Abstract: This invention relates to how to obtain an optical recording disc with a good quality, capable of achieving a beautiful outline shape of the inner peripheral part side rim part of the cured ultraviolet ray curing type resin substantially concentrically even in the case there is irregularity of the wettability of both round substrates with respect to the ultraviolet ray curing type resin, and capable of providing an even film thickness of the resin with the film thickness controlled to a predetermined value or less even in the case there are irregularity of the wettability of both round substrates, difficulty in controlling the centrifugal force applied on the resin, irregularity of the plate thickness of both round substrates, or the like.

Abstract: A process for producing a chip, comprising the steps of: setting an object to be diced on a pressure sensitive adhesive sheet for producing chip comprising at least one layer of shrinkable film, an expansible film and a pressure sensitive adhesive layer for setting the object; fixing edges of the pressure sensitive adhesive sheet for producing chip; dicing the object into chips, and shrinking the shrinkable film to thereby expand chip spacings. In the process for producing small chips such as semiconductor chips, chip spacings can be expanded without the need to conduct the conventional expansion step.

Abstract: A method for the production of a trim part for decorative purposes, especially for the forming of interior and/or exterior trim parts for motor vehicles, having a thin ornamental layer made from an inorganic and/or crystalline material that is fragile in thin-layer form, especially natural stone, includes the following method steps: first, a flexible, at least partially transparent stabilizing material is applied to the surface of a block of inorganic and/or crystalline material and is separated together with a thin ornamental layer from the block of inorganic and/or crystalline material; then the laminate of ornamental layer and stabilizing material is placed in a casting mold for the trim part; the casting mold is closed by moving an upper mold and a lower mold relative to one another, and the ornamental layer is thereby shaped into a desired three-dimensional form determined by the casting mold; then the casting mold is filled with at least approximately transparent material and the ornamental layer is the

Abstract: A method for manufacturing a laminated electronic component, in which magnetic layers and conductive patterns for coil are sequentially provided, a coil pattern is enclosed between the magnetic layers inside a laminated body, and a nonmagnetic section is provided between adjacent conductive patterns for coil, the coil pattern being provided by repeatedly performing: a first step of providing a second magnetic layer over the entire top face of a first magnetic layer, which a first conductive pattern for coil is provided on; a second step of providing a loop-shaped groove in the second magnetic layer by using laser processing; a third step of providing a nonmagnetic section in one portion of the loop-shaped groove; and a fourth step of printing a second conductive pattern for coil so that one end section thereof overlaps the end section of the first conductive pattern for coil and the other end section extends to the surface of the nonmagnetic section.

Abstract: Methods are disclosed for producing absorbent articles comprising molded airlaid webs and other molded fibrous webs. The molded webs can offer improved body fit and/or improved fluid handling. Molded airlaid webs, for example, can be formed having a central longitudinal hump and flexure zones longitudinally removed from the central hump to provide good contact with the body and improved fit when the article is squeezed from the sides. Molding can be achieved when a binder material is activated by an energy source and the web is held against a molding substrate. Energy sources can include microwaves, heated air, heated metal surfaces, ultraviolet radiation, ultrasonic energy, and the like.

Abstract: An improved method of fabricating a device such as OLED is disclosed. The method includes applying an adhesive on a cap or substrate. The adhesive is partially cured to initiate the cross-linking process while remaining in the liquid phase. The cap is then mounted onto the substrate and the adhesive is cured to encapsulate the device. By partially curing the adhesive prior to mounting the cap, the curing of the adhesive can be achieved without prolonged exposure to UV radiation or high temperatures which can adversely impact the device.

Abstract: A multi-layer structure includes a layer of a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing electron donor.

Abstract: A kit for repairing a windshield break utilizing a light activated resin includes a light impervious pedestal and resin chamber with the pedestal being placed in airtight engagement about a windshield break. The kit also includes a syringe which is couplable to an opening in the chamber. The light activated resin is carried in a light impervious container having a neck dimensioned to deposit the resin directly into the chamber before the syringe is coupled to the chamber. The kit additionally includes a light transmissive film to cover the resin filled break during curing of the resin and a light impervious patch for covering the opposite face of the windshield.

Abstract: The object of the present invention is to significantly inhibit the formation of voids between substrates bonded together when a liquid adhesive is supplied onto an optical disc substrate or when the optical disc substrate is bonded to another optical disc substrate. Accordingly, the present invention discloses a method for bonding two optical disc substrates together which comprises the steps of joining the optical disc substrates together with an adhesive and curing the adhesive, wherein the adhesive is supplied onto the optical disc substrate by an electric field formed between the adhesive-supplying nozzle, for supplying the adhesive onto the optical disc substrate, and the optical disc substrate, and the two optical disc substrates are then joined together and subjected to spun by a spinning process.

Abstract: The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process.

Abstract: A reinforced composite material includes a laminate panel adhered to a strengthening panel with a layer of adhesive that is interposed therebetween. The strengthening panel includes a reinforcement embedded therein, and may be in the form of a sheet of fiberglass reinforced plastic (FRP). The layer of adhesive can include a coating of a contact adhesive applied to each of the laminate panel and the strengthening panel, or can be in the form of a hot melt glue or an epoxy adhesive. A method of forming the reinforced composite material includes forming the laminate panel, forming the reinforcing panel, and adhering the laminate panel to the reinforcing panel with a layer of adhesive. The adhering step can include applying and curing a layer of hot melt adhesive, applying coatings of a contact adhesive to the laminate panel and the reinforcing panel, and applying an epoxy adhesive, and/or other steps.

