Patents Examined by Gerald P. Tolin
  • Heat dissipation device for personal computers
    Patent number: 5461540
    Abstract: A heat dissipation device for personal computers wherein an aluminum made computer panel is used and having an extension formed and extending into the computer enclosure and completely superimposing the surface of the CPU in order to transfer heat generated by the CPU during operation by means of heat conduction from the CPU to the outside of the computer enclosure.
    Type: Grant
    Filed: March 15, 1994
    Date of Patent: October 24, 1995
    Assignee: Infinity Group Corporation
    Inventor: Michael Lee
  • Printed circuit board assembly having high heat radiation property
    Patent number: 5459639
    Abstract: A printed circuit board assembly wherein a plurality of electronic parts including a heat generating part are mounted on a printed circuit board. At a portion of the printed circuit board at which the heat generating part is to be mounted, a recess is formed and a through-hole is formed substantially at the center of a bottom wall of the recess. A heat radiation member has a projection fitted in the through-hole of the printed circuit board, and a mounting portion provided around the projection for contacting with the bottom wall of the recess of the printed circuit board and securely mounted on the bottom face of the recess by means of solder. The rear face of a package of the heat generating part is securely mounted on the heat radiation member by means of solder.
    Type: Grant
    Filed: February 8, 1994
    Date of Patent: October 17, 1995
    Assignee: Fujitsu Limited
    Inventor: Shigeichi Izumi
  • Semiconductor device with heat radiating fin assembly and container for housing the same
    Patent number: 5459638
    Abstract: A semiconductor device is provided with a rectangular package body, a large number of leads projecting out from the body, and a heat radiating fin assembly on top of the package body. The heat radiating fin assembly is constructed of a support column extending vertically from the top surface of the package body and at least one heat radiating fin extending outwardly from the support column in a radial direction. The heat radiating fin is supported by direct or indirect engagement within a container for accommodating and holding the semiconductor device. The support is achieved in such a way that the leads of the device are held out of contact with the inside of the container and such that the device is accommodated and held within the container in a predetermined orientation.
    Type: Grant
    Filed: December 14, 1994
    Date of Patent: October 17, 1995
    Assignee: Fujitsu Limited
    Inventor: Yukio Ando
  • Electronic device having coplanar heatsink and electrical contacts
    Patent number: 5457605
    Abstract: An electronic device (100) has a heatsink (116) and electrical contacts (120) which are originally all part of a support frame (200). After assembly, the border of the support frame (202) is broken off, thereby electrically isolating the electrical contacts (120) from one another, and from the heatsink (116). The electrical contacts (120) and the heatsink (116) are coplanar. In one version, the electrical contacts (120) do not extend past the circuit board (102) of the device (100).
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: October 10, 1995
    Assignee: Motorola, Inc.
    Inventors: Robert Wagner, Joel R. Gibson, Scott McCall
  • Switch panel for electronic device
    Patent number: 5455743
    Abstract: A substrate 70 carrying a button plate 54 having an actuating button, and a switch element 72, is arranged at the back side of a front panel of an outer housing 1, and is supported by a bracket 74 screwed to the outer housing 1. The actuating button 52 and the switch element 72 may be positioned easily, while the LED 64 or the remote controlling light receiving section 68 may also be positioned simultaneously. The button plate 54 is not distorted in contradistinction from the case in which the button plate 54 is screwed directly.
    Type: Grant
    Filed: February 22, 1994
    Date of Patent: October 3, 1995
    Assignee: Sony Corporation
    Inventor: Satoshi Miyajima
  • Assembly for transferring heat from heat generating components to a surrounding housing
    Patent number: 5455739
    Abstract: An assembly transfers heat from the heat generating components of a circuit board to a surrounding housing. A removable heat transferring member is inserted into the interior of the housing. The removable heat transferring member is thermally coupled to the heat generating components, physically coupled to the circuit board, and thermally coupled to the housing. The coupling between the removable heat transferring member and the housing is such that the member, and thus the heat generating components and circuit board, can be easily removed from and reinserted into the housing. A portion of the housing is configured as a heat sink to dissipate heat.
    Type: Grant
    Filed: April 5, 1994
    Date of Patent: October 3, 1995
    Assignee: Alcatel Network Systems, Inc.
    Inventor: Robert L. Barden
  • Device for cooling power electronics
    Patent number: 5453911
    Abstract: A heatsink or cold plate is provided with which power electronic components mounted to a surface of the cold plate can be cooled with a cooling fluid flowing through the cold plate. The cold plate generally consists of a relatively planar structure through which one or more passages are formed for directing the cooling fluid through the cold plate. The passages direct the cooling fluid to recesses in the surface of the cold plate which are enclosed by the power electronic components. As such, cooling of the power electronic components is achieved by directly impinging the cooling fluid at their lower surfaces, preferably at an acute angle, such that enhanced heat transfer characteristics result.
