Abstract: A modularized electronic system for packaging and assembling a plurality of electronic modules for building a computer server which comprises an enclosure case having a backplane assembly, at least one electronic module assembly mounted in the enclosure case, and an external case frame for mounting the enclosure case. The enclosure case comprises one lower case assembly for module mounting. The lower case assembly comprises a U-shaped holding means for holding the rear end of the module assembly and a backplane assembly for module connection. The module assembly comprises a module connector under its module head which is vertically connected to the receptacle of the backplane assembly. The rear end of the module assembly further comprises a latching means which is latched to a latch receiving means installed on the U-shaped holding means to prevent the rear end of the module assembly from moving upward.

Abstract: A housing may hold a control device equipped with heat-producing components. A die-cast housing includes a side wall, a rear wall, a bottom, a cover, a front strut, a cooling element and an air guide device, a cover plate and a front cover. The cooling ribs of the cooling element run parallel to the rear wall, end in the plane of the side wall, and are covered with a bulkhead plate. The bottom and the cover are each provided with perforations for removing heat from the front housing half and openings through which connection lines may be passed. The front strut serves as a lateral frame part for the removable cover plate that covers a lateral access opening of the housing, and for the front cover which can close off the front-side opening of the housing. This results in a housing for a control device in book size format, where the number of assembly parts, the assembly effort and the assembly time are significantly reduced.

Abstract: The device embodying the invention comprises a rigid and good heat conducting frame supporting a printed circuit board, and comprising two posts having two runners susceptible of slidably fitting into two opposite U-shaped slide rails, each runner having two symmetrical ramps on which are applied, due to the action of tightening means generating a relative transversal motion of the wedges, the respective bevelled sides of two mobile wedging blocks, in a direction perpendicular to the plane of the frame. This device is particularly suited to the fastening of printed circuit boards into electronic installations on board aircraft.

Abstract: An operator presence sensor for an operator's seat on equipment, such as skid steer loaders and the like, provides a signal to indicate when the seat is occupied. The operator presence is sensed by permitting seat rails to pivot about their forward end against leaf springs designed to support the seat weight plus a known fraction of an operator's weight so that the rear of the seat is raised when the seat is unoccupied and when an operator occupies the seat the springs deflect and the rear of the seat moves down, resting on a seat support pan. An electronic sensor detects seat position to provide a position signal.

Abstract: A fuse mounting bracket assembly for air-insulated, live front padmounted switchgear is provided that in a first configuration permits only one type of fuse to be selectively mounted in the bracket assembly and in a second configuration allows only a second different type of fuse to be selectively mounted in the bracket assembly. The bracket assembly includes a main frame having an end wall and two side walls with slots being provided in the side walls for pivotally receiving opposed, outwardly extending mounting protuberances on the selected one type of fuse. A pair of adapters may be selectively mounted on the frame assembly in blocking relationship to the slots and which present components that extend inwardly toward one another from respective side walls for engagement with a mounting hook on a second type of fuse, thus allowing the fuse mounting bracket assembly to be selectively configured for either of the two types of fuses with minimum overall parts requirements.

Abstract: A CPU heat sink holding-down device including a CPU holder, a CPU mounted on the CPU holder, and a heat sink fastened to the CPU holder to hold down the CPU, wherein the heat sink has a fixed loop-like hanger pivotably disposed at one vertical side thereof and hung on a first retainer rod at one vertical side of the CPU holder, two locating bar extended out of an opposite vertical side thereof, a screw rod connected between the locating bars, a movable loop-like hanger turned about said screw rod and hung on a second retainer rod at an opposite vertical side of the CPU holder, and a curved spring plate connected to the movable loop-like hanger for lifting the movable loop-like hanger from the second retainer rod.

Abstract: An enclosure (12) for electrical equipment (14) includes a fan mounted on an interior surface of the enclosure (12) and adapted to blow air outwardly from the enclosure (12) through a grille (24). The grille (24) includes a plurality of sets (90-96) of short, wide elongated slots, each set (90-96) having its slots disposed perpendicular to a radial direction of the fan hub (44) passing through the slots. The enclosure material between the slot sets (e.g. 90, 92) overlies struts (50) forming part of the support for the hub (44) carrying the fan blades. The construction provides low noise from air blown through the slots, while maintaining robust grille construction.

