Abstract: In a vacuum prober, a head plate is arranged on a prober chamber. A stage, first moving mechanism, recessed chamber, and sealing member are provided in the prober chamber. The stage is arranged below a probe card. The first moving mechanism vertically moves the stage in at least the Z direction. The recessed chamber has a bottom portion and side portion. A lower camera, an upper camera, and the stage are operated to obtain data for alignment. When the upper end of the side portion of the recessed chamber comes into tight contact with the lower surface of the sealing member and a vacuum mechanism evacuates the recessed chamber, a vacuum chamber is formed. As the chamber has a small capacity, the time required for evacuation can be shortened.

Abstract: A probe assembly having a switch that selectively electrically connects, for example, either a Kelvin connection or a suspended guard element with the probe assembly.

Abstract: A probe apparatus with control-position detection means is provided for testing an electrical characteristic of a to-be-tested object formed on a substrate W. The probe apparatus includes a prober chamber, a susceptor provided in the prober chamber for placing thereon a to-be-tested object, and a moving mechanism for moving the susceptor in X-, Y-, Z- and ?-directions. The probe apparatus further includes a probe card having a plurality of probes and opposing the susceptor, and a first optical length-measuring unit. The first length-measuring unit emits light to the surface of the to-be-tested object placed on the susceptor, and detects the Z-directional position of the to-be-tested object based on the light reflected from the object. The probe apparatus can have a second length-measuring unit.

Abstract: In a working system for circuit boards such as, typically, as an electronic component mounting apparatus, an image pickup camera mainly for detecting the position of a reference mark on a circuit board or/and for detecting the misalignment of an electronic component from the axis a mounting head holding the electronic component is also utilized for detecting a peculiar portion formed on one of board lifting plates for lifting a circuit board to be clamped at a working position on a circuit board transfer conveyer. The peculiar portion comprises a plurality of grooves formed on one board lifting plate made of stainless steel for being detected as a plurality of dark regions appearing on the stainless steel board lifting plate. When the circuit board is transferred to the working position on the circuit board transfer conveyer, one of the dark regions to be detected is hidden by the circuit board from the image pickup camera, so that the presence of the circuit board on the board transfer device can be judged.

Abstract: A system for measuring radiant signals includes a detector circuit for detecting a time multiplexed, measured radiant signal and reference signal. A switch is connected to the detector circuit for receiving signals from the detector circuit. A measured signal sampling circuit, a reference signal sampling circuit, a measured alias circuit and a reference alias circuit are connected to the switch, which is operative for switching among the sampling and alias circuits to remove sampling noise and improve switching latency.

Abstract: The present invention relates to production testing of semiconductor devices, more specifically to production testing of such devices at wafer level. A method according to the present invention comprises the steps of generating (20) quality test-data at a limited number of semiconductor devices on the wafer, deciding (24) based on the generated quality test-data whether other semiconductor devices on the wafer are to be tested, and based on the result of the deciding step, testing (28) or not testing (26) the other semiconductor devices on the wafer. A corresponding wafer prober is also described.

Abstract: One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.

Abstract: A system, apparatus and method for controlling temperature of an integrated circuit in a chip tester is disclosed. Embodiments include supplying a chilled fluid to a cold plate at a first flowrate, where the first flowrate is associated with a first valve setting based on at least a desired temperature setpoint and an applied power. Embodiments may determine a change in applied power and modify the chilled fluid flowrate in response to a change in testing conditions to a second flowrate associated with a second valve setting associated with at least the desired temperature setpoint and the changed testing conditions. This feed forward loop may be supplemented by a feedback loop that includes modifying the energy supplied to a cold plate heater in response to a comparison of a current temperature and the temperature setpoint. The valve may be a proportional control valve or the like.

Abstract: A system and method for measuring circuits on an integrated circuit substrate includes a measurement circuit formed on the integrated circuit substrate that measures at least one characteristic of an integrated circuit. The measurement circuit has a power transfer device including a power transfer component, which receives energy from a source where the source does not make physical contact with the integrated circuit substrate to transfer power to the measurement circuit. Measurements are taken to provide feedback for in-situ adjustments to circuit parameters and responses.