Abstract: A method of preparing a bonded assembly of two substrates at least one of which is transparent or translucent to UV or visible light, comprises a) applying, to at least one of the substrates, a photo/anaerobic dual cure composition comprising: i) a (meth)acrylate-capped urethane oligomer, ii) at least one (meth)acrylate diluent monomer, iii) an anaerobic curing system, and iv) a free-radical photoinitiator; b) joining the two substrates c) irradiating the adhesive through said transparent or translucent substrates with light of a wavelength effective to activate the photoinitiator for a time sufficient to at least fixture the adhesive, and then d) allowing the assembly to further cure at ambient conditions without for at least 24 hrs without subjecting the fixtured assembly to substantial peel stresses.

Abstract: A process for the manufacture of a multilayer ceramic substrate includes fabricating the multilayer ceramic substrate from a monolith fabricated from universal layers and a monolith fabricated from custom layers. The universal layer monolith and the custom layer monolith are then joined to form the complete structure of the MLC substrate.

Abstract: A method for producing a re-releasable bond between two wafers which is stable at high temperatures and mechanically stable is described. The two wafers to be bonded are placed one on top of the other in such a way that a surface of the first wafer is disposed on a surface of the second wafer. Interspaces at least partially connecting the surfaces are created between the wafers. A liquid glass compound is introduced into the interspaces in such a way that a liquid glass film wetting the inner surfaces of the interspaces is formed, in which process voids that are connected to the atmosphere surrounding the wafers remain inside the interspaces wetted with the liquid glass compound. To transform the wetting liquid glass film into a solid silicon dioxide film, the wafers lying one on top of the other are subjected to a temperature treatment.

Abstract: An attachment between a monitoring device and an innerliner of a tire includes the use of an epoxy adhesive that bonds the monitoring device directly to the inner surface of the innerliner of the tire. The innerliner is first roughened in a manner that provides a roughened portion of the innerliner without removing the entire thickness of the innerliner. The entire thickness of the innerliner is not removed because the innerliner is preferably more than {fraction (1/16)} of an inch thick. The thickness of the innerliner allows the rigid cured epoxy to bond the monitoring device to the inner surface of the innerliner while allowing the innerliner to flex with the tire so as to not break the seal between the rigid epoxy and the innerliner. The monitoring device is preferably located at a low flex area of the tire to help avoid the problem of the innerliner flexing.

Abstract: An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin having particles of graphite suspended therein. In the preferred embodiment, the composition further includes a polymer to increase durability. The composition is formulated to be solid in the range of normal room temperatures, but liquify once subjected to temperatures just below the range at which heat generating electronic semi conductor devices typically operate. The present invention further comprises processes for transferring heat from a heat-dissipating component to a heat dissipater, which comprises applying the heat conductive composition to an interface between a heat-dissipating component and a heat sink.

Abstract: An ink jet recording head has a plurality of discharge energy generating devices for discharging recording liquid, while being provided with a recording element base plate arranged on the face opposite to the surface where the devices are arranged, having a plurality of recording liquid supply ports for supplying recording liquid to the devices, as well as with a supporting member that holds and fixes the recording element base plate. For the supporting member, a plurality of recording liquid supply paths are arranged to supply recording liquid to each of the supply ports of the recording element base plate, respectively, and then, the flow path width of each supply flow path is formed to be smaller than the opening width of inlet portion of each supply port. Further, the steps to be created between the supply flow path and the supply port is buried by the bonding agent forced out from the bonding face of the recording element base plate and the supporting member.

Abstract: An intermediate low-pressure laminated ceramic device is formed from a plurality of layers of unfired ceramic material each including ceramic particles in an organic binder. A polymer interfacial layer having a glass transition temperature such that it flows at a temperature below a temperature required for the unfired ceramic layers to substantially deform, is deposited on one surface of each of the unfired ceramic layers. The unfired ceramic layers are stacked with an interfacial layer positioned between adjacent unfired ceramic layers in the stack. The stack is heated to a temperature greater than the glass transition temperature of the interfacial layers and a pressure is applied to the heated stack below approximately 1200 psi to fixedly bond the plurality of layers in the stack together.

Abstract: A laminated optical element has an IR transmissive substrate and a laminated IR transmissive polymeric layer on at least one surface of the IR transmissive substrate. The polymer layer may be a fluoropolymer or polyethylene and has an aspheric/diffractive surface. The polymer layer is affixed to the substrate by adhesive or, alternatively, the polymer layer is formed directly on the substrate resulting in a unitary optical element that is IR transmissive.

Abstract: A method of making a surface planarization is provided using a separate pre-cut or precured film laminated onto a metallized surface to form planarized dielectric coating. The method comprises the steps of: (a) providing a thin film interconnect module with a polyimide adhesive laminated with a pre-cut or pre-cured polyimide lamination film on the top of the polyimide adhesive, the polyimide lamination film being covered with a glass plate; (b) applying pressure and heat in a synchronized format to ensure a uniform curing and gap filling in the thin film module metal for the adhesive layer; and (c) releasing the glass plate to expose a smooth lamination film surface.