Abstract: A wire-processing apparatus has grippers feeding a wire to processing stations for producing wire end connections. A holder is used to inspect the wire end connection, wherein the linear movement of the grippers is used for the automated inspection of the wire end connection by applying a pull out force along a longitudinal axis of the wire while the holder is retaining the connection.

Abstract: In a method or system for producing a helical stator, a stator core strip is provided having a base portion with spaced tangs extending from the base portion. The strip is driven in a feed direction toward a bending region. At the bending region the strip is bent with an outside pressure member positioned to apply pressure at an outside edge of the strip base portion and with an inside pressure wheel having a plurality of teeth. A backstop surface of the teeth contact an inside edge of the base portion between adjacent tangs to support the base portion as the strip is bent by the outside pressure member. A winding arbor receives the bent strip to collect multiple turns of the bent strip to form the helical stator.

Abstract: A method of forming a piezoelectric actuator of an inkjet head formed on a vibrating plate to provide a driving power for ejecting ink to each of pressure chambers is provided. The method includes forming a lower electrode on a vibrating plate, forming a piezoelectric layer on the lower electrode to be located above each of pressure chambers, forming a protecting layer covering the lower electrode and the piezoelectric layer, exposing an upper surface of the piezoelectric layer by decreasing a thickness of the protecting layer and the piezoelectric layer, forming an upper electrode on the upper surface of the piezoelectric layer, removing the protecting layer. According to the present invention, since the piezoelectric layer having a flat upper surface is formed in uniform figure, area and thickness of the upper electrode formed thereon is uniformly controlled.

Abstract: A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all times to make the inside of a suction chamber a negative pressure before chucking a workpiece, completion of chucking is detected based on a pressure value detected by a pressure sensor after chucking the workpiece, and the workpiece is unchucked by having a valve close an exhaust port to raise the pressure inside an exhaust chamber and introducing pressurized air from the ejector unit to the suction chamber.

Abstract: A progressive die assembly and method for manufacturing lamina stacks from a strip of substantially planar material, in which at least some of the individual laminas are formed with portions which extend from, or are otherwise not within, the plane of the material strip. The die assembly includes die stations having punches for punching features substantially within the plane of the strip corresponding to individual laminas, such as lamina profiles and lamina interlock features. Additionally, the die assembly also includes at least one forming station which includes a selectively actuable forming tool which is configured to form a lamina portion in the strip which is disposed outwardly of the strip plane, such as by bending a portion of the strip.

Abstract: Described herein are methods for making articles comprising a dielectric layer formed from any solution composition that can form barium titanate during firing and containing manganese in an amount between 0.002 and 0.05 atom percent of the solution composition, wherein the dielectric layer has been formed on metal foil and fired in a reducing atmosphere.

Abstract: The present invention relates to a method of manufacturing a piezoelectric vibration element unit used for an inkjet recording head. The method includes the steps of alternately laminating conductive layers and piezoelectric material layers, sintering a laminated structure after the conductive layers and the piezoelectric layers are laminated to a predetermined thickness, forming external connection electrodes on surfaces of the sintered structure, and fixing a non-vibration region of the sintered structure onto a fixing plate. A region of the structure where the conductive layers are formed is cut into drive piezoelectric vibration elements, and a region of the structure where the conductive layers are not formed is cut into a dummy piezoelectric element.

Abstract: An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.

Abstract: The invention concerns a method of making multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. According to the inventive method, a thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically on the side(s) of the heat resistant film to be attached to an electrically conductive layer having an electrical resistance material layer thereon. Attaching the adhesive to the heat resistant film rather than the electrically conductive layer streamlines the manufacturing process, particularly in the formation of the electrical resistance material layer onto the electrically conductive layer. This also results in better precision and uniformity of the multilayered construction.

Abstract: A method of manufacturing a superconducting wire includes the step of drawing a wire formed by coating raw material powder for a superconductor with a metal, the step of first rolling rolling a multifilamentary wire after the step of drawing, and the step of first sintering sintering the multifilamentary wire after the step of the first rolling. The method further includes the step of holding a clad wire, a multifilamentary wire, or a multifilamentary wire under a reduced-pressure atmosphere in at least one of an interval between the step of drawing and the step of the first rolling and an interval between the step of the first rolling and the step of the first sintering.

Abstract: A tool for installing compression connectors of various sizes and types on the end of a coaxial cable has a base mounting at least one movable anvil for engaging at least one length of connector. The base further incorporates a fixed anvil for engaging at least a second length of connector. The movable anvil defines an aperture or exit surfaces shaped to permit easy entry and exit of a cable while still applying a suitable retention force to an inserted cable. A slidably mounted plunger cooperates with the anvils to compress a connector.

