Abstract: An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.

Abstract: A rotor assembly and method for making the rotor assembly in which a cylindrical magnet which is magnetized in an axial direction is coupled with a rotary shaft and the magnet is clamped with rotor stacks formed by laminating annular magnetic plates, the surfaces of which are electrically insulated, to form a rotor, and around the outer circumference of the rotor stator cores which are wound with stator coil are disposed, a sleeve is pressed in between the magnet and the rotor stacks, and the rotary shaft and interposed therebetween. The cutting operation for the outer diameter of the rotor during the manufacturing processes is carried out while holding both ends of the sleeve, subsequently, the rotary shaft is inserted, thereby, regardless of the length of the rotary shaft, the manufacturing processes are carried out to reduce the number of the molds.

Abstract: A jumper coaxial cable assembly includes a jumper coaxial cable and at least one solder-type connector secured thereto. The cable may include an outer conductor, which, in turn, includes aluminum with a tin layer thereon. The tin layer permits an aluminum outer conductor to be used, yet facilitates soldering of the solder-type connector onto the outer conductor. The tin layer may be a tin alloy, such as a tin/lead alloy, for example. The outer conductor may have a continuous, non-braided, tubular shape, and the tin layer may extend continuously along an entire length of the outer conductor. The tin layer may be readily formed by tin plating during manufacturing of the jumper coaxial cable. The jumper coaxial cable assembly may be joined to a main coaxial cable and/or to electronic equipment.

Abstract: A method for producing a low-hysteresis magnetoelastic element comprising applying a magnetoelastic material onto a metal substrate. After the magnetoelastic element is securely bonded to the underlying shaft, a reduction in the outside diameter of the shaft draws the magnetoelastic element radially inward causing it to occupy a smaller volume. This process provides the magnetic anistropy required for the sensor to operate properly, and also results in a densification of the magnetoelastic element making it inherently stable. Several methods of reducing the outside diameter of the shaft to draw the magnetoelastic element radially inward have been devised. Prior to deposition of the magnetoelastic material, the outside diameter of a hollow shaft is elastically expanded by applying force to its inside diameter. This is accomplished by using an expanding insert, by pressurizing the cavity within the shaft, or by inducing a managed thermal expansion of the shaft prior to material deposition.

Abstract: A process for assembling a connector is provided, by which the production efficiency can be improved by preventing the problem of insertion error from occurring in a step of terminal insertion into a connector housing in the manufacturing process of the wiring harness by using an automatic assembly machine or in a step of the operation by the human hands. The process includes the steps of: provisionally locking the spacer in the connector housing; inserting ajig rod into the connector housing before inserting the terminal into the connector housing, the jig rod being for releasing the locking of the spacer which is completely locked in the connector housing; pulling the jig rod out from the connector housing; and inserting the terminal into the connector housing.

Abstract: A method for forming connections within a multi-layer electronic circuit board 10 which allows for the selective, efficient, and reliable interconnection between at least one conductive layer and a ground plane or layer.

Abstract: The disclosed board fabrication techniques and design features enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that require a large number of signaling paths across the backplane at speeds of 2.5 Gbps or greater, as well as distribution of significant amounts of power to router components. The disclosed techniques and features allow relatively thick (e.g., three- or four-ounce copper) power distribution planes to be combined with large numbers of high-speed signaling layers in a common backplane. Using traditional techniques, such a construction would not be possible because of the number of layers required and the thickness of the power distribution layers. The disclosed embodiments use novel layer arrangements, material selection, processing techniques, and panel features to produce the desired high-speed layers and low-noise high-power distribution layers in a single mechanically stable board.

Abstract: Transverse flux electric motors are made using a unique process where individual components are premade and then assembled together. A stator portion is made by nesting a coil between two stator core portions. In a disclosed example, distinct first and second stator core portions are formed. The stator core portions in disclosed examples are made from laminations or sintered powder materials. In a disclosed arrangement, a coil is supported between the core portions of the stator such that the core portions enclose at least part of axial surfaces on the coil. A rotor that has a core and a plurality of magnets is supported relative to the stator for relative rotary motion such that the plurality of magnets of the rotor interact with the stator core portions during the relative rotary motion.

Abstract: A substrate assembly is disclosed including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC device. The substrate assembly also comprises a layer of resilient conductive material formed on a surface of the substrate, the spring-biased electrical contacts being formed in the resilient conductive material layer in situ on the substrate. Each spring-biased electrical contact includes a surface or surfaces configured to bias against and electrically contact an IC device lead element. The present invention also encompasses methods of fabricating substrate assemblies according to the invention, including heat treating the substrate assembly after formation to achieve desired spring characteristics.

