Patents Examined by Leigh M. Garbowski
  • Patent number: 11657207
    Abstract: A method comprises receiving an integrated circuit (IC) chip design, and generating, by one or more processors, a wafer image and a wafer target from the IC chip design. The method further comprises generating, by the one or more processors, sensitivity information based on a determination that the wafer image and the wafer target converge, and outputting the sensitivity information. The sensitivity information is associated with writing a mask written for the IC chip design.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: May 23, 2023
    Assignee: Synopsys, Inc.
    Inventor: Thomas Cecil
  • Patent number: 11651130
    Abstract: The present disclosure provides methods and devices for simulating a design, wherein the design comprises a main class with parameters and a plurality of instances of the main class, wherein the plurality of instances comprise a first instance and a second instance. The method includes: determining, by analyzing the design, a plurality of secondary classes associated with instantiating the main class, wherein the plurality of secondary classes are used as the parameters of the main class and comprise a first secondary class corresponding to the first instance and a second secondary class corresponding to the second instance; translating the design to generate a first temporary code associated with the plurality of instances; generating, based on the first temporary code, a plurality of instance machine codes corresponding to the plurality of instances; and simulating the design based on the plurality of instance machine codes.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: May 16, 2023
    Assignee: XEPIC CORPORATION LIMITED
    Inventor: Jinya Zhang
  • Patent number: 11651135
    Abstract: A method comprises receiving an integrated circuit (IC) chip design, and generating, by one or more processors and based on the IC chip design, dose information, a wafer image, and a wafer target. Further, the method comprises modifying, by the one or more processors, the dose information based on a comparison of the wafer image and the wafer target. Further, the method comprises outputting the modified dose information to a mask writing device.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: May 16, 2023
    Assignee: Synopsys, Inc.
    Inventor: Thomas Cecil
  • Patent number: 11651129
    Abstract: A method includes generating a plurality of vector sequences based on input signals of an electric circuit design and encoding the plurality of vector sequences. The method also includes clustering the plurality of encoded vector sequences into a plurality of clusters and selecting a set of encoded vector sequences from the plurality of clusters. The method further includes selecting a first set of vector sequences corresponding to the selected set of encoded vector sequences, selecting a second set of vector sequences from the plurality of vector sequences not in the first set of encoded vector sequences, and training, by a processing device, a machine learning model to predict power consumption using the first and second sets of vector sequences.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: May 16, 2023
    Assignee: Synopsys, Inc.
    Inventors: Chaofan Wang, Vaibhav Jain, Shekaripuram Venkatesh, Solaiman Rahim
  • Patent number: 11636245
    Abstract: Embodiments for tuning parameters to a synthesis program are provided. At least one set of parameter settings for the synthesis program is selected. A plurality of identical synthesis jobs for the at least one set of parameter settings is run in an iteration of the synthesis program. Results of the iteration of the synthesis program are analyzed utilizing a tuning optimization cost function. Combinations of the parameter settings are created based on the analysis. At least one synthesis job for is run each of the combinations of the parameter settings in a subsequent iteration of the synthesis program. The analysis of the results, the creating of the combinations of parameter settings, and the running at the at least one synthesis job for each of the combinations of parameter settings are repeated until an exit criteria has been achieved.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: April 25, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Matthew Mantell Ziegler, Lakshmi N. Reddy, Robert Louis Franch
  • Patent number: 11636244
    Abstract: Some aspects of this disclosure are directed automated performance tuning of a hardware description language (HDL) simulation system. For example, some aspects of this disclosure relate to a method, including generating, by a first subsystem optimizer, a plurality of recommendations corresponding to a first subsystem of a hardware description language (HDL) simulation system. The plurality of recommendations are generated by the first subsystem optimizer using one or more optimization applications. The method further includes generating, by the first subsystem optimizer, a first aggregate recommendation by combining the plurality of recommendations corresponding to the first subsystem of the HDL simulation system. The method further includes updating a configuration of the first subsystem of the HDL simulation system based on the first aggregate recommendation, wherein the HDL simulation system is configured to simulate a circuit design using the updated configuration during execution of the first subsystem.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: April 25, 2023
    Assignee: SYNOPSYS, INC.