    Type: Grant
    Filed: February 17, 1994
    Date of Patent: September 26, 1995
    Assignee: General Motors Corporation
    Inventors: James H. Wolgemuth, Joseph Madak
  • Detachable apparatus for cooling integrated circuits
    Patent number: 5452181
    Abstract: An apparatus for cooling an integrated circuit device has a fan detachably mounted to a heat sink, and the heat sink is in turn mounted to an exposed surface of the integrated circuit. The heat sink includes a pair of mounting posts, and the fan assembly includes corresponding mounting recesses for receiving the mounting posts. The mounting recesses are dimensioned to form an interference fit with the corresponding mounting posts, in order to retain the mounting posts within the mounting recesses. Alternatively, the fan assembly has biased tabs, which are received within corresponding recesses formed on the integrated circuit device to detachably mount the fan to the heat sink and integrated circuit. An electrical connector with biased terminals is mounted on the fan, and the biased terminals engage corresponding terminals on the integrated circuit upon mounting the fan to the heat sink.
    Type: Grant
    Filed: February 7, 1994
    Date of Patent: September 19, 1995
    Assignee: Nidec Corporation
    Inventor: John W. Hoover
  • Circuit breaker support saddle for automated assembly
    Patent number: 5450282
    Abstract: A circuit breaker support saddle is assembled automatically from three plastic support pieces without welding or using separate fasteners to secure the pieces together. The metal circuit breaker support rails are positioned onto blocks integrally formed on the two outermost pieces to mechanically hold the pieces together as a single unit. The circuit breaker stab support busses are retained within elongated slots formed within the outer edges of the central support piece.
    Type: Grant
    Filed: May 9, 1994
    Date of Patent: September 12, 1995
    Assignee: General Electric Company
    Inventors: Timothy W. Webber, Robert G. Markowski, Peter F. Cavanaugh
  • Retainer for securing a heat sink to a socket
    Patent number: 5448449
    Abstract: A retainer is disclosed for securing a heat sink having a plurality of parallel vertical fins above an electronic package which is mounted on a socket. The retainer comprises a clip assembly including a clip having a pair of spaced apart beams dimensioned to span the heat sink and to reside in respective grooves between respective pairs of adjacent ones of the fins. The beams are resiliently deflectable in respective planes extending parallel to the fins. One end of the clip is engageable beneath a ledge on one side of the socket. An opposite end of the clip is pivotally coupled to a latch. The latch is engageable beneath a second ledge on an opposite side of the socket upon deflection of the beams in their respective planes. The clip assembly biases the heat sink toward the socket when the one end of the clip and the latch are engaged beneath the first and second ledges.
    Type: Grant
    Filed: December 20, 1993
    Date of Patent: September 5, 1995
    Assignee: The Whitaker Corporation
    Inventors: Edward J. Bright, James E. Crompton, III, Attalee S. Taylor, Kevin E. Walker
  • Card extender unit for computer
    Patent number: 5446619
    Abstract: A card extender unit for a computer housing including first and second card extender sections which mount the card extender in position in the computer housing. The card extender includes a housing including first and second sections which support a printed circuit board having one or more high wattage, integrated circuits. One of the card extender sections includes a flow direction channel intake for directing air generated by an internal housing fan over one or more of the high wattage, integrated circuits mounted on the printed circuit board.
    Type: Grant
    Filed: August 12, 1993
    Date of Patent: August 29, 1995
    Assignee: Compaq Computer Corp.
    Inventors: Roberta M. Madsen, David A. Moore, Brian J. Perona
  • PC board cartridge for a computer terminal
    Patent number: 5446622
    Abstract: A PC board cartridge for a computer terminal, the cartridge including a casing for holding a PC board with a connector mounted thereon. A handle is pivotally mounted on the casing along an axis extending in a plane that extends perpendicular to a major surface of the board and intersects the board at the connector. The PC board cartridge preserves electrical and mechanical connector integrity by providing a handle for removal which applies generally equal forces across the connector during removal. In addition, no additional hardware is required for assembly, installation, or removal of the cartridge.
    Type: Grant
    Filed: August 6, 1993
    Date of Patent: August 29, 1995
    Assignee: Digital Equipment Corporation
    Inventors: Christian C. Landry, Tzong-Bin Tsai, Bradford G. Chapin, Jin-Bond Lou
  • An electronic package that has a die coupled to a lead frame by a dielectric tape and a heat sink that providees both an electrical and a thermal path between the die and teh lead frame
    Patent number: 5444602
    Abstract: An electronic package which has a heat sink that is attached to the lead frame of the package with a material that is both electrically and thermally conductive. The lead frame is also coupled to a first surface of an integrated circuit die with tape automated bonded (TAB) leads. The low thermal resistance of the heat sink increases the thermal performance of the package. The heat sink may also be mounted directly to the die with a conductive material so that the die is electrically grounded to the heat sink. The heat sink is then bonded to the leads of the lead frame that are dedicated to ground. In this embodiment, the heat sink provides the dual functions of a ground plate and a heat spreader.