Abstract: A locking mechanism and method for selectively fixing and allowing movement of a tip portion of a probe relative to a rigid portion of the probe are provided. The mechanism comprises a locking ball joint for selectively locking and allowing relative movement between the tip portion and the rigid portion and a sleeve about the ball joint. The locking ball joint is locked by the placement of the sleeve in a first position, thereby fixing the position of the tip portion relative to the rigid portion, and released by the placement of the sleeve in a second position, thereby allowing movement of the tip portion relative to the rigid portion.

Abstract: It is an object of the present invention to provide an arch type probe capable of enduring a load caused by overdriving even if the probe is miniaturized, and a probe card using the same. An arch type probe 200 has a shape including a first quarter circle arc portion 210 which is supported at one end thereof by the base plate 100 and a second quarter circle arc portion 220 which is connected to the other end of the first quarter circle arc portion 210, extending toward the base plate and a little shorter than the first quarter circle arc portion 221. The top portion of the arch type probe 200 serves as a contact surface brought into contact with an electrode of a semiconductor water B.

Abstract: Test system for testing integrated chips and an adapter element for a test system.

Abstract: A test tray includes a rectangular shaped frame and a plurality of transport modules to receive a plurality of semiconductor devices. A precise location-determining unit mounted on both sides of the frame to precisely determines and fixes the test tray location. According to one embodiments, the precise location-determining unit includes a locking hole to receive a positioner, a bushing to prevent locking hole wear, a protection bar to cover the frame and the bushing. The test tray prevents yield reduction and handler malfunction, e.g., sudden stopping of the handler, by precisely fixing tray and semiconductor device position during loading, unloading, and testing. The test tray can be extensively without repair or replacement because locking hole, with protective bushing therein, enjoys little or no wear.

Abstract: A channel for use in automatic test equipment and adapted for coupling to a device-under-test is disclosed. The channel includes a driver and respective AC and DC-coupled signal paths. The AC-coupled signal path is disposed at the output of the driver and is configured to propagate signal components at and above a predetermined frequency. The DC-coupled signal path is disposed in parallel with the AC-coupled signal path and is configured to propagate signal components from DC to the predetermined frequency.

Abstract: The resolution and contrast of impedance measurements and scans are improved by using a non-contact impedance probe comprising an inner conductor configured to bear a measurement signal and an outer conductor configured to bear a shielding signal. The measurement signal and shielding signal are selected to increase the directionality of the flux emitted from the impedance probe. In one embodiment, the measurement signal and the shielding signal are phase locked signals. A sample may be placed in a basin having a conductive surface that receives the flux emitted from the impedance probe. By filling the basin with a conductive solution, direct contact between the probe and the sample may be avoided along with the associated variability in contact resistance. The small highly-directional flux emitting area achievable with the present invention enables high resolution high contrast non-contact scanning of biological and non-biological materials.

Abstract: A current sensor for measuring an electric current flowing through a current bus bar includes: a magnetic core with an opening, through which the current bus bar passes with a predetermined interval; and a first magnetic sensor for detecting magnetic flux density in the magnetic core, the magnetic flux density generated by the electric current passing through the current bus bar. The magnetic core has a first gap and a second gap. The first magnetic sensor is disposed in the first gap. The second gap is capable of preventing magnetic saturation of the magnetic core.

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.

Abstract: An apparatus, a system, and a method for semiconductor processing automation, specifically for handling, are disclosed herein. In various embodiments, an apparatus for handling comprises a pick-and-place subassembly and a press subassembly.

Abstract: A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.

Abstract: A test probe tip constructed substantially from resistive material. The resistive material is made of resistive conducting material substantially enclosed in and dispersed throughout encapsulating material. The test probe has a probing end for probing electronic circuitry and a connection end for interfacing with a probing head. The resistive conducting material forms at least one path through the encapsulating material from the probing end to the connection end. The resistive conducting material may be a plurality of longitudinally extending resistive/conductive members or a plurality of particulate resistive/conductive members.