Abstract: A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.

Abstract: A method for fabricating a magnetic head including a spin valve sensor having a sensor layer stack that includes a pinned magnetic layer, a spacer layer formed on the pinned magnetic layer, and a free magnetic layer formed on the spacer layer. In a preferred embodiment the spacer layer is comprised of CuOx. The method includes the plasma smoothing of the upper surface of the pinned magnetic layer prior to depositing the spacer layer, and a preferred plasma gas is a mixture of argon and oxygen.

Abstract: A sleeve housing for a motor includes a bearing member, which includes a cylindrical portion and a collar portion and is formed by press working or by forging. The bearing member is retained by a retaining portion which is a portion of a cutting tool and which relatively rotates with respect to the cutting tool in a concentric manner with a predetermined rotation axis in order to execute a cutting process on a lower portion of the collar portion with reference to an upper portion thereof, so as to effectively form the sleeve housing with very high precision.

Abstract: A lower electrode 3 including a low-temperature melting layer 3A and a high-temperature melting layer 3B having mutually different melting-start temperatures is provided between a vibration plate 2 and a piezoelectric layer 4. In a calcination step of calcinating the lower electrode 3, the calcination is performed at a low temperature at which only the low-temperature melting layer 3A melts, and in an annealing-process step of the piezoelectric layer 4, the annealing process is performed at a high temperature at which the high-temperature melting layer 3B melts. At this time, in the calcination step, the melting of platinum nano-particles occurs in the low-temperature melting layer 3A, rendering the adhesion and diffusion-preventive effect. Further, in the annealing step, in the high-temperature melting layer 3B, platinum particles are melted, rendering the adhesion and diffusion-preventive effect.

Abstract: A tool for effecting attachment of an electrical terminal terminated on a wire with respect to a mating electrical contact is provided including an elongate tubular body having a first opened end, a second opened end and a continuous slot from the first to the second opened end. The continuous slot defines a pair of inwardly deflectable opposed sidewalls, wherein the wire may be loosely received between the opposed sidewalls. A first recessed stop toward the first opened end of the tubular body is adapted to seat at least the terminal at the first opened end. The opposed sidewalls are inwardly deflectable so as to grip the wire to effect attachment to the mating electrical contact.

Abstract: A method for manufacturing a multilayer chip capacitor includes: forming screen patterns on mother green sheets such that a widthwise margin is not formed on the mother green sheets, the screen patterns are spaced apart from each other in the width direction and the longitudinal direction, and a width of each screen pattern is greater than a spacing between the adjacent screen patterns; forming internal electrode patterns on the mother green sheets; forming a stack of the mother green sheets; forming a capacitor body having internal electrodes by cutting the stack of the mother green sheets along cutting lines arranged in the width direction and the longitudinal direction; forming chip-protecting side members on both sides of the capacitor body such that the chip-protecting side members contact both sides of the internal electrodes, respectively; and forming a pair of terminal electrodes on the outer surface of the capacitor body.

Abstract: Method for producing parts for passive electronic components according to which: a laminated strip (1) is produced which is constituted by at least one stack of a thin metal strip and a layer of adhesive material, and at least one part (6) is cut from the laminated strip (1), the cutting operation being carried out using a method which comprises at least one step for etching by means of sandblasting. Parts produced.

Abstract: The present invention provides an electronic device with improved characteristics and a method of making the electronic device. In a method of making an electronic device (piezoelectric device) 74 according to the present invention, an outer edge R1 of a piezoelectric film 52A formed on an electrode film 46A of a laminate 60 is located inside an outer edge R2 of the electrode film 46A. For this reason, in removal of a monocrystalline Si substrate 14 from a multilayer board 61, where an etching solution permeates between polyimide 72 and laminate 60, the etching solution circumvents the electrode film 46A before it reaches the piezoelectric film 52A. Namely, a route A of the etching solution to the piezoelectric film 52A is significantly extended by the electrode film 46A. In the method of making the electronic device 74, therefore, the etching solution is less likely to reach the piezoelectric film 52A.

Abstract: System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

Abstract: A hand-held tool for terminating connectors onto a coaxial cable has an elongated body and an end stop and plunger on the body, the plunger being controlled by a lever arm which will axially advance the plunger toward and away from the end stop to radially compress a portion of the connector into firm crimping engagement with the end of the coaxial cable. To accommodate different lengths of connectors, a receiver is mounted on the plunger for insertion of different length adapter tips to vary the axial spacing between the receiver and the end stop according to the length of connector being terminated; and in still another form the body may include a hinged adapter adjacent to the end stop to vary the effective distance between the end stop and plunger according to the length of fitting being terminated.

