Abstract: The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional shifting amount of an electronic component on a suction nozzle before the electronic component is mounted on a printed board is stored in a RAM each time the component is picked up at a component feeding unit until a pickup count number reaches a predetermined pickup number, and a CPU calculates an average of the positional shifting amounts. When the pickup count number reaches the predetermined pickup number, the CPU obtains a temporary coefficient by adding an initial value to a value obtained by multiplying a negative coefficient by the pickup count number, and calculates a feedback value by multiplying the temporary coefficient by the average.

Abstract: A method of fabricating a mandrel for electroformation of an orifice plate. An array of mask elements may be created adjacent a substrate. Surface regions of the substrate disposed generally between the mask elements may be removed, to create a base having a base surface and a plurality of pillars extending from the base surface according to the array of mask elements. Each pillar may have a perimeter defined by an orthogonal projection of one of the mask elements onto the substrate. An electrical-conduction enhancer may be deposited adjacent the base surface and terminating at least substantially at the perimeter, to create a conductive layer to support growth of the orifice plate.

Abstract: In a capacitor device of the present invention includes a substrate, a plurality of lower electrodes formed on the substrate, a plurality of dielectric films formed on a plurality of lower electrodes respectively in a state that the dielectric films are separated mutually, and upper electrodes formed on a plurality of dielectric films respectively, a plurality of capacitors each composed of the lower electrode, the dielectric film, and the upper electrode are arranged on the substrate respectively, and each of the dielectric films in a plurality of capacitors has a different film thickness.

Abstract: A modular “quick-form” tooling system and stator bar form set-up method is provided for reconfigurably mounting various stator bar bending/forming tool modules that are used to produce custom bends and curvatures in a length of stator bar stock. At least one stator bar support structure is provided having a support surface formed with an array of tool location alignment holes that allow a variety of different bend-forming tooling modules to be positioned relative to each other in a manner that will define the shape of a generator stator bar during a bending/forming process.

Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.

Abstract: The conveying precision of a continuation inlet tape in the production line of the inlet for electronic tags is improved. A first structural body used as an inlet is moved to an inspection position where a communication characteristic test is carried out, and a CCD camera photographs the plane image of the structural body in the inspection position, and transmits image data to an image sensor controller. The image sensor controller measures the amount of location drifts of the structural body, analyzing the image data transmitted from the CCD camera, and transmits to a programmable controller as a correction value. It is transmitted to a positioning unit as actual movement magnitude, adjusting the correction value to the movement magnitude of standard, and the following structural body is moved according to the transmitted movement magnitude.

Abstract: The invention provides a manufacturing apparatus in which inter-substrate transfer of a thin film circuit or a thin film element can automatically be performed. An apparatus for manufacturing electronic devices includes a laser device to generate laser beams, a masking unit having a masking substrate to shape beam spots of the laser beams, a first stage to place a first substrate, which carries a object to be transferred, a second stage to place a second substrate, to which the object to be transferred is transferred, an adhesive agent applying unit to apply an adhesive agent on the object to be transferred or on a transferred position on the second substrate, and a control unit to control the actions of the first and the second stages.

Abstract: Methods of manufacturing printed circuit boards having circuit layers laminated with stacked (or staggered) micro via(s). Aspects of embodiments of the present invention are directed to a method of manufacturing a printed circuit board with Z-axis interconnect(s) or micro via(s) that can eliminate a need for plating micro vias and/or eliminate a need for planarizing plated bumps of a surface, that can be fabricated with one or two lamination cycles, and/or that can have carrier-to-carrier (or substrate-to-substrate) attachments with conductive vias, each filled with a conductive material (e.g., with a conductive paste) in the Z-axis. In one embodiment, a printed circuit board having a plurality of circuit layers with at least one z-axis interconnect can be fabricated using a single lamination cycle.

Abstract: Method for manufacturing a small radio frequency IC tag, where the radio frequency IC tag which can obtain sufficiently long communication distance with radio wave in the microwave band even if an antenna is made small and the radio frequency IC tag is embedded in metal material. An O-shaped antenna is formed to narrow the width of a neck part in which an IC chip is mounted and widen the width of radiating electrodes constituting radiating part of radio wave. The radiating electrodes are formed into offset structure on right and left sides of the feeding point so that areas of right and left radiating parts of the feeding point in which the IC chip is mounted are unsymmetrical. Further, a ground electrode is provided so that a dielectric body is held between the radiating electrodes and the ground electrode and the radiating electrode is connected to the ground electrode at the side of the dielectric body.

Abstract: A method of manufacturing an ink jet recording head includes the steps of forming adhesive layers and side walls of a flow path on a substrate; pasting a ceiling layer, which is a part of a flow path forming member, on the side walls; and forming discharge ports in the ceiling layer.

Abstract: A handling apparatus mounted on a moving member for holding, conveying, and installing a workpiece has a floating plate attached for radial movement to an apparatus body 10 connecting with the movable member, and a workpiece holding device for holding the workpiece on the floating plate. A lock plate is provided for fastening the floating plate to the apparatus body in a radial direction, A fastening piston is coupled to the lock plate through a fastening rod, and the floating plate can be fastened at any position. An aligning piston on which a tapered surface is formed is mounted on the apparatus body for reciprocation. The tapered surface of the aligning piston engages an aligning hole of the floating plate to return the floating plate in the radial direction to an origin position.

