Patents Examined by Minh Trinh
  • Pressurizing method
    Patent number: 7076867
    Abstract: A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool is disposed so as to face the stage and moved between a first position at which the tool faces the first and second components while spaced therefrom, and a second position at which the tool is biased toward the stage to pressurize the second component against the first component. When the tool is at the second position, the protection sheet supplying section supplies a protection sheet so that the protection sheet is placed between the second component and the tool.
    Type: Grant
    Filed: December 24, 2002
    Date of Patent: July 18, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiro Yamamoto, Sakae Kobayashi, Yoshikazu Yoshimura, Naoto Hosotani, Kenji Takahashi, Hiroshi Nasu, Naomi Kaino, Hidenobu Nishikawa
  • Method for producing ribbon cable using flash curing
    Patent number: 7073255
    Abstract: A method of manufacturing a ribbon cable, comprising providing a set of insulated wires and aligning said insulated wires in a predetermined arrangement. The insulated wires are warmed sufficiently for said insulation to be become soft and adhesive, are pressed together so that they adhere to one another and allowed to cool, to form a ribbon cable.
    Type: Grant
    Filed: July 26, 2004
    Date of Patent: July 11, 2006
    Assignee: Advanced Neuromodulation Systems, Inc.
    Inventors: John Swanson, James Pylant, Ky Huynh
  • Disassembling tool for process cartridge
    Patent number: 7073251
    Abstract: The disassembling tool for a process cartridge has a base body, an engagement portion provided on the base body and adapted to be engaged with the process cartridge to thereby position the process cartridge, a pushing-out portion provided for movement relative to the base body for pushing out a coupling member, and a grip portion adapted to be gripped when the pushing-out portion is to be moved, and connected to the pushing-out portion, and the engagement portion is provided at a location opposed to the pushing-out portion in a movement direction in which the pushing-out portion is moved. Thereby, a process cartridge having a frame can be simply disassembled.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: July 11, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ken Kikuchi, Toshiyuki Karakama, Toru Oguma, Akiyoshi Yokoi
  • Electrostatic gripping device
    Patent number: 7075772
    Abstract: An electrostatic gripper for moving wafers includes bipolar electrodes with an insulating layer of zirconium oxide, which are positioned on a circuit board. The gripper is produced by a pressing process and can be operated with a DC voltage of less than 900 V. As a result, heating of the wafer is almost completely prevented even under a vacuum.
    Type: Grant
    Filed: July 5, 2003
    Date of Patent: July 11, 2006
    Assignee: Integrated Dynamics Engineering GmbH
    Inventor: Peter Heiland
  • Method for maintaining operability of a flexible, self conforming, workpiece support system
    Patent number: 7073252
    Abstract: A method is disclosed for maintaining a reliable operation of a flexible, self-conforming support system. The self-conforming support system utilizes a plurality of pins that move vertically within a series of apertures. The motion of the pins can be hindered with unwarranted material becoming lodged between the pins and the respective aperture. One scenario where this is highly probable is when using the self-conforming support system for supporting Printed Circuit Boards during a solder paste application process. The present invention utilizes a protective collar to deflect any excess solder paste from becoming lodged between any of the pins and the respective aperture. The collar is essentially an umbrella, and can be of a molded material, a pliant material, or machined into the pins. The collar can further include a pliant top which also protects the Printed Circuit Board from the pins.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: July 11, 2006
    Inventors: Allen David Hertz, Eric Lee Hertz
  • Method for producing a circuit board
    Patent number: 7069645
    Abstract: A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: July 4, 2006
    Assignee: NGK Insulators, Ltd.
