Patents Examined by John T. Haran
  • Patent number: 6783623
    Abstract: A method of making a spirally wound dry bonded paperboard structure. The method includes adding a radio frequency active adhesive to the paperboard pulp stock during the paperboard fabrication process to first produce an RF active adhesive impregnated paperboard. The impregnated paperboard is then exposed to an RF energy field prior to or during winding, which activates the adhesive. The invention eliminates the need to apply a water-based adhesive to the paperboard prior to forming the structure, thereby reducing water migration into the paperboard.
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: August 31, 2004
    Assignee: Sonoco Development, Inc.
    Inventors: Jeremy E. Morin, Krishnaraju Varadarajan
  • Patent number: 6770968
    Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive.
    Type: Grant
    Filed: February 19, 2003
    Date of Patent: August 3, 2004
    Assignee: International Business Machines Corporation
    Inventors: Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson
  • Patent number: 6764569
    Abstract: An adhesive system for forming reversible adhesive bonds includes at least one polymeric adhesive component comprising at least one of polyurethanes, polyureas, or epoxy resins and at least one additional component that includes a functional group that can be activated by the introduction of energy, such that a chemical reaction with the adhesive component takes place involving a partial breakdown of the adhesive component. Reversible bonding of articles and controlled parting of an adhesive bond between articles can be achieved with the adhesive system.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: July 20, 2004
    Assignees: DaimlerChrysler AG, Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V., Henkel KgaA
    Inventors: Peter Becher, Heinrich Flegel, Michael Herrmann, Peter Kurzmann, Jörg Bauer, Monika Bauer, Hartmut Krüger, Jens Neumann-Rodekrich, Jürgen Schneider, Michael Hirthhammer
  • Patent number: 6764576
    Abstract: The disclosure relates to a method and an apparatus for forming and thermosealing one end of a packaging container which is manufactured from thermosealing material. The packaging container is placed in a conveyor which brings it into contact with mechanical forming devices (22) which progressively reform the packaging container end so that a sealing fin (6) oriented in the direction of movement of the packaging container is formed. In a subsequent sealing station (12), thermoplastic material located in the sealing fin (6) is heated to sealing temperature, whereafter wall portions included in the sealing fin are mechanically urged against one another during simultaneous cooling and continued advancement.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: July 20, 2004
    Assignee: Tetra Laval Holdings & Finance S.A.
    Inventors: Esko Heinonen, Mats Nyhlén, Mikael Andersson
  • Patent number: 6761790
    Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: July 13, 2004
    Assignee: Nitto Denko Corporation
    Inventors: Toshiyuki Kawashima, Nobuharu Tahara, Kenichi Ikeda
  • Patent number: 6752894
    Abstract: This invention concerns a process for modifying a polymeric substrate by contacting the surface with a photoreactive solution of an inorganic photochemical electron donor while irradiating the surface with actinic radiation. Patterns of modified and unmodified surfaces can be produced. Polymeric substrates with modified surfaces may be effectively bonded to polymer films to form composite articles. The process has particular applicability to the surface modification of fluorinated polymers.
    Type: Grant
    Filed: December 14, 2001
    Date of Patent: June 22, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Naiyong Jing, George Van Dyke Tiers
  • Patent number: 6752888
    Abstract: The present disclosure relates that constraining a substrate into a convex arc prior to mounting and affixing of any chips, allows those chips to achieve exemplary final chip-to-chip abutment when the substrate is released and allowed to return to stasis. This is particularly of use where there are any intervening thermal cycles, and the thermal temperature coefficients of expansion for the chip/die and any substrate/mount are significantly different. This will allow the utilization of otherwise more desirable materials for the substrate in spite of some mismatch in thermal coefficients that may exist between the substrate and chips.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: June 22, 2004
    Assignee: Xerox Corporation
    Inventors: Paul A. Hosier, Kraig A. Quinn
  • Patent number: 6752893
    Abstract: The method for manufacturing rimless spectacles provides a connection region between the lens and the rimless supporting structure wherein the connection region includes a radiation absorbing dye having a predetermined wavelength absorbing band. The lens and rimless supporting structures are then joined together, and the radiation absorbing dye is irradiated by a source of radiation operating at a wavelength within the predetermined wavelength band. Once exposed, the lens and rimless supporting structure are fused together.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: June 22, 2004
    Assignee: Gentex Corporation
    Inventor: Leonard P. Frieder, Jr.