Abstract: An apparatus for transplanting a multi-board is provided. This apparatus includes an orientation device, a calibration device, and an image-adjusting device. The orientation device has a first movable platform, and the multi-board is fixed on the first movable platform. The calibration device has a second movable platform and is used for moving a substitution circuit board to a recombination position of the multi-board. The image-adjusting device captures image data of the multi-board and the substitution circuit board and compares the image data to obtain an error signal. The calibration device receives the error signal and moves the second movable platform according to the error signal in order to calibrate the relative position between the substitution circuit board and the multi-board.

Abstract: Providing a terminal inserting apparatus which does not give a limitation to an assembled wiring harness thereby, the terminal inserting apparatus includes a jig mounting unit, a housing holding unit, an inserting unit and a jig transporting unit. The jig mounting unit has a plurality of holding jigs. The holding jig has a connector housing. The housing holding unit has one holding jig including the connector housing. The inserting unit inserts the terminal 6 connected with the electric wire into a terminal receiving chamber of the connector housing. The jig transporting unit transports the holding jig from the jig mounting unit to the housing holding unit.

Abstract: A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9-20 pm/° C.

Abstract: A method to repair a rotor system having a coupling, a coupling keyway, a shaft, a shaft keyway, and a key. The method may include the steps of machining a shaft relief on the shaft adjacent to the coupling, providing fillet radii to the coupling keyway and the shaft keyway, adding a fretting resistant button to the key, machining a keyway relief on the shaft keyway, and machining a coupling relief on the coupling adjacent to the shaft. The method further may include the step of machining the key, the step of positioning dowels between the coupling and the shaft, and the step of shot-peening the coupling keyway and the shaft keyway.

Abstract: A tool and method for winding and forming a field coil for field assembly, such as a stator, includes separable tool halves defining a winding cavity therebetween. The winding cavity receives magnet wire that is wound therein, such as by rotating the tool or a winding nozzle. The magnet wire generally conforms to the shape of the winding cavity such that when the tool halves are separated, a field coil having a net shape is produced. Once the magnet wire is sufficiently deposited within the winding cavity, wires of the coil may be bonded together either through a resistive heating process such as by passing an electrical current through the coil or through other heating or chemical bonding methods to thereby maintain the net shape of the field coil once it is removed from the tool.

Abstract: In a method of connecting electric signals between electronic apparatus, various signal terminals or sockets used to connecting power supply, audio/video signals, or transmission cables are integrated into a stackable connection terminal interface. Each of the connection terminals provides a plurality of signal transmission paths or contacts, and is electrically connectable at two opposite ends thereof to enable sequential stacking of multiple connection terminals. The electric contacts on the stackable connection terminal are separately pre-assigned to a different signal transmission path, so that two or more stackable connection terminals in a stacked state may still own respective signal transmission path to ensure independent signal transmission without mutual interference. Therefore, the space occupied by different terminal interfaces is reduced, and a uniformly structured connection interface is provided.

Abstract: A method for producing a circuit board having an integrated electronic component comprising providing a circuit board substrate having a first substrate surface and a second substrate surface, securing an integrated electronic component to the first substrate surface, and disposing a first dielectric layer on the first substrate surface and over the first integrated electronic component. The method additionally includes disposing a metallic layer on the first dielectric layer to produce an integrated electronic component assembly, producing in the integrated electronic component assembly at least one via having a metal lining in contact with the metallic layer, and disposing a second dielectric layer over the via and over the metallic layer.

Abstract: A method of mounting an electronic part to a substrate, comprising: a substrate feed transporting step transporting the substrate 10 supplied to a substrate transport start position to a mounting unit 12; an electronic part supplying step supplying the electronic part 11 to the mounting unit 12; a mounting step mounting the electronic part 11 to the substrate by the mounting unit 12; and a substrate return transporting step transporting the substrate 10 to a substrate discharge position on which the electronic part has been mounted in the mounting step, wherein in the substrate feed transporting step, a carrier 100 is heated during a period when transported over a predetermined distance from the substrate transport start position; and the substrate feed transporting step, the mounting step, and the substrate return transporting step are performed while the substrate 10 is held by the carrier 100 heated during the predetermined distance.

Abstract: A method of production of a multilayer ceramic electronic device having dielectric layers with an interlayer thickness of 5 ?m or less and internal electrode layers including a base metal, including the steps of firing, then annealing a stack comprised of a dielectric layer paste and an internal electrode layer paste including a base metal alternately arranged in 100 layers or more under a reducing atmosphere, treating the annealed stack by first heat treatment under a strong reducing atmosphere of an oxygen partial pressure P3 of over 2.9×10?39 Pa to less than 6.7×10?24 Pa at a holding temperature T3 of over 300° C. to less than 600° C. The stack after the first heat treatment is treated by second heat treatment under an atmosphere of an oxygen partial pressure P4 of over 1.9×10?7 Pa to less than 4.1×10?3 Pa at a holding temperature T4 of over 500° C. to less than 1000° C.