Abstract: Wedge wire bonding apparatus are disclosed with an improved configuration in which the transducer axis lies on a line that bisects the XY axes, and the operator views the bonding process by looking directly along the axis of the transducer. The result is a shorter bonding cycle time as time is saved as the bonding head moves from a first to a second bonding position while at the same time the operator is placed in the best possible position for viewing the bonding operation, which facilitates in particular any necessary alignment and set-up steps.

Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4, SF4, and H2 and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.

Abstract: A method of forming a meltable material at a joint between telescopingly engaged male and female elements, with the female element having a joint surface that surrounds a joint surface of the male element. The method includes the steps of: placing a ring of the meltable material around one of the male and female elements at a first location spaced from the joint; heating the male and female elements at the joint to a temperature at which the meltable material melts; sliding the ring of meltable material from the first location to a second location; with the ring of meltable material at the second location and the male and female elements of the joint at a temperature at which the meltable material melts, causing the meltable material to flow between the male and female joint surfaces; and cooling the male and female elements at the joint to solidify the meltable material between the male and female joint surfaces.

Abstract: A solder ball attracting mask which is mounted on a suction apparatus for sucking a plurality of solder balls under vacuum so as to place the solder balls on electrodes of an electronic component and formed with a plurality of through-holes for attracting the solder balls thereto, with the solder ball attracting mask having a principal face engageable with the solder balls and a rear face engageable with the suction apparatus such that the through-holes extend through the solder ball attracting mask from the principal face to the rear face, the through-holes each including a funnellike attraction area for attracting the solder ball thereto, which reduces its diameter gradually from the principal face towards the rear face up to a suction port and a suction hole which has a diameter larger than that of the suction port and extends from the suction port to the rear face to define a suction space.

Abstract: A conductive adhesive material characterized by metallurgical bonds between electrically-conductive particles dispersed in a polymer matrix of the material. The polymer matrix has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles. At least the outer surfaces of the particles are formed of a fusible material, so that sufficiently heating the conductive adhesive material will reduce metal oxides on the particles, and at least partially melt the fusible metal, enabling the particles to metallurgically bond to each other and to metal surfaces contacted by the adhesive material.

Abstract: A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the active ingredients are disposed primarily in the first phase and the carrier is disposed primarily in the second phase. The use of this solder flux composition is found to reduce solder migration, during solder reflow, that can result in bridging in ball grid arrays and other such devices.

Abstract: A method for mounting a chip on a substrate includes applying the underfill agent onto at least one of the substrate and the chip and moving the chip to the substrate to bring the bump into contact with the electrode. The method also includes steps to distribute the underfill agent in a space between the chip and the substrate, to around the bump and the electrode, heating the bump or electrode in the state that the bump is buried in the underfill agent to melt the bump or electrode so as to weld the bump to the electrode.

Abstract: A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn—Zn solder upon a copper base plate, placing one or more aluminum folded fin assemblies on the solder sheet or paste, heating the base plate, the folded fin assembly and the solder to a temperature exceeding the liquidus temperature of the solder and allowing the solder to flow, and cooling the solder to form a soldered joint between the base plate and the folded fin assembly.

Abstract: A method for the production of reinforced hollow sections with a continuous periphery. In order to provide in a simple manner, hollow sections with selective local reinforcement at points subject to high mechanical loads, an opening is formed in the periphery of the hollow section and a reinforcing plate is inserted into the opening, such that it at least projects into the hollow section. The reinforcing plate is then joined to the hollow section in the region of the edge of the opening.

Abstract: The vocal circuit for a hand tool includes a circuit board, a switch connected with the circuit board, and a chip and a speaker installed on the circuit board. The hand tool may be a gas-burning soldering device including a fuel reservoir, a soldering iron subject to heat caused via burning fuel flowing from a pipe and an igniter received in the shell for igniting the fuel. The switch of the vocal circuit is located between a button of the igniter and a main switch mounted on the shell. The main switch includes a pin extending into the shell for contact with the switch of the vocal circuit and the button of the igniter through the switch of the vocal circuit.

Abstract: A soldering heater cartridge with replaceable tips and a soldering iron for use therewith is constructed of a tip heater cartridge with an elongated cartridge body that has a tubular body member, electrical connectors at a first end of the tubular body member for plug-in connection with an electrical connector assembly of a soldering iron handpiece, a soldering tip for mounting on the cartridge body and a heater mounted within the cartridge body and electrically connected to the electrical connectors. The tip end part is located at a second end of the cartridge body and the heater is located within the tip end part, the soldering tip being replaceably mountable over the tip end part in heat exchange contact with it.