Abstract: An electronic package for an integrated circuit. The integrated circuit is mounted to a heat spreader that is attached to a substrate. The heat spreader is thermally conductive and lowers the thermal impedance of the package. The heat spreader may also provide a return current path from the integrated circuit to the substrate. The substrate has internal power and signal lines that are coupled to the integrated circuit. The power and signal lines are connected to surface pads or leads that can be mounted to an external printed circuit board. Mounted to an inner area of the integrated circuit is a decoupling capacitor. The decoupling capacitor is also connected to a lid that is mounted to the substrate. The decoupling capacitor reduces the noise within the integrated circuit and is used to control the impedance of the overall package. The lid contains both power and ground planes that are connected to the capacitor and the power/ground pins of the substrate.

Abstract: An electrical assembly 100 is provided which includes a land grid array integrated circuit package 103, a socket 104, a printed circuit board 106 and a clamping lid 101. Socket 104 and clamping lid 101 have major surface dimensions no greater than the major surface dimensions of the LGA integrated circuit package 103 in order to limit board space requirements to the minimum required by the circuit package 103. Alignment means associated with integrated circuit package 103, socket 104 and printed circuit board 106 are provided to maintain alignment between contact pads 120 on circuit package 103 and first ends of compressible conductors 111 on socket 104 and between contact pads 122 on circuit board 106 and second ends of compressible conductors 111. In the completed assembly, clamping lid 101 applies pressure to an adjacent surface of integrated circuit package 103 thereby compressing compressible conductors 111 against contact pads 120 and contact pads 122.

Abstract: A printed wiring board having electronic circuit devices (13, 44) such as semiconductors including a heat sink forming a housing (32, 36) for the printed wiring board, one of the electronic devices (13) being mounted on one portion (12) of a heat spreader that is formed of a material having high thermal conductivity, another portion (10) of the heat spreader forming a thermal energy flow path to the heat sink, thereby lowering the junction temperature at the electronic device (13) and increasing the reliability of the wiring board.

Abstract: A diaphragm assembly for movement in response to a pressure increase exerted thereon comprised of a resilient flexible diaphragm having a first surface with a predetermined profile when said diaphragm is in a neutral, unflexed condition, the diaphragm having an opening formed therethrough.A rigid pressure plate is adapted to be positioned against the diaphragm. The plate has a contoured surface for mating engagement with the first surface of the diaphragm. The contoured surface has a recessed sealing surface dimensioned to form an open space between the plate and the diaphragm when the diaphragm is in the neutral, unflexed condition, and to enable the diaphragm to flex into sealing engagement therewith when sufficient pressure is exerted on said diaphragm. A first vent passage communicates the opening in diaphragm with the open space, and a second vent passage communicates the open space with the edge of the pressure plate.

Abstract: A multi-chip module includes a substrate, an interconnection pattern provided on the substrate, a plurality of semiconductor chips provided commonly upon the substrate in electrical connection with the interconnection pattern, a plurality of thermally conductive blocks each provided on corresponding one of the plurality of semiconductor chips in an intimate contact therewith, a resin package body that encapsulates the plurality of semiconductor chips and the plurality of thermally conductive blocks together with the substrate, such that the resin package body has an upper major surface substantially flush with the upper major surfaces of the plurality of thermally conductive blocks, and a heat sink mounted upon the upper major surface of the resin package body such that the heat sink establishes an intimate contact with respective upper major surfaces of the thermally conducting blocks.

Abstract: A high density electric power supply device formed by stacked circuit modules including top, bottom and intermediate modules, each of the modules having electrical contact elements retained in engagement with complementing contact elements on an adjacent one of the stacked modules under a force having a direction to press the top and bottom modules against the intermediate modules. Each of at least the intermediate modules have supply and return ports parallel to the direction of the aforementioned force and at least some of the modules having a passageway for circulation of cooling fluid between the supply and return ports therein. An elastic seal circumscribes each of said supply and return ports on at least the intermediate modules for maintaining a continuous fluid-tight passageway through the supply and return ports among the stacked circuit modules, the elastic seals being maintained under compression by the compressing force.

