Abstract: A method includes heating a housing of an electric machine to thermally expand the housing, positioning a mount having power and control electronics assembled thereon and in contact therewith in the housing and against an internal stop defined within the housing, and allowing the housing to cool and thermally contract against the mount thereby forming an interference fit between the housing and the mount. The interference fit secures the mount within the housing. The mount and the housing have coefficients of thermal expansion such that the interference fit is maintained across an operating temperature range of the machine. The electric machine may also include a segmented or non-segmented stator within the housing.

Abstract: The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.

Abstract: Method of connecting an antenna wire to a transponder chip. A transponder chip in a recess in a substrate, and an antenna wire mounted to the surface of the substrate and having end portions spanning the recess. The end portions are spaced wider than the chip, to allow the chip to be inserted into the recess from the same side as the antenna. The end portions may then be repositioned to be over corresponding terminals of the chip, for bonding thereto. The recess may be substantially larger than the chip, so that the chip and/or the substrate may be moved from side-to-side in the recess for positioning the terminals under the end portions, for bonding thereto. Insulation may be removed from the end portions prior to mounting the chip in the recess, to enhance subsequent bonding.

Abstract: An interposer bonding device 3 is intended for bonding an interposer 10 having an interposer-side terminal to a base circuit sheet 20 provided with a base-side terminal. The interposer bonding device 3 has a press anvil 31 that holds the base circuit sheet 20 on which the interposer 10 is laminated and a bonding head 32 that moves relatively with respect to the press anvil 31. The bonding head 32 has a pressing surface 320 that presses the rear surface of the interposer by abutting against this surface. The pressing surface 320 scans the rear surface of the interposer 10 by the relative movement of the bonding head 32 with respect to the press anvil 31 and presses the whole surface of the interposer-side terminal 12 toward the base circuit sheet 20.

Abstract: According to embodiments of the present invention, a method for manufacturing a pattern of conductive elements on a substrate is provided. The method includes depositing in a vacuum deposition chamber an electrically conductive material onto the substrate to form a base layer. Then, the method includes selectively applying an electric insulating agent on selective areas of the base layer. Then, areas of the base layer that are not covered with the insulating material are electroplated with a second electrically conductive layer. The electric insulating agent is then removed from the substrate and the base layer is chemically etched thus removing the base layer that was covered with the insulating material and selectively exposing the substrate to create the pattern of conductive objects on the substrate.

Abstract: A method of making capacitor structure includes arranging first-layer conducting strips on a first layer of an integrated circuit chip, and arranging second-layer conducting strips on a second layer of the integrated circuit chip. The first-layer conducting strips and the second-layer conducting strips can be arranged as respective piecewise spirals. The second-layer conducting strips are arranged overlying and electrically separated from the first-layer conducting strips, and the method further includes electrically connecting the first-layer conducting strips with the second-layer conducting strips.

Abstract: In a linear driving mechanism for electronic component mounting apparatus that performs mounting operation for mounting an electronic component on a substrate and linearly drives a transfer beam 8 in a Y direction using a linear motor, an object to be driven and the linear motor are disposed such that a position P of thrust generated by the linear motor for driving the transfer beam 8 in the Y direction approximately corresponds to a central position D1 of inertial resistance of the object to be driven comprising movable portions such as transfer beam 8, loading head 9, and transfer plate 12. Accordingly, twisting moment applied to the transfer beam 8 due to inertial force is eliminated in acceleration/deceleration, and loading position accuracy is ensured and a component life can be lengthened.

Abstract: In the disclosed method of manufacturing an implantable wireless sensor, a cavity is etched in one side of a first substrate. A conductive structure are formed on the base of the cavity. A second conductive structureare formed on a surface of a second substrate, and the two substrates are mutually imposed such that the two conductive plates and coils are disposed in opposed, spaced-apart relation. A laser is then used to cut away perimeter portions of the imposed substrates and simultaneously to heat bond the two substrates together such that the cavity in the first substrate is hermetically sealed.

Abstract: A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.

Abstract: The present invention relates to a Jig and method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Abstract: A method for manufacturing a chip antenna is invented, which comprises forming multiple meandered lines, folding the meandered line set, and forming a package to encapsulate a three-dimensional antenna structure. The material of the package is a dielectric composite formed with polymers and ceramic powders, which has a dielectric constant designed for the antenna. The characteristics of the chip antenna are determined by the structures of the antenna body and the dielectric constant of the package. Thus, a requirement for miniature structures in antenna applications can be satisfied.