    Inventors: Badri Prasad Gopalan, Melvin Cardozo, Deepesh Puthiya-Purayil, Vamsi Krishna Doppalapudi, Trinanjan Chatterjee, Yichun Wang
  • Patent number: 11630935
    Abstract: Computer-based simulation of a device under test (DUT) corresponding to a user circuit design includes providing an adapter configured to couple to the DUT during the computer-based simulation (simulation). The adapter is configured to translate incoming high-level programming language (HLPL) transactions into DUT compatible data for conveyance to the DUT and translate DUT compatible data generated by the DUT to outgoing HLPL transactions. A communication server is provided that couples to the adapter during the simulation. The communication server is configured to exchange the incoming and outgoing HLPL transactions with an entity executing external to the simulation. A communication layer client is provided that is configured to execute external to the simulation and exchange the incoming and outgoing HLPL transactions with the communication server.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: April 18, 2023
    Assignee: Xilinx, Inc.
    Inventors: Amit Kasat, Tharun Kumar Ksheerasagar, Hemant Kashyap, Madhusudana Reddy, Rohit Bhadana
  • Patent number: 11625525
    Abstract: Various embodiments provide for clustering-based grouping of cells in a cell library, which can be used for pruning the cell library. In particular, various embodiments provide for a clustering-based grouping of cells in a cell library based on a criterion (or cell attribute), and for pruning of the cell library based on the grouping of cells, which can optimize the cell library for the criterion. For instance, some embodiments provide for a clustering-based grouping of cells based on leakage power and then applying cell library pruning to optimize for cell leakage power.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: April 11, 2023
    Assignee: Cadence Design Systems, Inc.
    Inventors: Zhuo Li, Natarajan Viswanathan, Vitor Bandeira, Yi-Xiao Ding
  • Patent number: 11620429
    Abstract: The present invention relates to a method for superimposing at least two images of a photolithographic mask, wherein the method comprises the following steps: (a) determining at least one first difference of at least one first image relative to design data of the photolithographic mask; (b) determining at least one second difference of at least one second image relative to design data of the photolithographic mask, or relative to the at least one first image; and (c) superimposing the at least one first image and the at least one second image taking account of the at least one first difference and the at least one second difference.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: April 4, 2023
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Gilles Tabbone, Carsten Schmidt
  • Patent number: 11620426
    Abstract: A method in certain embodiments includes using a computer system that includes an EDA tool to generate a layout of an IC device; searching, using a statistical method such as Bayesian optimization process, for one or more input variable parameters, such as the dimensions of the IC device and the dimensions of the voltage areas in the IC device, that results in an optimal characteristic, such as power, performance or area (PPA) of the IC device. A computer system including one or more EDAs configured to perform the method is also disclosed.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: April 4, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shin-Chi Chen, King-Ho Tam, Yu-Ze Lin, Huang-Yu Chen
  • Patent number: 11615226
    Abstract: A recording medium includes simulation data input into a computing device executing a simulation of a semiconductor device, wherein the simulation data includes part shape information describing a shape of a part included in a simulation target circuit, model information describing operation and connection information of the simulation target circuit, and symbol information of the part included in the simulation target circuit, and the computing device causes the part shape information, the model information, and the symbol information to correspond to each other to execute the simulation of the semiconductor device.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: March 28, 2023
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Hitoshi Imi, Motochika Okano, Yoshinori Fukuba
  • Patent number: 11580289
    Abstract: A method for determining a patterning device pattern. The method includes obtaining (i) an initial patterning device pattern having at least one feature, and (ii) a desired feature size of the at least one feature, obtaining, based on a patterning process model, the initial patterning device pattern and a target pattern for a substrate, a difference value between a predicted pattern of the substrate image by the initial patterning device and the target pattern for the substrate, determining a penalty value related the manufacturability of the at least one feature, wherein the penalty value varies as a function of the size of the at least one feature, and determining the patterning device pattern based on the initial patterning device pattern and the desired feature size such that a sum of the difference value and the penalty value is reduced.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: February 14, 2023
    Assignee: ASML Netherlands B.V.