  • Patent number: 6748990
    Abstract: A plurality of electric wires of a wire harness have a filler applied to predetermined waterproofing portions thereof. A sheet is wound on a peripheral surface of a bundle of electric wires to which the filler has been applied, and the sheet-wound waterproofing portion is repeatedly pressed from opposite sides. By such pressing, a relative displacement of the electric wires and the filler can be accelerated and the filler can be spread and filled securely in the waterproofing portion.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: June 15, 2004
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Ryoukichi Yashima, Hisashi Kurachi
  • Patent number: 6748995
    Abstract: An apparatus having several stations that receive, apply adhesive to, crowd, press and cure the wood pieces into a continuous wood panel. A singulation station engages an individual one of the wood pieces oriented in a cross-machine direction from an infeed station, presents the wood piece to an adhesive station for adhesive application and releases the wood piece for crowding at a crowding station into a batch of the wood pieces. A press station downwardly presses the batch with an upper platen and presses the batch in a downstream direction onto the continuous wood panel with a clamping device. A radio frequency device applies radio waves to cure the adhesive between the wood pieces of the batch so as to adhere the wood pieces together and so as to adhere the batch to the continuous wood panel. A cutting station cuts individual wood panels from the continuous wood panel.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: June 15, 2004
    Assignee: Radio Frequency Services, Inc.
    Inventors: Thomas Gorich, Lee Kidd, Mike Bicio, Greg Sprole
  • Patent number: 6740191
    Abstract: A process for forming a heat weld between a catheter shaft and a surrounding balloon comprises selecting an elongate catheter shaft formed of thermoplastic polymeric material that is opaque to red and near-infrared light, and selecting a balloon formed of thermoplastic polymeric material that is transparent or translucent to red and near-infrared light. While a neck of the balloon is fitted in close contact around a distal portion of the catheter shaft, a laser beam of red and near-infrared light is applied through the balloon neck to impinge on the underlying opaque distal shaft, which is heated thereby. Heat from the shaft is conducted into the surrounding balloon neck so that adjacent annular portions of both components melt and mix. The molten materials are allowed to cool, forming a secure weld joint between the neck and the shaft. The process yields strong, flexible bonds between balloons and catheter shafts that may be selected from a wide variety of materials.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: May 25, 2004
    Assignee: Medtronic AVE, Inc.
    Inventors: Gerry Clarke, Gerard M. O'Connor, Richard Sherlock, Alan O'Driscoll, Cathal McNamara, Hubert McDonagh
  • Patent number: 6741302
    Abstract: A system (and method) includes a first substrate having both a transparent region and alternating opaque and transparent regions with respect to incident electromagnetic radiation, a radiation diffuser at least partially transparent to the incident electromagnetic radiation, a coupler for attaching the radiation diffuser to the first substrate to form a diffuser-substrate interface, a polymer used for affixing the first substrate to a second substrate, the polymer positioned between the first substrate and the second substrate along at least a peripheral region common to both the first and the second substrates, and a source of electromagnetic radiation incident onto the diffuser attached to the substrate for polymerizing the polymer.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: May 25, 2004
    Assignee: International Business Machines Corporation
    Inventors: Robert Jacob von Gutfeld, James H. Glownia, Fuad Elias Doany
  • Patent number: 6733613
    Abstract: An anisotropic conductive compound is cured by exposing it to heat while in the presence of an AC magnetic field followed by a static, substantially homogeneous DC magnetic field.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: May 11, 2004
    Inventor: S. Kumar Khanna
  • Patent number: 6726806
    Abstract: A method and an apparatus for fixing a part and a part support for mounting the part by use of adhesive via an intermediate member are disclosed. The adhesive is implemented by photocuring adhesive while the intermediate member is formed of a material transparent for light. The intermediate member is free from coloring and deformation when illuminated by light for curing the adhesive. The adhesive is prevented from dropping or turning round to other portions during assembly.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: April 27, 2004
    Assignee: Ricoh Company, Ltd.
