Abstract: A socket electrically coupled to a BGA unit includes a plurality of ball contacts including a housing wherein a through-hole having a larger diameter than that of the ball contact is formed in a surface of the housing, which faces the BGA unit, in order to the through-hole corresponds the plurality of ball contacts and a pin contact provided in a plurality of through-holes and contacting a corresponding side part of the ball contact. More desirably, the plurality of pin contacts is provided in order that each extending directions of the pin contacts are opposite to one another.

Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

Abstract: A burn-in testing method to perform tests with a semiconductor device operated in an atmosphere at a prescribed temperature characterized in that operation instruction signals instructing an operation of the semiconductor device are repeatedly supplied while supplying power to the semiconductor device, and increases and decreases in a power supply current corresponding to the operation instruction signals are counted.

Abstract: An apparatus is disclosed for testing the processing electronics of a detector module for an X-ray computer tomograph. To provide a measurement environment which is as noise-free as possible, the processing electronics to be tested are tested when they are DC decoupled from a current source and a measurement and tapping apparatus.

Abstract: A system and method for reducing the likelihood of a phase to phase or phase to neutral arcing failure, or a flashover in an electrical power consumption monitoring device. The method includes generating a reduced voltage from either a single phase or two phases of the electrical service provided, and utilizing the reduced voltage to supply the power supply circuits of the watthour meter and/or the data transmission circuits. A step-down auto-transformer may be used to generate the reduced voltage to thereby not only reduce the voltage available to the monitoring and data transmitting circuits of the watthour meter, but also limiting the current carried to those circuits. Because the total available power is reduced, the likelihood of a catastrophic failure caused by arcing within the watthour meter or a MOV failure is significantly reduced.

Abstract: method for testing integrated circuits comprises: generation of a change in an input signal of the integrated circuit, detection of a change in the output signal of the integrated circuit, the change triggered by the change in the input signal when a predetermined condition is satisfied, and a comparison of the detected output signal with at least one predetermined comparison criterion. Whereby, the predetermined condition is derived individually for each integrated circuit from a time response of the output signal.

Abstract: Methods and systems formulate the impedance for decoupling capacitors of a multiple power supply printed circuit board considering plane capacitance, series resonant frequencies, parallel resonant frequencies and impedance. The impedances are evaluated at anti-resonant frequencies, which have been found to be the problematic frequencies and potentials for high impedance. Once such impedance at selected frequencies have been determined, they can be compared to target values, set for example by various system integrity or EMI standards or design parameters, to assess whether a particular DC power supply system performs properly from signal integrity or electromagnetic radiation points of view. This ability to readily assess a high probability of compliance theoretically will reduce research and development time and budget, reducing possibly many iterations of board designs and trials and error physical testing.

Abstract: A semiconductor test apparatus comprising a test apparatus main body for generating a test pattern provided to a semiconductor device, a test head which contacts the semiconductor device and provides the test pattern generated by the test apparatus main body for the semiconductor device, a cable for delivering the test pattern to the test head from the test apparatus main body and a movable supporting unit for moving in a direction to release tension when tension occurs in the cable while holding the cable.

Abstract: An inspection device for a display device includes: an inspection circuit which judges a defect of each of pixels based on current which flows through an inspection interconnect connected with interconnects of the display device; and an inspection driver circuit which drives by supplying a necessary signal to the display device. The inspection circuit includes: a correction circuit which generates a first correction current which substantially cancels a first current which flows through the inspection interconnect when all the pixels are set to an off-state based on the first current; a detection circuit which detects a measured value for each pixel obtained by correcting a measured current which flows through the inspection interconnect by the first correction current each time the pixels are sequentially set to an on-state; and a defect judgment circuit which judges a defect of each of the pixels based on the measured value.

Abstract: A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.