Abstract: An electrical equipment cabinet utilizes a door-mounted, air-to-air heat exchanger for providing cooling to the equipment housed in the cabinet while maintaining a closed or sealed environment within the cabinet. An arrangement of ducts and vents is used to force interior and exterior air through the heat exchanger using powered fans mounted within the main portion of the cabinet. The mounting of the heat exchanger on or within the door of the cabinet makes more efficient use of the space available within the cabinet, and the placement of the fans within the main portion of the cabinet protects them from damage and avoids the need to provide electrical power to the door.

Abstract: Printed circuit board and heat sink assembly in which heat conductive elements are provided to distribute heat across the board before transferring heat into the heat sink. Also in other structures, heat is conducted directly into a heat sink from surface mount components while bypassing the board.

Abstract: A cooling apparatus for integrated circuit chips in which the pressure of coolant does not affect the pressure exerted by the cooling apparatus on the chip. A block is provided with a plurality of holes, and cooling members are inserted in these holes. An elastic member is provided between the block and the cooling member, and the cooling member is supported in the block by the elastic member. Each of the cooling members are connected by pipes, and a bellows is provided in the pipe. When the block is loaded on the substrate on which the integrated circuit chips are mounted, the elastic member deforms and the cooling member is displaced in accordance with the height and inclination of the integrated circuit chip. The lower surface of the cooling member is brought into close contact with the integrated circuit chip due to the deformation of the elastic member. The bellows deforms in accordance with the displacement of the cooling member to ensure the normal connection of the pipe.

Abstract: An adjustable depth electrical enclosure is taught. Briefly stated, a load center housing has inverted T shaped slots provided along its exterior. A bracket having an adjusting screw swagged thereto is extended through the T slot so that the bracket can ride back and forth in the vertical portion of the T slot. The adjusting screw is rotatably attached to a flange on the enclosure such that rotation of the screw causes the adjusting bracket to move with respect to the front/rear direction of the enclosure. Thereafter, when the brackets are attached to wall studs, mere adjustment of the adjusting screw allows the enclosure to be moved perpendicular to the wall thereby allowing the enclosure to be accurately flush mounted with the wall material utilized.

Abstract: An electronic component is provided which comprises a resin package for enclosing inside parts. The package has a heat sensitive surface portion provided with a heat sensitive material which irreversibly discolors at a temperature higher than the soldering temperature for the electronic component. The component may be a solid tantalum capacitor, solid aluminum capacitor, diode or transistor which generates heat under abnormal operating conditions.

Abstract: A pressure switch particularly adapted for use with high pressure fluid is shown having a frusto-conical support surface in the form of a protuberance (121, 121') formed at the center of a surface of a piston guide member (12, 12'). A stretchable diaphragm cap member (14, 14') generally in the shape of an inverted V is closely fitted on the protuberance (121, 121') of the piston guide member (12, 12') as well as the head (111b) of a piston member (111, 111') received in and projecting out of bore (120, 120'a) formed centrally through protuberance (121, 121'). The outer thickened peripheral berm (143, 14'a) of the cap member (14, 14') is inserted into a recess (102e, 102'e) in the wall defining an enlarged portion of the bore (102) which in turn opens to a cavity (103, 103') of the upper housing (10, 10') in which piston guide member (12, 12') is disposed. The cap member (14, 14') serves to seal the fluid passage side of the switch from the remainder of the switch.

Abstract: An enclosure for protectively housing a printed circuit board in an electronic circuit module includes a base having an internal surface and an external surface. The base includes a pair of raised mounting pads formed on the internal surface which define respective mounting surfaces. A pair of channels are also formed on the internal surface of the base. The enclosure further includes a cover having a panel portion and a pair of end wall portions. Respective projections are formed on each of the end wall portions which define grooves therein. The cover is assembled to the base by inserting the edges of the end wall portions provided on the cover into the channels provided on the base. A plurality of spring clips is disposed within each of the grooves provided on the cover. The spring clips can be positioned at any desired location along each of the grooves.