Abstract: Methods of making a radio frequency identification (RFID) tag. A flexible strap is provided by disposing a plurality of RFID chips on a first web of flexible material and removing the flexible strap from the first web and attaching the flexible strap to an antenna on a flexible substrate.

Abstract: A method of producing a whip antenna by tapering a length of aluminium tube and applying high velocity plasma to the aluminium tube. A ribbon conductor is also wound with a plurality of selected number of turns along the aluminium tube. A polymer coating is also applied to the antenna.

Abstract: A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.

Abstract: A method for the manufacture of a multilayer circuit comprising a liquid crystalline polymer layer, the method comprising treating the multilayer circuit with an amount of heat effective to raise the crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, of the liquid crystalline polymer layer by at least about 10° C.

Abstract: The described embodiments relate to slotted substrates and methods of making the slotted substrates. One exemplary method patterns a first set of dummy features in a first layer positioned over a first surface of a substrate and patterns a second set of dummy features in a second layer positioned over the first layer. After the method patterns the first set of dummy features and the second set of dummy features, the method further forms a slot in the substrate, at least in part, by allowing an etchant to pass through the first and second sets of dummy features to the first surface.

Abstract: The method for manufacturing a liquid ejection head comprising a diaphragm which serves as portions of pressure chambers connected to nozzles through which liquid is ejected, and piezoelectric bodies which deform the diaphragm, the method comprises: an electrical wire forming step of removing at least a part of a silicon substrate, and forming electrical wires for supplying drive signals to drive the piezoelectric bodies, in sections where the silicon substrate has been removed; a piezoelectric body forming step of forming the piezoelectric bodies on sections where the silicon substrate has not been removed at least in the electrical wire forming step; and a diaphragm forming step of forming the diaphragm on a side of the piezoelectric bodies opposite to the silicon substrate.

Abstract: It is an object of the invention to provide a technique for easily installing many turns of a coil winding on a stator. Representative method for manufacturing a motor includes preparing the coil wound into a ring-like form and tied, preparing the split core such that the spacing between the pair pole pieces in the circumferential direction of the split core corresponds to the inner dimension of the coil in the circumferential direction of the split core, inserting the tied coil into the two coil receiving parts through the openings and then, deforming the split core such that the spacing between the pair pole pieces is increased to be longer than the inner dimension of the coil.

Abstract: A method of assembling a rotor assembly is provided, without the use of a rotor steel hub. The method comprises forming first, second and third lamination stacks by stacking individual rotor laminations together. The first, second and third lamination stacks are cast to lock the individual rotor laminations together. The rotor laminations in the first, second and third lamination stacks have a generally ring-like shape with a variable inner diameter and a substantially common outer diameter. The rotor laminations in the first, second and third lamination stacks have substantially the same outer diameter, whereas the rotor laminations in the second lamination stack have a substantially larger inner diameter than the first and third rotor laminations. The elimination of the hub results in reducing total cost and manufacturing cycle time, and in improved features, performance and efficiency of the rotor assembly.

Abstract: A method of making a microelectronic element includes making a connection component by providing a metal layer having a top surface and a bottom surface, providing a dielectric layer over the top surface of the metal layer and forming openings in the dielectric layer to expose portions of the top surface of the metal layer. The method includes providing conductive elements atop the dielectric layer, at least some of the conductive elements extending through the openings in the dielectric layer and being in contact with the metal layer, and plating first conductive protrusions atop the at least some of the conductive elements extending through the openings in the dielectric layer, the first conductive protrusions extending away from the metal layer. The method includes selectively removing portions of the metal layer from the bottom surface of the metal layer to form second conductive protrusions that extend away from the first conductive protrusions.

Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each of effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Abstract: Methods, systems, and apparatuses for automated manufacturing microstrip element antennas is described. The microstrip element antenna comprises a printed circuit layer, a dielectric layer and a ground plane layer. Mass manufacturing process for such microstrip element antennas without any substantial manual assembly process is described. Automation of the manufacturing steps leads to lower production costs, faster production and a higher yield.

