Abstract: A method for manufacturing an electrolytic capacitor with improved deformation qualities includes impregnating an electrolytic capacitor with a first electrolyte, aging the electrolytic capacitor after impregnating and reimpregnating the electrolytic capacitor with a second electrolyte. The water content of the second electrolyte is lower than the water content of the first electrolyte. The second electrolyte may also have a lower viscosity and a higher conductivity than the first electrolyte.

Abstract: A method of insulating a coil of an electrical machine includes applying an insulating varnish to a coil of conductive wire. The varnish includes (i) a resin; (ii) a first catalyst having a first activation temperature, the first catalyst being active at room temperature; and (iii) a second catalyst with a second activation temperature substantially higher than the first activation temperature. The varnish is allowed to partially cure at room temperature. The coil is mounted to a yoke to form a rotor of the electrical machine. The rotor is operated so as to heat the coil and activate the second catalyst to complete curing of the varnish.

Abstract: A method for making plural plated through holes in a single circuit board via is provided. The method includes plating copper in the walls of said circuit board via to form a first plated through hole and applying a thin layer of first adhesive promotor to the surface of said plated via. The method further includes vacuum depositing an organic layer having a high dielectric strength unto said layer of first adhesive promoter and applying a second layer of adhesive promoter over said organic layer. The method even further includes plating copper over said second layer of adhesive promoter to form a second plated through hole in said circuit board via.

Abstract: An apparatus is provided for forming a seal within a ferrule having a compression ring disposed therein. The apparatus comprises a frame assembly for crimping a portion of the ferrule, and a push rod assembly coupled to the frame assembly. The push rod assembly is capable of independent articulation with respect to the frame assembly and is configured to compress the compression ring within the ferrule.

Abstract: To provide a method for manufacturing a quartz piece which can suppress the deterioration of the CI and the temperature characteristic failure by forming the end surface of the quartz piece perpendicularly. A method for manufacturing a quartz piece that has a shape having two sides facing each other from a quartz substrate, includes the steps of: forming an etching mask provided with an opening area for forming the outside shape along one side out of the two sides which face each other, and provided with no opening area on the other side out of the two sides facing each other, on one surface side of the quartz substrate; and forming an etching mask provided with an opening area for forming an outside shape along the other side out of the two sides which face each other, and provided with no opening area on the one side, on the other surface side of the quartz substrate.

Abstract: A method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.

Abstract: Methods of making metal/dielectric/metal structures include casting copper slurry onto a fugitive substrate to form the first electrode and subsequently casting dielectric and copper slurries onto the first electrode, removing the fugitive substrate and co-firing the structure, wherein the dielectric comprises glass in an amount that is less than 20% by weight of the total inorganic composition and the dielectric achieves substantially complete densification. Alternatively, a metal tape and a dielectric tape, comprising glass in the above amount, may be formed and laminated together to form a metal/dielectric/metal green tape structure, which is co-fired, such that the structure achieves substantially complete densification.

Abstract: /The present invention provides a method of use for a monolithic device utilizing cascaded, switchable slow-wave CPW sections that are integrated along the length of a planar transmission line. The purpose of the switchable slow-wave CPW sections element is to enable control of the propagation constant along the transmission line while maintaining a quasi-constant characteristic impedance. The method can be used to produce true time delay phase shifting components in which large amounts of time delay can be achieved without significant variation in the effective characteristic impedance of the transmission line, and thus also the input/output return loss of the component. Additionally, for a particular value of return loss, greater time delay per unit length can be achieved in comparison to tunable capacitance-only delay components.

Abstract: Disclosed herein is a method of manufacturing a medical device, catheter or lead having electrically conductive traces and external electrical contacts. Each trace may be in electrical connection with one or more external electrical contacts. More specifically, each trace is typically electrically connected to a single contact. The traces and contacts may assist in diagnosis and/or detection of bio-electrical signals emitted by organs, and may transmit such signals to a connector or diagnostic device affixed to the catheter. The external electrical contacts may detect bioelectric energy or may deliver electrical energy to a target site. Also disclosed herein is a medical device made in accordance with the method described above.