Abstract: A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

Abstract: A method of manufacturing a watertight brushless fan motor includes first, combining a stator assembly with a stator and a circuit substrate, a case, a die, and an annular member. The stator assembly is mounted on the bearing supporting cylindrical section of the case. The bearing supporting cylindrical section is engaged and the die and annular member are fixed to the case. An insulating resin is poured into the die to mold spaces between the plate-like section and the bearing supporting cylindrical section so that the stator and the circuit substrate are included inside. The resin may be poured under low vacuum. With this arrangement, the watertight brushless fan motor is provided that can prevent occurrence of a crack in the outer surface of the molded part due to molding shrinkage of the insulating resin or expansion and shrinkage of the insulating resin caused by a change in ambient temperature.

Abstract: A method for assembling a plurality of electronic devices is described. A plurality of dies separated die from a wafer are attached to a support surface. The plurality of dies is transferred from the support surface to a substrate structure that includes a plurality of tag substrates.

Abstract: The present technique provides a multi-tile detector and a process for assembling the multi-tile detector using a flexible structure and intermediate electrical connections. The present technique minimizes edge gaps between adjacent detector tiles by coupling the detector tiles to the flexible structure and then flexing the flexible structure to close the edge gaps. Intermediate electrical connections, such as interlayer solder bumps, also may be used to minimize visible artifacts associated with tiling of the detector tiles. The present technique also may use a plurality of soldering materials having different melting temperatures to facilitate multiple soldering steps that are nondestructive of previous soldering steps.

Abstract: A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-layer rigid PCB. A portion of the multi-layer rigid PCB between the grooves is milled to expose a corresponding portion of the soft PCB to define an exposed area. The combined PCB is drilled through along two opposite sides of the grooves and the corresponding exposed area of the soft PCB. Breakable parts are formed at a center of the corresponding portion of the soft PCB and two opposite outside edges of the grooves.

Abstract: An electronic component holding head, an electronic component mounting apparatus using same, and a method for mounting an electronic component, are provided for use in mounting an electronic component having a positioning mark formed on a film member.

Abstract: A method of production of a circuit board able to prevent peeling of a conductive layer during polishing of the conductive layer including the steps of forming at least holes in one surface of a substrate; forming a plating power supply layer on the one surface of the substrate, the other surface, the sides, and inner surfaces of the holes; forming a metal layer formed on the one surface of the substrate, the other surface, and the sides and burying the holes by electroplating through the plating power supply layer; and polishing the metal layer to form interconnect patterns comprised of the metal layer buried in the holes.

Abstract: A component mounting machine is arranged to perform a method for handling boards in a component mounting machine includes the steps of moving a plurality of boards substantially simultaneously from a first plurality of cassettes, arranged in parallel at the machine, onto a board carrier; processing said plurality of boards by mounting components thereon; moving said plurality of boards substantially simultaneously and in parallel from the board carrier into a second plurality of board cassettes arranged in parallel at the machine and moving a next plurality of boards from said first plurality of cassettes onto the board carrier; repeating the steps of processing and moving the plurality of boards until said first plurality of cassettes are empty; and exchanging cassettes and repeating the method from step a.

Abstract: A method is proposed to manufacture a precise multi-pole magnetic component for using in magnetic encoders. A special layout of the circuit pattern is designed and formed on a printed circuit board (PCB). Alternate and regular magnetic field is induced according to Ampere's law after a current flowing through the circuit on the PCB. The multi-pole magnetic component with fine magnetic pole pitch is achieved by forming the high-density circuit patterns on a substrate using the PCB technology.

Abstract: A high-speed shear with a knife, particularly a chisel-type knife with a knife edge, arranged on at least one of two oppositely arranged drums, wherein the knife can be accelerated to the feeding speed of the rolled strip and the drums can be adjusted relative to each other for carrying out a cut. At least one drive unit provided for the drums serves to accelerate the drums to the speed of the rolled strip to be cut and at least one of the drums may be provided with a separately controllable adjusting device. The chisel-type knife of the knife drum is mounted so as to protrude from the cutting circle towards the anvil or the surface portion of the second drum acting as an anvil and to mount the chisel-type knife of the knife drum so as to be resiliently supported against a predetermined restoring force.

Abstract: A system for enabling a reliable, motor-to-base merge process is designed for motors that are attached to a base with screws that mount from outside of the base. An assembly fixture receives the motor, which has a tooling hole for circumferentially locating the motor relative to the base. The assembly fixture closely receives the motor and has a tooling pin that engages the tooling hole to prevent rotation of the motor relative to the assembly fixture. During the motor-to-base merge process, the motor is inverted with the tooling pin in the tooling hole. The assembly fixture aligns the threaded screw holes in the motor with the mounting holes on the base.