Abstract: An apparatus and associated method for manufacturing a window covering 50 for an architectural opening. The apparatus includes a support structure handling assembly 92, an operating element handling assembly 94, and a vane handling assembly 96. The handling assemblies process the respective materials to an assembly station 100 to attach one portion of a vane 54 to the operating elements 56, and another portion of the vane 54 to the support structure 52, allowing movement of one portion of the vane 54 relative to other portion of the vane.

Abstract: A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns.

Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

Abstract: A sheet in an electronic display is composed of a substrate containing an array of wire electrodes. The wire electrodes are preferably electrically connected to patterned transparent conductive electrode lines. The wire electrodes are used to carry the bulk of the current. The wire electrodes are capable of being extended away from the substrate and connected directly to the printed circuit board. The transparent conductive electrode (TCE) is used to spread the charge or voltage from the wire electrode across the pixel. The TCE is a patterned film and must be at least 50% transparent, and, for most applications, is preferably over 90% transparent. In most applications, the electroded surface of the electroded sheet has to be flattened. Use of a thin polymer substrate yields a light, flexible, rugged sheet that may be curved, bent or rolled.

Abstract: An inflator device is disclosed. The inflator device includes a seal assembly that maintains, while sealing from ambient pressure, an open air passageway between a tire bead and wheel bead seat during an inflation procedure. A seal for the inflator device is also disclosed. The seal includes a ring-shape having a flexible inner periphery that is adapted to maintain, while sealing from ambient pressure, an open air passageway between a tire bead and wheel bead seat during an inflation procedure.

Abstract: Novel methods are provided that results in the formation of single-cap VIPs in a substrate are described herein. As a result, fine pitch trace patterns may be formed on the substrate. The methods may include initially providing a substrate having a first and a second side, the first side being opposite of the second side. A via may then be constructed in the substrate, the via being formed within a via hole that extends from the first side to the second side of the substrate, the formed via having a first end located at the first side of the substrate, and a second end opposite the first end located at the second side of the substrate. A selective deposition may be performed of a conductive material on the second end of the via to form a conductive pad directly on the via on the second side of the substrate without depositing the conductive material onto the first side of the substrate.

Abstract: To provide a method of manufacturing a quartz-crystal resonator, in which without adding new processes, a desired quartz-crystal piece can be obtained from a quartz-crystal wafer by etching and electrodes can be provided without restraint. When a quartz-crystal piece 10 is formed, etching masks 6 having dummy regions 44, 48 that are provided at two positions corresponding to corner portions on a +X side of the quartz-crystal piece 10 and extend toward a +X axis direction of a wafer W are formed, and when the quartz-crystal piece 10 is formed, etching in groove portions 7 at positions corresponding to the dummy regions 44, 48 is delayed. Accordingly, it is possible to form the quartz-crystal piece 10 without chipped portions at the corner portions in a state where the quartz-crystal piece 10 and the wafer W are connected to and supported by a connection support portion 11.

Abstract: A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as the thermal expansion coefficient of the circuit board. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs which include first fibers that conduct electricity and second fibers that do not conduct electricity, which have the second fibers disposed at positions where plated through holes will pass through, and which are impregnated with resin; a step of forming through holes at positions in the core portion where the second fibers are disposed; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the first fibers and thereby produce a core substrate.

Abstract: There is provided a rotating electric machine capable of reducing torque pulsation, even when a slight stepped portion is present in an inner diameter shape of a stator core formed by allowing coupling split cores divided in every magnetic pole to be in an annular shape. The stator core is formed by stacking a plurality of laminates prepared by stack of coupling split core members formed by punching steel sheets in an annularly arranged shape in a state where the laminates are rotated one another by a predetermined angle. With such a configuration, it is possible to mutually offset torque pulsation components caused by the shape asymmetry of the laminates and reduce the torque pulsation components of the stator core on the whole.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract: A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative material and the first conductive circuit, forming on a surface of the second resin insulative material a first concave portion to be filled with a conductive material for formation of a second conductive circuit, forming on the surface of the second resin insulative material a pattern having a second concave portion and post portions to be filled with the conductive material for formation of a plane conductor, and filling the conductive material in the first concave portion and the second concave portion such that the second conductive circuit and the plane conductor are formed.

Abstract: The protection of sensitive components on printed circuit boards by using planar transient protection material in one or more layers of a printed circuit board stackup is disclosed.