Abstract: A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.

Abstract: The present invention relates to a process for producing a block of low-frequency piezoelectric composite material having rows of superposed ceramic posts embedded in a dielectric. This process includes the production of the block of composite material from two superposed identical half-blocks, produced by cutting into a single pre-machined piezoelectric ceramic block. According to the invention, the block of ceramic material thus constituted is then machined so as to form a structure comprising rows of aligned posts, each post being formed from two elementary posts facing each other in strict alignment. The ceramic structure thus produced is then integrated into an appropriate dielectric matrix. The block thus produced is intended to be used for manufacturing acoustic transducers from composite materials. The invention relates in particular to the field of sonar detectors designed to detect objects located at a relatively short distance from the detector.

Abstract: A method for manufacturing electronic modules from a moulded module strip having a laminate including at least one conductive layer, and one or more dies and or surface mounted devices arranged on an upper surface of the laminate and embedded by a moulding compound, includes the steps of: cutting partway through the laminate reaching at least through the uppermost of the at least one conductive layers and thereby creating a cut of width in the laminate; applying a conductive coating covering the upper surface of the laminate, and further covering all surfaces of the cut, the conductive coating contacting the uppermost conductive layer in the laminate; singulating the moulded module strip into separate electronic modules by cutting all the way through the laminate by creating a second cut in said first cut, the second cut having a width d smaller than the width of the first cut.

Abstract: Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.

Abstract: A manufacturing method of a multilayer substrate that suppresses relative displacement of layers and forms interconnecting portions electrically connecting layers having an accurate positioning. A manufacturing method of a multilayer substrate for laminating, via an insulating film, a wiring layer formed by patterning a conductive film comprises providing a positioning hole in a conductive film laminated at the beginning and patterning a second and/or any subsequent wiring layers after identifying a position of an identification section. Interconnecting sections for interconnecting wiring layers are formed using the identification section.

Abstract: A production method of a multilayer electronic device, comprising the steps of forming an electrode layer 12a on a first support sheet 20; forming a green sheet 10a on a surface of the electrode layer 12a to obtain a green sheet 10a having an electrode layer 12a; stacking the green sheets 10a, each having the electrode layer 12a, to form a green chip; and firing the green chip: wherein before stacking the green sheet 10a having the electrode layer 12a, an adhesive layer 28 is formed on a surface on the opposite side of the electrode layer side of the green sheet 10a having the electrode layer 12a; and the green sheet 10a having the electrode layer 12a formed thereon is stacked via the adhesive layer 28.

Abstract: A method of providing a housing assembly for a permanent magnet electric motor provides a frame holder having external surface features at an end thereof defining bearing support features. A plastic frame is provided over a portion of the frame holder. The plastic frame has internal surfaces features corresponding to the external surface features of the frame holder. The plastic frame has lamination receiving portions. Permanent magnets are placed adjacent to portions of the frame holder and between the lamination receiving portions of the plastic frame. A ferrous lamination is wound over the lamination receiving portions and the magnets to define flux structure.

Abstract: A device for holding electrical wires that supply power to an in-wheel motor. A clamp for restricting movement of the electrical wires only in a longitudinal direction is provided to a front area in which the electrical wires fixed at one ends to the motor are bent at about 90°. A fixing member for fixing the rotation and longitudinal movement of the wires is provided in proximity to the power source.

Abstract: A mounting device, for mounting a plurality of buttons on a product, includes a supporting member, a punching member, and a driving member The supporting member includes a supporting panel, a plurality of holding portions fixed on the supporting panel for supporting the product, a molding board having a plurality of molding holes a platform, and a base fixed on the platform for supporting the molding board. The punching member includes a retaining member positioned above the supporting member, and a plurality of cutters fixed to the retaining member The cutters cut the buttons off a button assembly, and couple to a vacuum generator for creating suction to hold the buttons. The driving member drives the punching member to mount the buttons on the product.

Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.