Abstract: A method of manufacturing a microwave antenna assembly includes the step of providing a proximal portion having an inner conductor and an outer conductor. Each of the inner and outer conductors extend through the proximal portion and the inner conductor is disposed within the outer conductor. The method also includes the step of placing a junction member adjacent to a distal end of the proximal portion such that the inner conductor extends through a channel defined in the junction member. The method also includes the step of placing a proximal end of a distal portion adjacent to a distal end of the junction member such that the inner conductor extends within a channel defined within the distal portion. The method also includes the step of affixing the inner conductor to the distal portion such that the proximal portion and the distal portion apply a compressive force on the junction member.

Abstract: An assembly for a semiconductor package comprises an electrical connector and a tool located upon the electrical connector. The electrical connector has an insulating housing and a plurality of terminals adapted for electrically connecting with the semiconductor package. The tool is formed with a body having a through hole, and a funnelform casing formed at a bottom end of the through hole for aligning and guiding the semiconductor package into the electrical connector.

Abstract: A clamping device for a flexible substrate is provided. The clamping device includes a carrier board. The carrier board has a fixed positioning assembly and a plurality of movable positioning assemblies. The fixed positioning assembly and the movable positioning assemblies are disposed in locations that almost correspond to a plurality of through holes on the flexible substrate. The fixed positioning assembly includes a hole body with a positioning hole and a dowel pin. Each movable positioning assembly includes a hole body with a positioning hole, a plurality of curved extending arms and a dowel pin. Each curved extending arm is connected to the hole body and the carrier board and the dowel pin is inserted into the positioning hole.

Abstract: A device and method for bonding objects to be bonded each having a metal bonding portion on a substrate, comprising cleaning means for exposing the metal bonding portions to a plasma having an energy enough to etch the surfaces of the metal bonding portions at a depth of 1.6 nm or more over the entire surfaces of the metal bonding portions under a reduced pressure and bonding means for bonding the metal bonding portions of the objects taken out of the cleaning means in an atmospheric air. By using a specific scheme, metal bonding portions after the plasma cleaning can be bonded in the atmospheric air, thereby significantly simplifying the bonding process and the whole device and lowering the cost.

Abstract: A method of manufacturing an inkjet head at a low cost is provided. The inkjet head has a passage unit. A plurality of plates are laminated together to form the passage unit. The passage unit has individual ink passages that extend in the plate laminating direction. When the passage unit is to be manufactured, communication holes that will become individual ink passages later will first be formed in the plurality of plates that form the passage unit. All of the plates in which the communication holes are formed will be laminated together with a thermosetting adhesive. The laminated plates will be heated and pressure will be applied thereto. In this way, all of the plates will be simultaneously adhered. An ink passage unit can be manufactured in one adhesion step. The manufacturing costs of the ink passage unit can be reduced. Components such as actuator units, an ink supply unit, and the like will be attached to the manufactured ink passage unit to complete an inkjet head.

Abstract: An assembly device assembles a recording and reproducing device for an optical disc by bonding spindle motor to a mechanical chassis. The assembly device adjusts the attitude of the spindle motor relative to the mechanical chassis prior to bonding by adjusting an inclination of the spindle motor about a first axis and about a second axis perpendicular to the first axis. The assembly device also adjusts a height of the spindle motor.

Abstract: A printed-board supporting apparatus includes a support pin that is attached to a pin-supporting table. An image of the support surface of the support pin is taken by a mark-image taking device, at a first position where a center of an image-take surface of the mark-image taking device is expected to coincide with a center of the support surface of the support pin. Another image of the support surface is taken at a second position where the center of the image-take surface is distant from the center of the support surface by a predetermined distance. At the second position, the image of the support surface is formed on the image-take surface at a position corresponding to the height of the support surface. Based on the position corresponding to the height of the support surface, the height of the support surface relative to the mark-image taking device is obtained.

Abstract: A method of manufacturing an inkjet printer component and an inkjet printer component electropolishing device are provided. The method includes positioning an electrode in a fluid passageway of an inkjet printer component, the electrode including a conductive face and a nonconductive face; polishing a side of the fluid passageway by: biasing the nonconductive face of the electrode toward a side of the fluid passageway such that the conductive face of the electrode does not contact any portion of the fluid passageway; providing an electrolytic fluid to the fluid passageway of the inkjet printer component; and applying a voltage between the electrode and the inkjet printer component.

Abstract: A tape feeder including an electronic component accommodating part installed at one side of a tape feeder main body to accommodate electronic components which are not picked up by a suction nozzle of an electronic component conveyance robot installed at an electronic component mounting device, thereby preventing the electronic components from clogging a carrier tape moving path, and storing the electronic components in the electronic component accommodating part. Therefore, it is possible to increase efficiency of equipment without operational delay and stoppage of the equipment, readily extract and reuse the electronic components accommodated in the electronic component accommodating part, and keep an operational environment clean.