Abstract: Methods and apparatus for removing condensed metal from the surfaces of metal processing chambers, such as, vacuum induction melting (VIM) furnaces having, for example, condensed Mg or Ti, are disclosed. The methods and apparatus provide a robotic arm end positioned in the furnace having a nozzle operatively connected to a source of dry ice. The robotic arm end directs a stream of dry ice particles against the surface of the furnace to displace condensed metal. The displaced metal is collected for reuse or disposal. Aspects of the invention provide a safe and automated process for cleaning process chambers and recovering metal that can typically be dangerous when performed by conventional methods.

Abstract: An assembly includes a fixture including an opening shaped to receive a portion of a turbine engine component. A non-metallic cover is placed over at least a portion of the fixture. The cover facilitates reducing metal to metal contact of the fixture and the turbine engine component when the turbine engine component is installed in the fixture, and facilitates reducing scratching of the turbine engine component.

Abstract: The method of producing a substrate comprises the steps of: forming a through-hole in a base member; plating the base member so as to coat an inner face of the through-hole with a plated layer; applying photo resist on the base member; optically exposing and developing the photo resist so as to form a resist pattern, which coats at least a planar area of the through-hole; and etching an electrically conductive layer formed on the surface of the base member. The resist pattern is formed so as to separate an area of exposing the conductive layer a prescribed distance away from an edge of the through-hole, and the prescribed length is longer than a distance of etching a side face of the conductive layer in the etching step.

Abstract: A system of splicing ends of conveyor belts is provided that enables a splice installer to install splices in an easy and fast manner. In one aspect, the system includes a base having a recess extending therealong configured to fit fastener members of conveyor belt fasteners therein so that the fastener members do not shift as the belt fasteners are attached to the belt ends. In another aspect, removable rivet guide blocks are provided which significantly reduces the weight of an alignment bar having upper plate members of the belt fasteners secured thereto. In addition, the removable guide blocks allow the installer to secure the upper plate members to the alignment bar without having to deal with the heavy weight of multiple guide blocks fixed thereto. A method of splicing belt ends is also provided which includes indexing the removable guide block along the alignment bar during for riveting operations.

Abstract: A method of manufacturing a handheld computing device that includes an electronic component assembly including at least one user interface component and an enclosure. The enclosure is a tube that is extruded. The extruded tube defines an internal lumen between open ends, and has a substantially uniform cross section along a longitudinal axis thereof. The extruded tube includes a front face, a back face, side portions connecting the front face and the back face, at least one access opening provided on the front face, and a pair of guide rails formed in the lumen along the side portions in parallel with the longitudinal axis. The electronic component assembly is slidably inserted into the lumen along the guide rails. The guide rails support the electronic component assembly and provide a reference surface for positioning the electronic component assembly relative to the front face such that the user interface is placed right behind the access opening to provide user access therethrough.

Abstract: For forming a clamping ring first the pipe is extruded. The extruded pipe is cut to form a pipe part. While extruding the pipe, its inner diameter is formed smaller than the outer diameter of a pipe onto which the clamping ring is positioned before making a pipe connection. The inner diameter of the pipe part is made larger by removing material from the inside of the pipe part but only over part of the length of the pipe part such that a stop edge is formed. The clamping ring is used on a pipe when making a pipe connection.

Abstract: The invention relates to a method for attaching guide means (106) to a flexible sheet (100), preferably as part of a shading system for a vehicle, and to a device provided therefor. Holding regions (102a, 102b), spaced apart from one another in a Y-direction, of a flexible sheet (100) extending in an X-direction and a Y-direction are spaced apart from one another by being acted upon with a predetermined pretensioning force (Fv) acting in the Y-direction, with the result that a pretension state is achieved. Subsequently, in a further processing state which corresponds to the pretension state or to a pretension state relieved by the amount of a predetermined relief distance (S3) in the Y-direction with respect to the pretension state, guide means (106) extending parallel to one another in the X-direction and spaced apart from one another in the Y-direction are fastened to the sheet (100).

Abstract: A droplet discharging head comprises a pressure chamber in which fluid is filled through a channel, and a nozzle that is connected to the pressure chamber and which discharges the fluid as a droplet. After the droplet discharging head is assembled, at least the wall surfaces contacting the fluid are coated with a carbonized silicon film.