Abstract: A chip package including a substrate, a first conductive structure, and an electrical isolation structure is provided. The substrate has a first surface and a second surface opposite the first surface), and includes a first opening and a second opening surrounding the first opening. The substrate includes a sensor device adjacent to the first surface. A first conductive structure includes a first conductive portion in the first opening of the substrate, and a second conductive portion over the second surface of the substrate. An electrical isolation structure includes a first isolation portion in the second opening of the substrate, and a second isolation portion extending from the first isolation portion and between the second surface of the substrate and the second conductive portion. The first isolation portion surrounds the first conductive portion.

Abstract: A pixel structure includes an original light emitting diode die and a repairing light emitting diode die emitting light of a same color, and an extending conductor. The original light emitting diode die includes a first epitaxial layer, and a first electrode and a second electrode disposed at opposite sides of the first epitaxial layer. The repairing light emitting diode die includes a second epitaxial layer, and a third electrode and a fourth electrode disposed at a same side of the second epitaxial layer. The extending conductor includes a first portion, a second portion and a cut-off region. The first portion is electrically connected to the second electrode of the original light emitting diode die. The second portion is electrically connected to the third electrode of the repairing light emitting diode die. The cut-off region is located in the first portion or between the first portion and the second portion.

Abstract: There are provided semiconductor packages including a redistribution substrate and a semiconductor chip mounted on the redistribution substrate. The redistribution substrate may include a lower protective layer, a first conductive pattern disposed on the lower protective layer, a first insulating layer surrounding the first conductive pattern and disposed on the lower protective layer, and a second insulating layer disposed on the first insulating layer. The first insulating layer may include a first upper surface that includes a first flat portion extending parallel to an upper surface of the lower protective layer, and a first recess facing the lower protective layer and in contact with the first conductive pattern. The first recess may be directly connected to the first conductive pattern.

Abstract: A display device includes a display panel including a display area and a non-display area, a first output pad set, a second output pad set, and a buffer pad set that are disposed in the non-display area, and a path change circuit. In an exemplary embodiment, the path change circuit is configured to change a signal delivery path such that a signal delivered through the first output pad set or the second output pad set is delivered through the buffer pad set, when an enable signal is input.

Abstract: A display device including a display area and a sensor area which includes a transmission part comprises a substrate, display elements disposed on the substrate and including a first display element and a second display element spaced apart from each another with the transmission part therebetween, pixel circuits including a first pixel circuit electrically connected to the first display element and a second pixel circuit electrically connected to the second display element, and a light-shielding layer including a part overlapping the first pixel circuit and the second pixel circuit and the light-shielding layer includes a hole corresponding to the transmission part, the width of the hole of the light-shielding layer is less than a separation distance between the first display element and the second display element.

Abstract: A display device comprising: first and second pixels; a first data line connected to the first pixel and configured to have data voltages applied thereto; and a second data line connected to the second pixel, the second data line being adjacent to the first data line, and configured to have the data voltages applied thereto, wherein the first data line includes a 1A-th data line which is in a first data layer, and the second data line includes a 2B-th data line which is in a second data layer different from the first data layer.

Abstract: The display device includes a non-display area. The non-display area includes: a slit formed in an edge cover; a first conductive layer formed in the same layer as an anode, and being in contact with a cathode; and a second conductive layer formed in the same layer as a capacitance electrode and provided to overlap the slit.

Abstract: In a bending portion, a slit that exposes a resin substrate is formed in at least one inorganic insulating film, a first flattening film is provided so as to fill in the slit, each of a plurality of wiring lines is provided on the first flattening film and both end portions of the inorganic insulating film, the slit being formed at both end portions, a second flattening film is provided on each of the wiring lines, a plurality of conductive layers each having an island shape are provided on the second flattening film, and each of the wiring lines and a corresponding conductive layer are electrically connected via contact holes formed in the second flattening film.

Abstract: The present disclosure provides an organic light-emitting diode (OLED) display panel comprising a display area, a non-display, and a block area provided in the non-display area. The OLED display panel includes a signal trace layer, an organic film layer, and an anode layer which are sequentially located on the signal trace layer. The signal trace layer is provided with a signal trace in the non-display area. When an anode is formed on the anode layer, an anode material layer at least covering the exposed signal trace is formed in the corresponding block area, so as prevent mis-etching of the signal trace caused by the etching solution.

Abstract: A semiconductor device includes a substrate, a gate structure on the substrate, a first etch stop layer, a second etch stop layer, and an interlayer insulation layer that are stacked on the gate structure, and a contact plug penetrating the interlayer insulation layer, the second etch stop layer, and the first etch stop layer and contacting a sidewall of the gate structure. The contact plug includes a lower portion having a first width and an upper portion having a second width. A lower surface of the contact plug has a stepped shape.