    Type: Grant
    Filed: February 25, 1994
    Date of Patent: August 22, 1995
    Assignee: Intel Corporation
    Inventors: Koushik Banerjee, Siva Natarajan, Debendra Mallik, Praveen Jain
  • Wiring system for vehicle instrument panel wire encapsulated in reconfigured ventilation system
    Patent number: 5442518
    Abstract: A wiring system for a vehicle instrument panel, which includes a plurality of electronic subassembly components electrically connected to at least one wire, is encapsulated in a reconfigured ventilation duct structure located to the rear of the instrument panel. The ventilation duct structure, which extends between the subassembly components, is reconfigured to have at least one trough formed in it. The at least one trough has a finite length in at least one axial direction with an open side extending substantially along the length, so that the at least one wire may be received within the trough. The at least one wire is connected to at least one of the subassembly components. Wire restraints restrain the wire within the at least one trough.
    Type: Grant
    Filed: July 6, 1994
    Date of Patent: August 15, 1995
    Assignee: Chrysler Corporation
    Inventor: William M. Beam
  • Device for fastening a housing
    Patent number: 5440455
    Abstract: The innovation pertains to a device for fastening the housing of a data sensing element which encloses electronic circuits and connecting elements. Data sensing elements of this type are fastened in the wall which encloses the medium to be measured by means of a screw insert. Depending on their function, these data sensing elements may assume a position in which the connection of the connecting lines leading to a control room which is situated at a distance from the measuring point is only possible with great difficulties. This is the reason why the housing should be adjustable axially symmetrically relative to the screw insert. According to the solution suggested, the separable connection between the housing and the screw insert is formed by only one easily accessible screw which penetrates through a clamping disk and by projections which penetrate into a groove of the screw insert.
    Type: Grant
    Filed: June 1, 1994
    Date of Patent: August 8, 1995
    Assignee: Endress + Hauser GmbH + Co.
    Inventor: Werner Rottmar
  • High density, heat-dissipating circuit assembly with accessible components
    Patent number: 5438479
    Abstract: A circuit assembly includes a platen for pressing carrier plates, bearing heat-dissipating components, against a heat sink. Circuits on one carrier plate are electrically connected with circuits on the other carrier plate by corresponding contacts on each carrier plate which the platen presses into mutual contact as it presses the carrier plates against the heat sink. The surfaces to which the carrier plates are pressed is stepped, which serves to align the carrier plates with respect to each other. One or more substrates, bearing other circuit elements, are attached to the platen and electrically connected to circuits on the carrier plate by resilient contact elements attached to the platen. The resilient contact elements press against contact surfaces of the carrier plates and substrates to make connections. Recesses in the platen also facilitate alignment of the carrier plates and components thereon.
    Type: Grant
    Filed: November 8, 1993
    Date of Patent: August 1, 1995
    Assignee: Export-Contor Aussenhandelsgesellschaft mbH
    Inventor: Heinrich Heilbronner
  • Ferrimagnetic vias within multi-layer 3-dimensional structures/substrates
    Patent number: 5438167
    Abstract: Ferrimagnetic structures formed of ferrimagnetic vias in a unitized multilayer microcircuit structure that is formed of a plurality of co-fired insulating layers.
    Type: Grant
    Filed: October 19, 1993
    Date of Patent: August 1, 1995
    Assignee: Hughes Aircraft Company
    Inventors: Robert F. McClanahan, Robert D. Washburn, Hal D. Smith, Andrew Shapiro
  • Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
    Patent number: 5436793
    Abstract: An apparatus for containing and cooling an integrated circuit device includes a container defining a chamber. The apparatus further includes a conduit positioned in the chamber and having an inner surface and an outer surface, the integrated circuit device being positionable in the chamber and securable to the outer surface of the conduit. In addition, the apparatus includes an insulating member positioned to provide thermal isolation between the container and the conduit.
    Type: Grant
    Filed: March 31, 1993
    Date of Patent: July 25, 1995
    Assignee: NCR Corporation
    Inventors: Ikuo J. Sanwo, John Flavin
  • Modular station of the metal-clad type and of reduced size, with a shortened set of busbars
    Patent number: 5436797
    Abstract: A metal-clad modular power-supply station comprising a main set of busbars interconnecting at least two pairs of components, such as overhead feedthroughs or cable boxes, in an H-station configuration. The components are connected together in pairs by respective rectilinear groups of metal-clad electrical apparatuses that are parallel to and connected to the main set of busbars. Preferably, the groups of electrical apparatuses are in alignment. The length of the set of busbars is thus reduced while complying with the laid-down isolation distances and a station is provided of minimum size and of reduced cost.
    Type: Grant
    Filed: September 10, 1993
    Date of Patent: July 25, 1995
    Assignee: GEC Alsthom T & D SA
    Inventor: Jean Marmonier
  • Floor board assembly
    Patent number: 5434355
    Abstract: A floor board assembly includes four base plates connected around a center plate on the same plane, a cover board covered on the center plate, four lining plates covered on the base plates, four blocking plates connected to the center plate at four sides and bridged over either two base plates and disposed in flush with the lining plates, the base plate having open blocks spaced from one another for passing electric wires through spaces therebetween, the center plate having upright rods with a respective screw holes for mounting an electric socket after the removable of the cover board, the blocking plates having rows of sharp projections for fasten the floor covering being covered over the floor board assembly.
    Type: Grant
    Filed: October 26, 1993
    Date of Patent: July 18, 1995
    Inventor: Jen-Tai Sho