Abstract: A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided, wherein at least one of the pre-soldering bumps has a defect. Then, a micro-electroplating process or a micro-electrolyzing process is performed by a micro-electrode nearby the defective pre-soldering bump, so as to repair the defective pre-soldering bump. Therefore, the present invention is able to enhance the process yield and reduce the production cost.

Abstract: Forming an inlay comprising an antenna wire having two end portions and a site for a transponder chip, comprises: mounting the wire to a surface of substrate; and leaving the end portions of the antenna wire free-standing, as loops adjacent terminal areas of a site on the substrate for the transponder chip. With the transponder chip installed on the substrate, the free-standing loops are repositioned to be substantially directly over the terminals of the transponder chip, in preparation for interconnection of the loops to the terminals of the transponder chip, then are bonded to the terminals. An embedding tool for mounting the wire on the substrate may embed the wire in or adhesively place a self-bonding wire on a surface of the substrate. The substrate may have two transponder chips, and function as a secure inlay. An anti-skimming feature is included in the inlay.

Abstract: A punching apparatus forms a hole at a bottom portion of each of recesses which are formed in a metal plate in advance and arrayed in a first direction. A female die supports the metal plate. A male die is opposed to the recess and provided with a punch array in which a plurality of punches in the first direction. The male die is movable in a second direction perpendicular to the first direction to form the hole with each of the punches. The punches include first punches each having a distal end face which is slant in the second direction. A slant angle of the distal end face corresponds to a warp of the plate member due to the formation of the recesses.

Abstract: A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the element.

Abstract: According to a nozzle winding method of causing a nozzle (41) to pass between adjacent magnetic poles (12) and rotating the nozzle (41) around the magnetic pole (12), winding is carried out until the rotating nozzle (41) interferes with wound coils (201 to 242), so that a high space factor is obtained. Thereafter, according to a cam winding method, winding is carried out in a space remaining in a slot while rotating the nozzle (41) in an area not interfering with the coils (201 to 242) in the slot, thereby achieving winding with a high space factor of coils in the entire space of the slot.

Abstract: A method for installing a bonding pad as a gasket for an electronic subassembly includes providing a bonding pad comprising an expandable foam; an air-tight bladder covering at least one side of the expandable foam; a layer of conductive material covering the air-tight bladder and comprising at least one contact point; and an open port; removing air from the air-tight bladder, thereby compressing the expandable foam; installing the bonding pad into a gap between two surfaces; allowing the compressed foam to expand under atmospheric pressure; and electrically bonding the two surfaces with the bonding pad.

Abstract: The present invention discloses a method of manufacturing a wiring substrate to which a semiconductor chip mounted. The method includes the steps of forming a base, forming a peeling layer on the base, forming a capacitor having a plurality of layers on the peeling layer, and forming a wiring part in the capacitor for connecting the capacitor to the semiconductor chip.

Abstract: A method of accessing a motherboard in a computer system includes, during sliding of a card along a guide slot in the system, automatically interacting a first detent formed along an edge of the card with a guide tab when the card reaches an intermediate position to support the card in the intermediate position detached from the motherboard. The detachment of the card and the motherboard is sufficient to permit access to the motherboard while the card remains coupled to a system chassis. Interacting the guide tab with the detent may include extending a portion of the guide tab into the detent to provide lateral support for the card. The guide tab may be a metallic leaf spring and may be affixed to the chassis and may provide an electrical contact to a ground contact in a second detent to ground the daughter card when its attached to the motherboard.

Abstract: The present invention is directed towards manufacturing a plurality of individual radio frequency devices from a web. The method comprises: transporting the web over a processing area; applying adhesive to the web as it is transported over the processing area; repeatedly applying sets of an antenna and a microchip to the web at spatially separated positions, as the web is transported over the processing area; longitudinally folding the web in half, thereby layering the sets of an antenna and a microchip between the two halves of the web and at least partly holding the sets of an antenna and a microchip in place by the adhesive, as the web is transported over the processing area; and cutting the folded web into individual radio frequency devices, as the web is transported over the processing area.