Abstract: An alignment fixture includes a rotor fixture, a stator fixture and a sensor system which measures a rotational displacement therebetween. The fixture precisely measures rotation of a generator stator assembly away from a NULL position referenced by a unique reference spline on the rotor shaft. By providing an adjustable location of the stator assembly within the housing, the magnetic axes within each generator shall be aligned to a predetermined and controlled tolerance between the generator interface mounting pin and the reference spline on the rotor shaft. Once magnetically aligned, each generator is essentially a line replaceable unit which may be readily mounted to any input of a multi-generator gearbox assembly with the assurance that the magnetic alignment will be within a predetermined tolerance.

Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Abstract: A component recognition apparatus for a chip mounter includes a head portion having a frame and at least one nozzle portion installed on the frame, the nozzle portion picking up an electronic component and mounting the electronic component on a substrate, a camera coupled with the frame and comprising an imaging device, and a mirror portion having a mirror support portion installed on the frame and a mirror held by the mirror support portion in a space that does not interfere with the movement path of the electronic component held by the nozzle portion. The camera includes a lens portion, and an image of the electronic component held by the nozzle portion is reflected by the mirror, passes off-axis through the lens portion, and is formed on the imaging device.

Abstract: An user-friendly impact tool for wire end termination in which the pre-set compression of a main drive spring is adjusted by hand with an adjustment screw having a knurled knob that is both visible and hand-accessible through an opening in the housing wall, and also having a vernier scale formed partly on the outer housing wall surface and partly on the knurled knob itself to correctly indicate the pre-load adjustment position of the drive spring.

Abstract: Provided is a component mounter. The component mounter comprises: a bed; a component supply unit; a conveyor transferring at least one PCB to a specified mounting position; a plurality of head units having at least one nozzle for picking up the electronic component from the component supply unit and for mounting it to the PCB; first and second Y axis transfer mechanisms; an X axis transfer mechanism having a first end of mounted to the first Y axis transfer mechanism and the second end mounted to the second Y axis transfer mechanism; a first driving unit controlling the movement of the first end of the X axis transfer mechanism along Y axis; and a second driving unit controlling the movement of the second end of the X axis transfer mechanism along the Y axis, independently of the first driving unit.

Abstract: An apparatus that fixes a stator of a motor of a reciprocal compressor is provided. The apparatus includes a front frame, a cylinder inserted into and coupled to the front frame, an outer stator supported by and contacting the front frame, an inner stator formed in a cylindrical shape and inserted onto an outside circumferential surface of the cylinder with a predetermined interval from an inside diameter of the outer stator, a mover inserted between the outer stator and the inner stator and coupled to a piston inserted into the cylinder, and a stator fixing device incorporated with the front frame to pass through the cylinder or the inner stator in a longitudinal direction that supports and fixes both sides of the inner stator.

Abstract: A wedge connection tool for securing a tap connector having a C shaped member and a wedge using a ram tool. The tool head comprises an elongate base member comprising first and second ends. A collar at the first end of the base member has a through opening for receiving a ram tool. A head at the second end of the base member is aligned with the collar through opening to engage a C shaped member. A cable stop plate is mounted to the head for limiting movement of a tap line cable received in a C shaped member when a ram tool is securing a tap connector.

Abstract: A method for fabricating an interposer includes: forming on one primary surface of a first substrate a thin-film capacitor including a first capacitor electrode, a crystalline capacitor dielectric film formed on the first electrode and a second capacitor electrode formed on the dielectric film; and forming on the primary surface of the first substrate and the capacitor a first layer as semi-cured, and a first partial electrode to be a part of a through-electrode, buried in the first resin layer and electrically connected to the first electrode or the second electrode.

Abstract: A wire processing unit has a crimp head moved in a “z” direction by an eccentric drive and a crimping tool arranged on the crimp head moves with it. The crimp head also moves a pin connected to a lowering unit that has a C-shaped bracket on which the gripper unit is arranged. When a crimping punch moves, the gripper unit is moved with it, and the wire-end held by a gripper pair is inserted into an upwardly-open conductor crimp and an insulation crimp respectively. A cutting head of a cutting unit cuts off the leading wire-end, removes the insulation, and separates contacts with defective crimp fastening from the wire-end.

Abstract: A method of making a device for measuring deformation includes a step of depositing a silicon adhesion underlayer on a silicon carbide surface by chemical vapor spraying, and a step of depositing a coating on the silicon adhesion underlayer by atmospheric thermal spraying.