Abstract: Described herein is a surface-mounted integrated current sensor for use in a printed circuit having a track along which there flows, in use, the electric current to be measured. The current sensor comprises a package having a bottom face facing, in use, the printed circuit, and on which there is set an electrically conductive bottom piece, which, in use, makes contact with the track of the printed circuit in such a way as to be traversed by the current to be measured. The current sensor moreover comprises a sensor element, for example a Hall-effect one, designed to generate a voltage proportional to the electric current that flows through the bottom piece.

Abstract: A method includes setting a first target temperature for an object that is in contact with a thermal medium, repeatedly receiving input that is indicative of a current temperature of the thermal medium, repeatedly estimating the temperature of the object based on the input, repeatedly setting a second target temperature for the thermal medium based on the estimated temperature of the object, and controlling the temperature of the thermal medium based on the second target temperature which has been set. Other embodiments are described and claimed.

Abstract: A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices.

Abstract: An integrated circuit includes a circuit component, a first control circuit and a switchable resistance network. An input voltage is fed to the circuit component on the input side. A control signal generated by the first control circuit is fed to the control terminal of the circuit component. With the switchable resistance network, the first resistance or the second resistance is connected between an output terminal of the circuit component and the output terminal of the integrated circuit to generate a voltage drop between the input side and the output terminal of the circuit component. The integrated circuit makes it possible to generate a current at the output terminal of the circuit component in a manner dependent on the control signal and the voltage dropped between the input side and the output terminal of the circuit component. Families of characteristic curves of transistors of an integrated circuit are determined by the integrated circuit.

Abstract: A leakage inverter has a switching delay in one direction that is directly proportional to the drain or gate leakage current of either an n-type or p-type device. For one aspect, a leakage ring oscillator includes an odd number of inverters including at least one leakage inverter such that the frequency of oscillation of the leakage ring oscillator is directly proportional to local device leakage. For another aspect, a leakage ring oscillator may be used to indicate temperature and/or temperature variation on a die.

Abstract: The present invention provides a semiconductor test device that can output a higher voltage as a driver output without increasing power consumption of a high-speed driver, so as to test a device under test. In order to achieve this, the semiconductor test device for switching a driver output between a plurality of voltages and a higher voltage that is higher than said plurality of voltages and outputting said driver output to test a device under test, includes: a first buffer portion operable to output said plurality of voltages by a push-pull circuit of an emitter follower serving as a source and an emitter follower serving as a sink; and a second buffer portion operable to output said higher voltage by a push-pull circuit of said emitter follower serving as said sink of said first buffer portion and an emitter follower serving as a source of said higher voltage.

Abstract: Low threshold current switch comprising a sensing transformer, a voltage multiplier and a switch enables monitoring a very low electric current in a power cable.

Abstract: An electrical scanning probe microscope (SPM) apparatus. The SPM apparatus is equipped with an atomic force microscope with an infrared laser source, a position-sensitive photo-detector (PSPD) to provide a topographic image, a charge-coupled device (CCD) monitor for optical alignment, and an electrical scanning sensor operatively coupled to the atomic force microscope to acquire synchronous two-dimensional electrical images. The photoperturbation effects induced by stray light and perturbation of the contrast of SCM images can thus be ameliorated.

Abstract: A pallet capable of fixing display panels having various sizes substantially normal to the pallet, a method of fixing the display panels using the pallet, and a method of transferring the pallet are provided. The pallet includes a first supporting unit and a second supporting unit for fixing a display panel, first panel fixing units included in both the first supporting unit and the second supporting unit, the first panel fixing units support a lower end of the display panel, and one or more second panel fixing units included in the first supporting unit and/or the second supporting unit. The one or more second panel fixing units are made of a plurality of disks for fixing at least one of opposing sides of the display panel.

Abstract: An open-loop current sensor comprising a magnetic circuit having an air gap, a magnetic field detector disposed in the air gap, and a primary conductor having one or more turns surrounding the magnetic circuit, the current to be measured flowing in the primary conductor, the sensor being characterised in that the turns of the primary conductor are disposed close to the air gap, on each side of the air gap.