Abstract: A package removal device is for removing a package (5) from a component band (1) to expose a carrier band (2). The package removal device includes a stand (10), a first scrolling unit includes a first gear (52), and a second scrolling unit includes a second gear (85). The stand includes a platform (12) with an import end (14a) and an export end (14b). The export end includes a locating gear (18) mounted thereon, a first exit (24), and a second exit (22). The component band is separated into the package and the carrier band in the export end. The first gear meshes with the second gear to output the package from the first exit. The locating gear engages the carrier band to output the carrier band from the second exit.

Abstract: A substrate accommodating tray pallet has a substrate in a horizontal state, includes openings for inserting substrate removal tools for raising the substrate, and is used for transferring substrate accommodating trays which can be vertically stacked, wherein: the substrate accommodating trays are to be mounted on an upper surface; and substrate removal tool insertion openings for inserting the substrate removal tools are positioned so as to oppose openings of the mounted substrate accommodating trays.

Abstract: A powder compaction process using opposed rib and channel punches which are interleaved and a production method are used to produce capacitor elements having a uniform compaction density and which are free of surface imperfections.

Abstract: A wire inserting method comprises a pipe inserting step of inserting one pipe (5) into all through-holes (11) under the state where the plurality of through-holes (11) are arranged on the same axis, a wire inserting step carried out after, or in parallel with, the pipe inserting step, for inserting the electrode wire (2) through the pipe (5), and a pipe removing step of pulling out only the pipe (5) from the through-holes (11) after the wire insertion step.

Abstract: An apparatus for manufacturing an electric motor having a laminated core structure formed by a plurality of core plates made of rolled material of electromagnetic sheet steel. The core plates are manufactured by punching rolled electromagnetic sheet steel in a die set. The rolled electromagnetic sheet steel is displaced angularly relative to the die set. The core plates have rolling directions of the electromagnetic sheet steel angularly displaced by a machine angle determined in accordance with the number of slots or poles provided in the laminated core structure so that a phase difference of cogging torques produced by magnetic anisotropy of the core plates is substantially 180°.

Abstract: A method of manufacturing an actuator device configured to prevent separation of a vibration plate and to enhance durability and reliability, and a liquid-jet apparatus are provided. The method includes the steps of forming a vibration plate on one surface of a substrate, and forming a piezoelectric element having a lower electrode, a piezoelectric layer, and an upper electrode on the vibration plate. The step of forming a vibration plate at least includes an insulation film forming step of forming an insulation film made of zirconium oxide by forming a zirconium layer on the one surface side of the substrate in accordance with a sputtering method and subjecting the zirconium layer to thermal oxidation by inserting the substrate formed with the zirconium layer to a thermal oxidation furnace heated to a temperature greater than or equal to 700° C. at a speed greater than or equal to 200 mm/min.

Abstract: Disclosed herein is a jig for assembling a rotor. The jig includes an upper jig part, a lower jig part, a support plate, a guide jig part, and a spring. The upper jig part has a pressure protrusion for press-fitting a rotating shaft, and applies pressing force to the rotating shaft. The lower jig part supports a rotor casing in a direction which is opposite the acting direction of the pressing force. The support plate is mounted to the lower jig part, and supports the rotor casing in a direction which is opposite that of the force for press-fitting the rotating shaft. The guide jig part supports the rotor casing in a direction which is opposite that of reaction force generated in the rotor casing by the support plate. The spring elastically biases the guide jig part towards the rotor casing.

Abstract: A component-holding-tape connecting apparatus for connecting two component holding tapes through a connecting member, by caulking end portions of the respective two component holding tapes and the connecting member in a caulking position. The apparatus includes: (a) a supplying device supplying the connecting members to the caulking position; (b) a holding device holding, in the caulking position, the end portions of the respective two component holding tapes and the connecting member which is supplied by the supplying device; and (c) a caulking device caulking the end portions of the respective two component holding tapes and the connecting member which are held by the holding device, by causing caulking claws of the connecting member, to pierce through each the end portions of the respective two component holding tapes, and deforming the caulking claws. The supplying device includes a rotary body positioning the connecting members one by one in a predetermined position.

Abstract: Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include using a position sensitive device that measures the position of the placement head relative to the workpiece as the placement head travels towards and away from the workpiece during a placement cycle. The output of this sensor is used to selectably trigger the acquisition of the images used to measure a placement characteristic of the component placement machine.