    Inventors: Takahiro Ishikawa, Masahiro Kida, Shuhei Ishikawa, Nobuaki Nakayama
  • Method of making chip type power inductor
    Patent number: 7069639
    Abstract: A method of fabricating a chip type power inductor includes the steps of: preparing green sheets: forming cutting lines on a magnetic layer green sheet and a non-magnetic layer green sheet; forming via holes on the non-magnetic layer green sheet where the cutting lines are formed, and forming an electrode pattern at an upper surface of the non-magnetic layer green sheet; stacking a plurality of layers by constituting the magnetic layer and the non-magnetic layer where via holes and electrode patterns are formed as one unit in a state that a non-magnetic layer where cutting lines and electrode patterns are not formed is inserted; stacking a cover layer composed of a magnetic layer at upper and lower surfaces of the stacked layers; firing the stacked body; and forming external electrodes at an outer surface of the fired stack body.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: July 4, 2006
    Assignee: Ceratech Corporation
    Inventors: Myoung-Hui Choi, Soon-Gyu Hong, Sang-Eun Jang
  • Component mounting method
    Patent number: 7069648
    Abstract: Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: July 4, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kanji Hata, Noriaki Yoshida
  • Method of fabricating a current control device
    Patent number: 7069642
    Abstract: A method of fabricating a current control device is presented. The method impregnates a pressure conduction composite within a current control device with a fluid additive via suffusion. The suffusion process is performed by placing the pressure conduction composite within a bath of a liquid additive. The method generally includes the steps of mixing a compressible non-conductive matrix and conductive filler, forming a pressure conduction composite composed of the non-conductive matrix having the conductive filler electrically isolated therein, suffusing the composite within a bath so as to impregnate the composite with an additive, and attaching a pair of conductive plates to the composite. Alternate methods include attaching non-conductive plates to the composite, forming pores within the pressure conduction composite, and inserting a temperature responsive material into a porous composite.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: July 4, 2006
    Assignee: QorTek, Inc.
    Inventors: Bruce Bower, Gareth Knowles
  • Methods for installing a circuit device
    Patent number: 7065868
    Abstract: A method is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: June 27, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Larry Kinsman, Mike Brooks, Warren M. Farnworth, Walter Moden, Terry Lee
  • Method for plating of printed circuit board strip
    Patent number: 7065869
    Abstract: Disclosed is a design method for plating of a printed circuit board (PCB) strip, in which a main plating line is optionally formed on a component side, a solder side, or an inner layer of the PCB strip by modifying a sub-plating line of the PCB strip used to manufacture a semiconductor chip package, and a method of manufacturing the semiconductor chip package using the same. Therefore, an excellent semiconductor chip package is manufactured without a short when the PCB strip is cut using a sawing machine because misalignment of main plating lines of the solder side and the component side of the PCB strip is avoided, and an interval between PCB units is reduced to desirably increase the number of PCB units in the PCB strip without the short when the PCB strip is cut.
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: June 27, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae-Hyeog Kang, Sang-Kab Park, Kwang-Ho Yoon, Bong-Kyu Choi
  • Method of manufacturing electronic device
    Patent number: 7065857
    Abstract: The method of manufacturing an electric part including a matrix-shaped nonconductive base member, and a carbon nanotube group that is sealed within the nonconductive base member and includes at least one of a carbon nanotube and a plurality carbon nanotubes that are electrically connected to each other. According to the method, substantially only an end portion of the carbon nanotube or at least carbon nanotube contained in the plurality of carbon nanotubes may be exposed from one surface of the nonconductive base member, and an electrode may be connected to a side surface of at least one carbon nanotube included in the carbon nanotube group.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: June 27, 2006
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Miho Watanabe, Hiroyuki Watanabe, Chikara Manabe, Masaaki Shimizu
  • Method for component mounting
    Patent number: 7065864
    Abstract: There are provided a method and apparatus of component mounting capable of avoiding damage caused by production operations with a component holder having debris thereon. If it is determined during a detecting step of a component holding condition that a component is held by a component holder in an improper condition for mounting, the component holder releases such a component into a collecting box, and skips a pick up operation at a next round of a pick up station. The component holder is then subjected to confirming whether any debris exists by using, preferably, a condition sensor, and the component holder picks up a new component if it is confirmed that no debris exists. If debris is found during the confirming step, production operations are stopped, or a warning is generated. After maintenance of the component holder is completed, production operations are restarted.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: June 27, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroki Yamamoto, Shigeki Imafuku, Keizo Izumida, Takeshi Kuribayashi
  • Apparatus for identifying and mounting printed circuit boards
    Patent number: 7062844
    Abstract: An apparatus is provided for identifying one or more mounting locations for mounting a printed circuit board or other type of electronic device, including a mounting surface and one or more light sources mounted on the mounting surface. The light sources are located at positions corresponding to the mounting locations for mounting the printed circuit board or other type of electronic component. When illuminated, the light sources identify one or more mounting locations. The mounting locations are defined by mounting patterns corresponding to the mounting locations for a given type of printed circuit board or other electronic component. The light sources are illuminated so that only light sources corresponding to mounting locations defined by a particular mounting pattern are illuminated.