Abstract: The disclosure provides a display panel, a manufacturing method thereof, and a display device. A display area is defined on a surface of the display panel, and a first electricity supply area and a second electricity supply area are disposed opposite to each other at two sides of the display area. The display panel includes a substrate layer, and a first metal layer and a second metal layer which are sequentially disposed on the substrate layer, and an insulating layer is further disposed between the first metal layer and the second metal layer in the display area.

Abstract: An organic light-emitting display device includes a substrate having a display region and a peripheral region, a plurality of pixels on the substrate in the display region, a first wiring and a second wiring on the substrate in the peripheral region, An insulation layer on the first and second wirings, the insulation layer covering a top surface and a sidewall of each of the first and second wirings, and an encapsulation layer on the plurality of pixels and on the insulation layer.

Abstract: A display panel includes a substrate including a display area and a transmission area arranged in the display area which is surrounded by a first side extending in a first direction, a second side extending in a second direction crossing the first direction, a third side facing the first side, and a fourth side facing the second side, pixels arranged in the display area, a first black line extending from the transmission area to the first side in a third direction different from the second direction and arranged with dummy pixels which do not emit light, and a second black line extending from the transmission area to the second side in a fourth direction different from the first direction and arranged with the dummy pixels which do not emit light, wherein the transmission area is arranged closer to the first and second sides than the third and fourth sides.

Abstract: In a step of forming a plurality of control lines composed of a first metal layer a first metal layer branch line is formed. In a step of forming a plurality of power source lines composed of a second metal layer a second metal layer connecting portion is formed that connects each power source line with the first metal layer branch line via an opening of a first insulating film. In a step of forming a plurality of data signal lines composed of a third metal layer that is formed on a second insulating film the first metal layer branch line formed in the opening of the first insulating and the second metal layer connecting portion formed in an opening of the second insulating film are etched.

Abstract: A semiconductor substrate and a method of manufacturing the same are provided. The semiconductor substrate includes a dielectric layer, at least one first conductive trace, and a conductive via. The dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface. The first conductive trace is disposed adjacent to the first dielectric surface of the dielectric layer. The conductive via is disposed adjacent to the second dielectric surface of the dielectric layer and connected to the first conductive trace, where the conductive via and the first conductive trace are connected at a first interface leveled with about a half thickness of the dielectric layer.

Abstract: A method of forming an integrated circuit structure includes forming an etch stop layer over a conductive feature, forming a dielectric layer over the etch stop layer, forming an opening in the dielectric layer to reveal the etch stop layer, and etching the etch stop layer through the opening using an etchant comprising an inhibitor. An inhibitor film comprising the inhibitor is formed on the conductive feature. The method further includes depositing a conductive barrier layer extending into the opening, performing a treatment to remove the inhibitor film after the conductive barrier layer is deposited, and depositing a conductive material to fill a remaining portion of the opening.

Abstract: A display device according to an embodiment of the present invention has a first substrate, a display region provided with a plurality of pixels on the first substrate, each of the plurality of pixels including a light-emitting element, a driving circuit provided along a first direction of the display region on the first substrate, a sealing film covering the display region, and stacking a first inorganic insulating layer, an organic insulating layer, and a second inorganic insulating layer in order from the light-emitting element, a second substrate on the sealing film, a through hole provided in the first substrate, the display region, and the second substrate; and a first region surrounding the through hole.

Abstract: An array substrate is provided, including a substrate, wherein the substrate is provided with a plurality of electrodes and a plurality of first signal lines, each of the electrodes being correspondingly connected with a first signal line. In some examples, the first signal lines extend in the same direction. In some examples, at least two of the plurality of first signal lines are located in different layers of an insulating spacer from each other. In some examples, orthographic projections on the substrate of at least two of the first signal lines in the different layers at least partially overlap. Accordingly, a light field display device comprising the array substrate is also provided. The array substrate can reduce a light-emitting point size and increase a density distribution of light-emitting points.

Abstract: A display panel is provided including a substrate including a display area comprising first pixels and a sensor area including second pixels and a transmission portion. A display element layer is disposed on the substrate, the display element layer comprising the first pixels electrically connected to a first thin film transistor and the second pixels electrically connected to a second thin film transistor. A conductive layer is disposed between the second thin film transistor and the substrate, the conductive layer having two or more steps at an edge thereof.

Abstract: The present invention provides an active matrix organic light emitting diode display panel including a display area with a recessed space and a concave area, wherein the concave area is connected to the display area and is disposed close to the recessed space, and the concave area is provided with an RC compensation capacitor therein, which is formed by voltage lines and a scanning lines. The active matrix organic light-emitting diode display panel provided by the present invention can reduce the phenomenon of screen-splitting between the concave area and the display area on the premise of ensuring a narrow upper frame.