Abstract: A Multi-Chip Module (MCM) package includes a substrate having a plurality of metal terminals and at least a first die attach area. An encapsulant is around the substrate including on at least a portion of the topside and at least a portion of the bottomside of the package. At least a first device including at least two device terminals is attached face up on the first die attach area. At least a second device including at least two device terminals is flip-chip attached and stacked on the first device. At least one of the first device and second device include a transistor. At least one metal clip is between the first device and second device including a plurality of clip portions isolated from one another connecting at least one device terminal of each of the first device and second device to respective metal terminals of the plurality of metal terminals.

Abstract: The present disclosure provides a display panel and a display device. The display panel includes a display area, a transmitted subregion, a substrate, an array layer, a first barrier wall, a second barrier wall, a light emitting layer, and a boss. The boss includes a plurality of step layers. The light emitting layer covers the boss and is discontinuous at the boss. The barrier walls and the boss prevent external substances from entering the panel through film layers, thereby effectively preventing continued diffusion of water vapor to protect the display panel.

Abstract: The Embodiments of the present disclosure relate to a display panel and a display device. The display panel includes a plurality of wirings extending parallel to a display surface of the display panel, and a plurality of light shielding portions extending parallel to the display surface, wherein projections of at least two wirings of the plurality of wirings with parallel extending directions on the display surface are within a projection of a same light shielding portion on the display surface, wherein at least a portion of each light-shielding portion has a curved profile along the extending direction.

Abstract: The present disclosure provides a wire structure for a display panel, a display panel, a display device, and a manufacturing method. The wire structure includes a first wire layer and a thermally conductive layer above the first wire layer. A thermal conductivity of the thermally conductive layer is greater than a thermal conductivity of the first wire layer.

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

Abstract: A display device may include a substrate, a pixel, a transistor, a data line, a connection line, a pad, and an electrostatic discharge protection circuit. The substrate may include a display area and a pad area. The pad area may overlap the display area. The pixel may be supported by the display area and may include a pixel electrode. The data line may be electrically connected through the transistor to the pixel electrode. The connection line may be supported by the display area and may be electrically connected through the data line to the transistor. The pad may be supported by the pad area and may be electrically connected through the connection line to the data line. The display area and the pad area may be positioned between the connection line and the pad. The electrostatic discharge protection circuit may be electrically connected to the connection line.

Abstract: A method for obtaining metallic carbon nanotubes is provided. An insulating substrate comprising hollow portions and non-hollow portions is provided. A plurality of electrodes is formed on a surface of the non-hollow portions. A plurality of carbon nanotubes is formed on a surface of the insulating substrate, and the carbon nanotubes stretch across the hollow portions. The insulating substrate, the plurality of electrodes and the carbon nanotubes are placed into a cavity, and the cavity is evacuated. A voltage is applied between any two electrodes, and photos of carbon nanotubes suspended between the two electrodes are taken. In the photo, darker ones are semiconducting carbon nanotubes, and brighter ones are metallic carbon nanotubes. Finally, the semiconducting carbon nanotubes are removed.

Abstract: A method of forming an IC structure includes providing a metal gate structure, a spacer adjacent the metal gate structure and a contact to each of a pair of source/drain regions adjacent sides of the spacer. The spacer includes a first dielectric having a first dielectric constant. The metal gate structure is recessed, and the spacer is recessed to have an upper surface of the first dielectric below an upper surface of the metal gate structure, leaving a lower spacer portion. An upper spacer portion of a second dielectric having a dielectric constant lower than the first dielectric is formed over the lower spacer portion. A gate cap is formed over the metal gate structure and the upper spacer portion. The second dielectric can include, for example, an oxide or a gas. The method may reduce effective capacitance and gate height loss, and improve gate-to-contact short margin.

Abstract: A display device can include a substrate on which reference lines extending in a first direction are disposed, first sub pixels which include a first circuit area disposed at one side of the reference lines and a first emission area disposed at another side of the reference lines, second sub pixels which include a second emission area disposed at one side of the reference lines and a second circuit area disposed at another side of the reference lines, first data lines which extend in the first direction and are disposed to be spaced apart from the reference lines, and second data lines which extend in the first direction and are disposed to be spaced apart from the reference lines.

Abstract: The present application discloses a display panel and a display device. The display panel includes: a base substrate; a reference power line, arranged in a non-display area and including a first electrode metal layer and a second electrode metal layer which are arranged on the base substrate in sequence in a stacked manner; and an encapsulating structure, arranged on a side, deviating from the base substrate, of the reference power line; where in the reference power line, a projection of the second electrode metal layer on the base substrate is arranged within a projection of the encapsulating structure on the base substrate, and a projection of the first electrode metal layer on the base substrate goes beyond an edge of the projection of the encapsulating structure on the base substrate.

Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes an elastic plate, a substrate, a temperature-controlled adhesive layer, at least one heating element and a power source. The elastic plate has a first surface and a second surface opposite to each other. The substrate is disposed on the first surface. The temperature-controlled adhesive layer is disposed on the second surface and configured to adhere the micro elements. The heating element is disposed between the second surface and the temperature-controlled adhesive layer. The power source is electrically connected with the heating element. A viscosity of the temperature-controlled adhesive layer varies with a temperature of the temperature-controlled adhesive layer.

