and of the functional modules are arranged separate from one another by means of a thermal decoupling and/or an EMC shield.

Abstract: A heat dissipation device includes a console box, multiple casings and two flow-spilt assemblies. The casings are vertically superposed on the console box. Each casing has a heat dissipation loop. The two flow-split assemblies are disposed outside the casings. Each flow-split assembly has a water reservoir, a connecting tube communicated between the console box and the water reservoir and multiple curved tubes disposed on the water reservoir. The water reservoir is of a rod shape along a direction of the superposing of the casings. The curved tubes are arranged sequentially and spacedly along the water reservoir to communicate between the water reservoir and each casing correspondingly and connect each of the heat dissipation loops.

Abstract: An inverter system is provided, by which the magnitudes of currents flowing through inverter modules are substantially equal. The inverter system includes multiple inverter modules connected in parallel, where input terminals of all the multiple inverter modules are connected to a same direct current input bus, and output terminals of all the multiple inverter modules are connected to a same alternating current output bus. An input contact S1 of the direct current input bus and an output contact S2 of the alternating current output bus are such located that a difference between impedances of any two branches between S1 and S2 does not exceed a preset value.

Abstract: In one or more embodiments, a power distribution unit may include: multiple power distribution module (PDM) receptacles, in which each PDM receptacle is configured to receive a PDM along a longitudinal axis of the PDM receptacle and is configured with multiple conductors disposed along a plane orthogonal to the longitudinal axis; first multiple power outlets coupled to a first PDM receptacle of the multiple PDM receptacles, in which the first multiple power outlets are configured to provide first single-phase power to first multiple information handling systems housed by a rack; and second multiple power outlets coupled to a second PDM receptacle of the multiple PDM receptacles, in which the second multiple power outlets are configured to provide second single-phase power to second multiple information handling systems housed by the rack. In one or more embodiments, a monitoring device of the power distribution unit may monitor one or more environmental attributes.

Abstract: A base station includes a first area and a second area that are obtained by partitioning closed space by a partition wall. The first area includes a first device that controls communication and a liquid cooling device that sends a cooled liquid refrigerant to the first device. The second area includes a radiator that cools a liquid refrigerant by performing heat exchange with air, that supplies the cooled liquid refrigerant to the liquid cooling device, and that discharges the air used for heat exchange into the second area, and includes a second device that radiates heat by using the air discharged from the radiator and that performs a wireless process in accordance with control performed by the first device.

Abstract: An electrical connection point configured to electrically connect an electric load in a dwelling to a power grid. The connection point includes: a wall block, including first connection elements, the wall block configured to be mounted securely in a wall of the dwelling such that the first connection elements are electrically connected to corresponding portions of the grid; and a functional block configured to provide a specific electric function and including second connecting elements, wherein the functional block is configured to be removably mounted in the wall block, and thus interchangeable, the attachment providing the electrical connection of the second connection elements to the corresponding portions of the grid via the first connection elements, to allow the electric function to be brought into service.

Abstract: A pump tray has a liquid pump with an inlet and outlet. A blindly matable liquid coupler fluidicly couples with the pump inlet and a blindly matable liquid coupler fluidicly couples with the pump outlet. A chassis of the pump tray has an alignment member configured to removably engage with another device and to restrict, to a limited number of degrees-of-freedom, movement of the chassis relative to the other device (e.g., a liquid pumping unit). The blindly matable liquid couplers are so physically coupled with the chassis as to inhibit movement of them relative to the chassis. A liquid pumping unit also has a chassis defining a bay configured to receive a pump tray, a liquid inlet coupler and a liquid outlet coupler, and a reservoir fluidicly coupled with the liquid inlet coupler. A blindly-matable liquid coupler fluidicly couples with the reservoir outlet and a blindly-matable liquid coupler fluidicly couples with the liquid outlet coupler.

Abstract: A glass circuit assembly employing densely packed components is described. Air cooled computer systems employing densely packed circuit components are described. Relating to agile reconfigurable computer systems a high-resolution substrate having an area of at least 100 cm2 and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components in a circuit assembly. Switchable chips and redundant switchable chips may be included on each circuit assembly. Each independently operable cluster of components may include a power distribution chip, a test/monitor chip, and at least one redundant chip for each different logic device and for each different memory device. Chiplet components and combinations may be used to populate independently operable clusters of components. Agile reconfigurable systems are operable to adapt to changing workloads under direction of a system controller.

Abstract: A power converter includes: a plurality of semiconductor devices; a heat receiving plate; and a first partition member. The semiconductor devices constitute a power conversion unit. The heat receiving plate includes a first surface supporting the semiconductor devices. The first partition member is fixed to the heat receiving plate and partitions the semiconductor devices.

Abstract: A power distribution box configured to house a plurality of electronic components is provided. The electronic components are mounted to a lower case. An upper case is mounted to the lower case and spaced apart from the lower case so as to define a storage compartment. The upper case includes a vent configured to allow heat generated by electric components to escape. In particular, the vents are registered so as to be above selective heat generating electric components.

Abstract: A controller includes: a casing having a rectangular solid shape and including a front panel including an intake port, a rear panel including a discharge port and opposed to the front panel, and a heat transfer wall including an opening portion and perpendicular to the front panel and the rear panel; a fan inside the casing that sucks outside air into the casing through the intake port and supply the air to the inside of the casing; a regenerative resistor inside the casing at a position where the regenerative resistor is exposed to the outside through the opening portion of the heat transfer wall, the regenerative resistor being insertable and detachable through the opening portion; electronic parts inside the casing and including a servo amplifier which makes the regenerative resistor consume electric power; and a lid body detachably attached to the heat transfer wall to seal the opening portion.

Abstract: A radio frequency signal repeater includes, a first communication printed circuit board, a second communication printed circuit board, at least one embedded radio frequency module printed circuit board disposed between and communicably coupled to both the first communication printed circuit board and the second communication printed circuit board. The at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are stacked one board on top of the others, and adjacent boards of the at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are electrically coupled by a respective interconnection join layer so as to form an integrated printed circuit board module, where the adjacent boards are electrically coupled to each other through vias that extend through the interconnection join layer.

Abstract: The present disclosure provides a liquid cooling manifold. The liquid cooling manifold includes a channel body and a plurality of fluid connectors. The channel body includes a base, a wall portion and a fixing portion. The wall portion is connected between the base and the fixing portion, and a fluid channel is formed among the base, the wall portion and the fixing portion. The fixing portion includes a plurality of fixing openings respectively in fluid communication with the fluid channel. The plurality of fluid connectors are respectively disposed on the fixing portion and fixed to the corresponding one of the plurality of fixing openings and respectively in fluid communication with the fluid channel.

Abstract: An electronic device includes: a casing including a bottom wall and a side wall rising from the bottom wall, the side wall being attached to a manifold of an actuator in an aircraft at an opposite side to the bottom wall; a boss projecting from the bottom wall toward the opposite side to the bottom wall with respect to the side wall; and a circuit portion fixed to the boss.

Abstract: A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.

Abstract: An electric power substation includes one or more primary relay panels located at a substation site and susceptible to damage caused by radiated or coupled electromagnetic energy, and an electromagnetic pulse mitigation module located at the substation site and comprising a continuous conductive enclosure that is impervious to the radiated or coupled electromagnetic energy. One or more backup relay panels are housed within the electromagnetic pulse mitigation module and capable of assuming operation of the one or more primary relay panels.