Abstract: A solder flow oven comprises a reflow zone for heating a workpiece using heated air to a temperature effective to reflow solder. The reflow zone comprises a nozzle having divergent vanes that direct shear layers into neighboring zones to extend the distance over which the workpiece is heated to effective solder reflow temperature.

Abstract: Grooves 18 formed to face plates 11 and 12 of a hollow shape member 10 at an abutted region with hollow shape member 20 receive projections 28 formed to face plates 21 and 22 of member 20. A connecting plate 14 orthogonal to the face plates 11 and 12 is provided to the hollow shape member 10. There is no connecting plate orthogonal to face plates 21 and 22 disposed on the end of the hollow shape member 20. Friction stir welding heat causes the face plate 21(22) to wove toward the thickness direction of hollow shape members 10 and 20, but such movement is suppressed by the groove 18 and projection 28. Thereby, the abutted region is welded flatly.

Abstract: A projection 3 is pressed into first and second members W1 and W2 with a predetermined pressure, while rotating a rotary tool 1 at a preset rotational speed, such that the first and second members W1 and W2 are sandwiched by the rotary tool 1 and stationary tool 10. The projection 3 rotates in these members to cut member textures around it, thereby generating heat. Furthermore, the cuttings formed by cutting with the projection 3 are accumulated in the members and agitated by the two tools 1 and 10, to collide against the surrounding member textures and the projection 3, thereby generating heat. Also, a first shoulder 2 is pressed in with a predetermined pressure and rotated to generate heat, thereby fusing the cuttings. While the plastic flow of the surrounding member textures is promoted, the first shoulder 2 is held at the predetermined pressure and rotational speed. The pressure per unit area is thus increased to increase the volume of plastic flow.

Abstract: A method for processing workpieces by means of high-energy radiation, wherein the radiation is focused by a processing optic onto a processing site. The light radiation emanating form the workpiece is received by the same processing optic and is analyzed by a detector. An optical measurement with respect to the surface of the workpiece is performed in a processing area of the workpiece by means of an external source of measuring light, utilizing measuring light reflected from the processing area. The same processing optic is used to focus radiation onto the processing site and to receive radiation emanating from the workpiece at the processing site.

Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

Abstract: An exothermic welding system uses compressible layers of disposable refractory batting or gaskets to form a weld chamber for parts to be welded. The parts to be welded are layered with the batting between a base and a crucible platen supported by a clamping fixture. The layered batting is provided with the holes intersecting the parts to be welded. The holes form the weld chamber. The crucible platen is provided with a chamber for the exothermic material which when ignited forms molten metal which flows through a tap hole into the weld chamber. When the weld is made, the fixture is opened and the batting is discarded. The invention is also the method of forming the welded connection by compressing the layered batting and the parts to be welded to form the disposable weld chamber enabling a simpler and lower cost welding system to make a wide variety of connections not requiring a large inventory of special and costly refractory mold parts.

Abstract: A soldering iron comprises a tip end; a heater portion for electrically heating the tip end of the soldering iron; a holding portion provided at the rear end of the heater portion: a heat pipe structure provided in the holding portion; a first heat pipe holder for holding a frontal portion of the heat pipe structure to which heat generated at the heater portion is transferred; a second heat pipe holder for holding a rear part of the heat pipe structure; and a grip portion placed externally around the first heat pipe holder.

Abstract: Method for controlling the deposition of solder on a base metal or substrate is disclosed. The method comprises applying an attaching flux and finishing flux to a substrate, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the normally insoluble corrosive residues that would occur when the attaching flux is subjected to reflow conditions with the preform and substrate. Alternatively, the attaching flux may be applied to the preform and substrate before undergoing reverse reflow conditions and then the finishing flux is applied to the solder deposit and substrate and the same subjected to second reflow conditions. After each method, the residues left from the attaching flux which are solubilized by the finishing flux, are cleaned by washing with a typical solvent.

Abstract: An ultrasonic horn assembly for applying ultrasonic energy at an operating location which assembly includes a metallic fusion zone at an interface between adjacent horn assembly components. A method of manufacturing an ultrasonic horn assembly including forming this metallic fusion zone.