Abstract: A method of making a lead finish incorporating mechanically flattening the plated coating of metal leads. This may be accomplished by mechanical means such as rolling, stamping, peening, coining, forging, or other suitable flattening techniques.

Abstract: The invention comprises filling a conductive adhesive on a hole end of a wire connection part in tubular shape of the terminal which has an electric contact part at one side and the wire connection part at the other side, inserting an electric wire from a hole opening of the wire connection part toward the hole end, and reducing evenly a size of a tubular wall of the wire connection part, thereby causing the conductive adhesive to infiltrate into a space of the electric contact part or between wires. The invention also comprises tightening the tubular wall of the wire connection part by a rotary swaging process. Further, the conductive adhesive is a nickel paste which is a mixture of nickel powders in a liquid epoxy resin based binder. In addition, at least one of a core wire portion of the electric wire or the terminal is aluminum or aluminum alloy.

Abstract: A known good die is economically fabricated. A tested integrated circuit is provided which includes a die having a bonding location on an upper surface and a lead. An upper portion of the integrated circuit package is removed or ground away to expose the bonding location. The lead is removed leaving the die and exposed bonding location to provide a known good die. The backside portion of the integrated circuit package is removed or ground away to expose the backside of the die. A contact pad is disposed on the bonding location. The bonding wire and exterior lead are also removed or ground away. The upper portion of the bonding ball is removed to provide a flattened bonding location. Preferably, the tested integrated circuit package provided is a thin small outline integrated circuit package (TSOP), and advantageously may be a packaged flash memory integrated circuit.

Abstract: A tape head module assembly method is disclosed. A first and second module holder are placed in an initial alignment with module holder ends facing each other, the module ends each holding a tape head module. A tape wrap angle between the first and second module is set by first performing a fringe alignment and then lifting a rear end of the first and second module holder a prescribed amount. A horizontal adjuster produces a rotation for the first module holder so that gaps between the first and second modules are parallel. An alignment along a longitudinal axis for the second module holder is selected and the second module is translated laterally until the second tape head module held by the second module holder is aligned with the first tape head module held by the first module holder to provide reader-opposite-writer track-to-track registration. Then, the first and second tape head modules are joined together using a joining agent in the gap between the first and second tape head modules.

Abstract: An inductor device including a device body having a plurality of insulating layers; a plurality of conductive coil pattern units formed inside the device body between insulating layers along a single planar direction, coil pattern units adjoining each other in the single plane being centro-symmetric patterns with respect to a center point of a boundary line between unit sections containing coil pattern units; and connection portions connecting upper and lower coil pattern units separated by the insulating layers to form a coil. It is possible to obtain an inductor device able to suppress the stack deviation without complicating the production process even if the device is made small in size.

Abstract: A method of manufacturing an on-chip transformer balun includes creating, on a semiconductor substrate, a primary winding having at least one substantially symmetrical primary turn on a first dielectric layer and at least one metal bridge on a second layer. A secondary winding is created on the semiconductor substrate, the secondary winding having at least one substantially symmetrical secondary turn on a third dielectric layer and at least one metal bridge on a fourth dielectric layer. In an alternative embodiment, the primary winding has at least one first primary turn on a first dielectric layer and at least one second primary turn on a second dielectric layer and at least one via that operably connects the first primary turn to the second primary turn. The secondary winding has at least one first secondary turn on a third dielectric layer and at least one second secondary turn on a fourth dielectric layer.

Abstract: An armature manufacturing method of forming an armature including an arm holding a printing wire, and magnetic circuit forming members attached to the arm places the magnetic circuit forming members on the arm with a resistive layer of a resistive material having high electric resistance sandwiched between the arm and each of the magnetic circuit forming members, and welds together the arm and the magnetic circuit forming members with the resistive films sandwiched between the arm and the magnetic circuit forming members by spot welding. The arm and the magnetic circuit forming members of the armature can be joined together by welds having a high weld strength.

Abstract: The stacked core assembly apparatus, which can perform assembly at a high speed while keeping strength of an angle indexing apparatus, comprises a press machine 1, a non-synchronous transmitting apparatus 10 and an angle indexing apparatus 7. The non-synchronous transmitting apparatus 10 transforms a constant revolution of the press machine 1 into a variable revolution. The angle indexing apparatus 7 is connected to the non-synchronous transmitting apparatus 10 via a coupling device 20, and is connected to a rotatably stacking cavity device 51 of a press die 5. An accelerated rotational speed period of an output shaft 13 of the non-synchronous transmitting apparatus 10 is set during a Feeding-Phase period of time of the press machine 1, and thereby, a rotational state completion of a driving shaft 33 of the angle indexing apparatus 7 completes earlier than the Feeding-Phase period of time completion of the press machined 1 so that a non-rotating period of time can be provided.