    Type: Grant
    Filed: March 18, 2002
    Date of Patent: June 20, 2006
    Assignee: American Megatrends, Inc.
    Inventor: Clas Gerhard Sivertsen
  • Method for producing printed wiring boards
    Patent number: 7059039
    Abstract: A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: June 13, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masahide Tsukamoto, Masanaru Hasegawa, Hideo Hatanaka
  • Apparatus for holding and mounting a component
    Patent number: 7059036
    Abstract: An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.
    Type: Grant
    Filed: April 20, 2005
    Date of Patent: June 13, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Osamu Okuda, Yoshihiro Yoshida, Akira Kabeshita, Satoshi Shida, Naoyuki Kitamura
  • Integrated circuit trimming device broken die sensor
    Patent number: 7051427
    Abstract: A broken trim die tool detection sensor. The lands of the tie bar die connect with the leads of the unit to form switches. The states of these switches indicate broken die lands or other malfunctions.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: May 30, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Ronald B. Azcarate, Alwin A. Rosete, Jong A. Foronda, Jr.
  • Method for forming a medium having data storage and communication capabilities
    Patent number: 7051429
    Abstract: A method for forming a medium having a substrate is formed have a patterned surface with a channel pattern and a transponder having a memory is provided in the channel pattern. A conductive material is deposited in the channel pattern with the conductive material operatively associated with the transponder.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: May 30, 2006
    Assignee: Eastman Kodak Company
    Inventors: Roger S. Kerr, Timothy J. Tredwell, Cheryl J. Kaminsky, Robert P. Bourdelais
  • Recycling method for magnetic field generator
    Patent number: 7051425
    Abstract: A recycling method for a magnetic field generator, which includes a plate yoke, and a permanent magnet provided on the plate yoke, the magnetic field generator further including a plurality of neodymium magnets bonded together by an adhesive. The magnetic field generator is heated to 200° C.˜1000° C., then at least one of the plurality of neodymium magnets is removed; and a surface of the removed neodymium magnet is polished for reusing the neodymium magnet.
    Type: Grant
    Filed: August 26, 2003
    Date of Patent: May 30, 2006
    Assignee: Neomax Co., Ltd.
    Inventors: Masaaki Aoki, Shigeo Hashimoto
  • Designing a ball assignment for a ball grid array package
    Patent number: 7051434
    Abstract: A method for designing a routing pattern for electrical contacts on a printed circuit board by arranging contacts in an array of rows and columns on the printed circuit board, connecting groups of n columns of contacts to n?1 columns of vias disposed interstitially between the contacts, thereby forming a vertical channel that does not extend completely through the contact array. Connecting the vias to traces, and routing the traces to an outside edge of the via array through the vertical channel. Connecting groups of n rows of the contacts to n?1 rows of vias disposed interstitially between the contacts, thereby forming a horizontal channel that does not extend completely through the contact array, and intersects with the vertical channel. Connecting the vias to traces, and routing the traces to the outside edge of the via array through the horizontal channel.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: May 30, 2006
    Assignee: LSI Logic Corporation
    Inventors: Leah M. Miller, Farshad Ghahghahi