Abstract: Embodiments provide a high aspect ratio via for coupling a top electrode of a vertically oriented component to the substrate, where the top electrode of the component is coupled to the via by a conductive bridge, and where the bottom electrode of the component is coupled to substrate. Some embodiments provide for mounting the component by a component wafer and separating the components while mounted to the substrate. Some embodiments provide for mounting individual components to the substrate.

Abstract: A display device includes: a first substrate including a first through hole, a display area, and a non-display area, the display area surrounding the first through hole, and the non-display area surrounding at least a portion of the display area; an inorganic insulating layer arranged in the display area; a display element layer including a display element and arranged on the inorganic insulating layer; a second substrate including a second through hole and arranged on the display element layer, the second through hole being connected to the first through hole; and a blocking member arranged along an inner surface of the first through hole and the second through hole, and extending from the first substrate to the second substrate, wherein the inorganic insulating layer extends from the display area to the inner surface of the first through hole.

Abstract: Embodiments relate to nanoporous copper interconnects on a first body for electrically connecting to a second body. To fabricate the nanoporous copper interconnect, a zinc-copper alloy is deposited on recesses on the surface of the first body, and then the zinc is removed from the zinc-copper alloy to obtain nanoporous copper. The first body and the second body can be attached using bonding between oxide surfaces of the two bodies or be provided with underfill between the two bodies. The nanoporous copper electrically connects to an active layer or electrical components of the first body and the second bodies. Using nanoporous copper as interconnects is advantageous, among other reasons, because it can be formed at a low temperature, it is compatible with a standard complementary metal-oxide-semiconductor (CMOS) process, it provides good electrical conductivity, and it is less likely to cause issues due to migration of material.

Abstract: A method of manufacturing a redistribution layer includes: forming an insulating layer on a wafer, delimited by a top surface and a bottom surface in contact with the wafer; forming a conductive body above the top surface of the insulating layer; forming a first coating region extending around and above the conductive body, in contact with the conductive body, and in contact with the top surface of the insulating layer in correspondence of a bottom surface of the first coating region; applying a thermal treatment to the wafer in order to modify a residual stress of the first coating region, forming a gap between the bottom surface of the first coating region and the top surface of the insulating layer; forming, after applying the thermal treatment, a second coating region extending around and above the first coating region, filling said gap and completely sealing the first coating region.

Abstract: A display device includes a substrate, a first transistor disposed on the substrate and including a first active pattern having a first channel region, a first source region, a first drain region, and a first gate electrode, a first insulating layer disposed on the first transistor, a first electrode disposed on the first insulating layer and electrically connected to the first drain region, a second insulating layer having a first opening disposed on the first electrode, a first contact member disposed on the second insulating layer and electrically connected to the first electrode through the first opening, a third insulating layer having a second opening disposed on the first contact member, and a pixel electrode disposed on the third insulating layer and electrically connected to the first contact member through the second opening, and an emission layer disposed on the pixel electrode.

Abstract: A manufacturing method of a display device includes: stacking a release layer over a first substrate; forming a conductor pattern over the release layer; forming a sacrificial layer over the conductor pattern; forming a second substrate including a polymer layer over the sacrificial layer; forming an electronic element including a conductor over the second substrate; forming a pattern corresponding to the conductor pattern in the sacrificial layer; transferring the conductor pattern from the release layer to a surface of the second substrate; and removing the first substrate, the release layer, and the sacrificial layer.

Abstract: A method of forming an integrated circuit includes forming a patterned mask layer on a material layer, wherein the patterned mask layer has a plurality of first features, and a first distance between adjacent first features of the plurality of first features. The method further includes patterning the material layer to form the first features in the material layer. The method further includes increasing the first distance between adjacent first features of the plurality of first features to a second distance. The method further includes treating portions of the material layer exposed by the patterned mask layer. The method further includes removing the patterned mask layer; and removing non-treated portions of the material layer.

Abstract: A display device includes a display substrate including a display area and a pad area located around the display area, a plurality of light emitting elements located on the display area of the display substrate, a plurality of pads located on the pad area of the display substrate and connected to the plurality of light emitting elements, a flexible film attached to the display substrate, a plurality of lead wires disposed on the flexible film, and an anisotropic conductive film disposed between the display substrate and the flexible film. The anisotropic conductive film is disposed between each of the plurality of pads and a corresponding one of the plurality of lead wires overlapping each other to form an electrical connection therebetween. The flexible film has a light transmittance of 60% or more with respect to a visible light wavelength range.

Abstract: An organic light emitting diode display includes: a substrate; a first electrode on the substrate; a second electrode opposed to the first electrode; a first light emitting unit and a second light emitting unit between the first electrode and the second electrode; and a charge generation layer between the first light emitting unit and the second light emitting unit. The first light emitting unit includes a blue fluorescent light emitting layer. The second light emitting unit includes a blue light emitting layer and a yellow light emitting layer.