Abstract: An array of electrically conductive waveguides is made by a method including defining slots in broad surfaces of planar dielectric slabs. The surfaces of the slabs, including slots, are metallized. The broad sides of the slabs are juxtaposed, with the slots registered with the planar surfaces of another slab, to form one or more closed waveguides. Heat pipes are made by defining apertures within the dielectric slabs, and introducing wick material into the apertures.

Abstract: In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother board and, after bonding wires are connected to the semiconductor chip, a lens barrel is joined to the wiring substrate mother board so as to cover the semiconductor chip. A position adjustment pin and a through hole are provided on the lens barrel and the wiring substrate mother board respectively outside a junction face between the lens barrel and the wiring substrate mother board to be used for adjusting the position of the lens barrel with respect to the wiring substrate mother board by inserting the position adjustment pin into the through hole.

Abstract: A method for heat-treating a plurality of microelectronic structures attached to a non-metallic substrate is disclosed. The method comprises the steps of: (a) placing the non-metallic substrate and the plurality of microelectronic structures in an oscillating electromagnetic field, whereby the plurality of microelectronic structures are heated by the oscillating electromagnetic field and the non-metallic substrate is essentially not heated by the oscillating electromagnetic field; (b) maintaining the non-metallic substrate and the plurality of microelectronic structures in the oscillating electromagnetic field until each of the plurality of microelectronic structures obtains a defined heat-treatment temperature substantially greater than an ambient temperature; (c) removing the non-metallic substrate and the plurality of microelectronic structures from the oscillating electromagnetic field; and (d) cooling the plurality of microelectronic structures to the ambient temperature.

Abstract: Methods to shield conductive layer from via. A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the conductive layer and create a short circuit. In one embodiment, the protective coating is sufficiently hard to deflect a drill bit being used to drill the via hole, thus protecting against misregistered drilled holes.

Abstract: A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers is formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.

Abstract: Tool for securing a tap connector having a C shaped member and a wedge using a ram tool. The tool head comprises an elongate base member comprising first and second ends. A collar at the first end of the base member has a through opening for receiving a ram tool. A head at the second end of the base member is aligned with the collar through opening to engage a C shaped member. A cable stop plate is mounted to the head for limiting movement of a tap line cable received in a C shaped member when a ram tool is securing a tap connector.

Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Abstract: A device for manufacturing a motor is disclosed. The motors to be manufactured have a stator body including a stator of the motor, field cores that protrude from the inside surface of the stator body, pole pieces that extend from the field cores to cross with the field cores, coil receiving parts defined by a space facing the field cores, the pole pieces and the inside surface of the stator body, and coils retained in the coil receiving parts. The device has first jigs that extend in the longitudinal direction of the stator body and retain the pole pieces as well as a second jig that extends in the longitudinal direction of the stator body. The second jig has a pressing part corresponding to the arcuate shape of the pole pieces. The device further includes a pressing mechanism that presses the first jigs retaining the pole pieces away from the coil receiving parts, thereby bending the pole pieces away from the coil receiving parts.

Abstract: An electronic component mounting apparatus is configured to adjust a positional relationship between two axes when an error occurs in the positional relationship between the axes when a beam is moved by two drive sources. According to movement of the beam for component picking and mounting operations, linear scale signals from linear scale reading heads are inputted to a Y2 driver and a Y1 driver, respectively. Each of the Y2 driver and the Y1 driver calculates a difference between positions of the drive axes of the beam and controls a moving member of a linear motor based on the difference so as to increase thrust of one drive axis when the one drive axis is in a more backward position than another drive axis and to reduce the thrust of one drive axis when the one drive axis in a more forward position than another drive axis.

Abstract: An electrically operated chucking apparatus including (a) an electrically operated chuck including at least two movable members movable toward and away from each other, and at least two drive devices which include respective electrically operated actuators operable to move the at least two movable members, respectively, toward and away from each other, and (b) a control device operable to control the at least two drive devices, and wherein the control device includes: a drive control portion operable to control the at least two drive devices such that each of at least one of an actual position and an actual speed of movement of the at least two movable members changes toward a predetermined target value; and a load detecting portion operable to detect a load acting on the at least two movable members during operation of the drive control portion to control the at least two drive device.

Abstract: The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.

Abstract: A method of assembling a magnetic tape cartridge where an opening, through which a magnetic tape is drawn out, is provided in part of a sidewall of a cartridge case across a lower half and an upper half of the cartridge case. A slide door that opens and closes the opening is mounted between guide portions provided in the cartridge lower and upper halves, while stressing the slide door with a spring member toward a position in which the opening is closed. During mounting, the slide door is stressed with the spring member toward the position in which the opening is closed by fitting a lower edge of the slide door into the guide portion of the lower half A mounting position of the slide door is retained by holding an end of the slide door facing a direction in which the slide door moves to close the opening.