    Inventors: Hiroshi Takemoto, Shinobu Kanatani, Yoshihiro Morii, Shigeru Fujita
  • Patent number: 6726792
    Abstract: A method of making a flangeless seam for a disposable article including the following steps: A first member of the disposable article is provided. An electromagnetic field responsive member is provided on the first member. The first member is folded about the electromagnetic field responsive member providing opposing first proximal and first distal portions of the first member, the electromagnetic field responsive member being disposed at least partially between the opposing first proximal and first distal portions. A second member of the disposable article is provided in a folded configuration juxtaposed at least a portion of the first member to form a laminate including the first member and the second member. An electromagnetic field is applied across at least a portion of the laminate to heat the electromagnetic field responsive member to a temperature which joins at least a portion of the first member and at least a portion of the second member.
    Type: Grant
    Filed: December 10, 1999
    Date of Patent: April 27, 2004
    Assignee: The Procter & Gamble Company
    Inventors: Larry K. Johnson, Stephen J. Lange, John J. Angstadt, Bradley E. Walsh, Fredrick W. Gibson
  • Patent number: 6719871
    Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: April 13, 2004
    Assignee: International Business Machines Corporation
    Inventors: Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson
  • Patent number: 6719868
    Abstract: A system is provided for positioning separate portions of a sample in elongate, parallel channels of a sample chamber and to irradiate a sample in the chamber to create a diffraction pattern where the sample and chamber differ in refractive index. The system also can measure absorption of electromagnetic radiation by a sample in the chamber, and can measure the absorption simultaneously with measurement of diffraction by the sample.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: April 13, 2004
    Assignee: President and Fellows of Harvard College
    Inventors: Olivier J. A. Schueller, David C. Duffy, John A. Rogers, Scott T. Brittain, George M. Whitesides
  • Patent number: 6719877
    Abstract: The bonding system for auxiliary door seals contains a receiving means for detachably holding a mounting template whose peripheral edge at the narrow side is provided with a plurality of spaced-apart trough-like suction members which are connectable via a joint line and a connection valve to a source of vacuum to suck in the auxiliary door seal placed on the peripheral edge. The receiving means is guided together with the mounting template by a slide means below and past two plasma irradiation means and below two metering devices which apply a predetermined amount of a viscous adhesive to the auxiliary door seal. Each of the metering devices has a double seat valve which releases either the connection between a cartridge and a displacement-type metering means or the connection between the displacement-type metering means and the outlet opening of the valve means.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: April 13, 2004
    Inventor: Hartmut Böhle
  • Patent number: 6716294
    Abstract: A plant for the continuous production of polarizing lenses includes a coil polarizing film feeding station; a glass convex lens feeding station; a concave lens feeding station; an under vacuum film shaping station; a deposition and gluing outer convex lens station; a translation station for the pre-glued lenses; a deposition and gluing inner concave lens station; a lens separation and film cutting station; and a palletization station for the finished lenses; and a method.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: April 6, 2004
    Assignee: Barberini S.p.A.
    Inventor: Gianni Vetrini
  • Patent number: 6712925
    Abstract: The present invention provides an apparatus and method for storing a particle-containing liquid. The storage apparatus comprises a microfluidic convoluted flow channel having a plurality of particle capture regions. The storage channel is preferably an isotropic spatially periodic channel. Sedimented particles can be resuspended following storage. This invention further provides a microfluidic analysis cartridge having a convoluted storage channel therein. The sample analysis can use optical, electrical, pressure sensitive, or flow sensitive detection. A plurality of analysis channels can be included in a single cartridge. The analysis channels can be joined to reagent inlets for diluents, indicators or lysing agents. A mixing channel can be positioned between the reagent inlet and the analysis region to allow mixing and reaction of the reagent. The cartridge can include additional valves and pumps for flow management.
    Type: Grant
    Filed: October 28, 1999
    Date of Patent: March 30, 2004
    Assignee: University of Washington
    Inventors: Mark R. Holl, Floyd Edwards, Robert Morff, Gerald L. Klein