    Inventors: Roshni Biswas, Rafael C. Howell, Cuiping Zhang, Ningning Jia, Jingjing Liu, Quan Zhang
  • Patent number: 11574108
    Abstract: A partitioning method for partitioning a group of power-ground (PG) cells is disclosed. The method includes: placing at least one out-boundary PG cell on a substrate, wherein power strips of the at least one out-boundary PG cell are aligned with corresponding power rails on the substrate; and placing at least one in-boundary PG cell on the substrate, wherein power strips of the at least one in-boundary PG cell are aligned with corresponding power rails on the substrate.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: February 7, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen-Hung Lin, Yuan-Te Hou, Chung-Hsing Wang
  • Patent number: 11562117
    Abstract: Methods and systems are provided for protecting a circuit design for an integrated circuit. Logic circuits are identified in at least a portion of the circuit design for replacement. The logic circuits in the circuit design are replaced with a bitstream and configurable circuits that comprise memory circuits. A transformed circuit design is generated for the integrated circuit that comprises the configurable circuits. The configurable circuits in the transformed circuit design perform logic functions of the logic circuits when the bitstream is stored in the memory circuits in the configurable circuits.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: January 24, 2023
    Assignee: Intel Corporation
    Inventors: Nij Dorairaj, David Kehlet
  • Patent number: 11553597
    Abstract: Inter-alia, a method for manufacturing a three-dimensional light emitting appliance is disclosed, said method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, wherein the plurality of spots is substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, wherein the position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: January 10, 2023
    Assignee: Lumileds LLC
    Inventor: Barbara Muelders
  • Patent number: 11550981
    Abstract: This application discloses a distributed computing system implementing multiple participating processes to separately compile different portions of a circuit design describing an electronic device over multiple phases. The distributed computing system can implement a management process to utilize a synchronization protocol to identify operational states of the participating processes during compilation of the different portions of the circuit design, maintain the operational states of the participating processes, and separately determine when the participating processes have completed compilation of the circuit design portions for one of the phases based on the operational states of the participating processes.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: January 10, 2023
    Assignee: Siemens Industry Software Inc.
    Inventors: Vipul Kulshrestha, Amit Agrawal
  • Patent number: 11544436
    Abstract: Hardware-software interaction testing is performed using formal verification for language-specified hardware designs. A description of valid access using an interface for a configuration space of a language specified hardware design and a description of a valid output of the language-specified hardware design is received. Formal verification is performed on the language-specified hardware design using the interface for the configuration space according to the description of valid access using the interface. A sequence of access to the configuration space using the interface that causes a failure to produce the valid output of the language-specified hardware design according to the description of valid output to identify as an error for the language-specified hardware design.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: January 3, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Uri Leder, Ori Cohen, Benzi Denkberg, Max Chvalevsky
  • Patent number: 11526644
    Abstract: The disclosure provides using test processors to provide a more flexible solution compared to the existing DFX blocks that are used for controlling test networks in chips. The test processors provide a highly flexible solution since programming of the test processors can be changed at any time; even after manufacturing, and can support practically an unlimited number of core chips in any configuration. The high flexibility provided via the test processors can reduce engineering effort needed in design and verification, accelerate schedules, and may prevent additional tapeouts in case of DFX design bugs. By making debug and diagnosis easier by providing an opportunity to change debug behavior as needed, the time-to-market timeline can be accelerated. Accordingly, the disclosure provides a chip with a test processor, a multi-chip processing system with a test processor, and a method of designing a chip having a test processor.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: December 13, 2022
    Assignee: NVIDIA Corporation
    Inventors: Kaushik Narayanun, Mahmut Yilmaz, Shantanu Sarangi, Jae Wu
  • Patent number: 11514220
    Abstract: Predicting power usage of a chip may include receiving placement data describing a placement, within the chip, of a plurality of logical components of the chip; providing the placement data as an input to a neural network; and determining, by the neural network, based on the placement data, a predicted power usage of the chip.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: November 29, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Zhichao Li, Yaoguang Wei, Kai Liu, Su Liu, Manjunath Ravi
  • Patent number: 11507720
    Abstract: This disclosure relates to signal observability rating. In an example, a method can include propagating a clock signal through a respective module of a circuit design in a forward and backward direction, evaluating clock signal propagation results for the respective module based on a forward and backward clock signal propagation of the clock signal to compute an observability rating for a data signal to be processed by the respective module during formal verification, and updating a current observability rating of the respective property for the data signal to the computed observability rating.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: November 22, 2022
    Assignee: CADENCE DESIGN SYSTEMS, INC.
    Inventors: Matheus Nogueira Fonseca, Thamara Karen Cunha Andrade, Lars Lundgren, Breno Guimaraes