Abstract: A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from contacting with and damaging the capacitor layers and forming vias directly between the capacitor electrodes and the board circuitry.

Abstract: A hand-held tool for terminating connectors onto a coaxial cable has an elongated body and an end stop and plunger on the body, the plunger being controlled by a lever arm which will axially advance the plunger toward and away from the end stop to radially compress a portion of the connector into firm crimping engagement with the end of the coaxial cable. To accommodate different lengths of connectors, a receiver is mounted on the plunger for insertion of different length adapter tips to vary the axial spacing between the receiver and the end stop according to the length of connector being terminated; and in still another form the body may include a hinged adapter adjacent to the end stop to vary the effective distance between the end stop and plunger according to the length of fitting being terminated.

Abstract: The inventive device comprises a positioning device (4) for a fitting head (14). The positioning device is anchored on a support (3), which is detachably fastened to a supporting body (2) of the inventive device. A control device (17) for the positioning device (4) is additionally fastened to the support. These functional parts form a completely operative functional unit, which can be separately tested, calibrated and supplied by the supporting body (2). Different supports (3, 23) for different positioning devices (4, 20) can be fastened to the supporting body (2), whereby the inventive device can be optimally adapted to perform different fitting tasks.

Abstract: A method is provided for manufacturing a multi-layer wiring circuit substrate. A first metal layer is selectively etched in first areas to reduce a thickness of the metal layer in the first areas and to form protrusions in other areas which extend above the etched areas. An interlayer-insulating layer is formed to overlie the etched areas of the first metal layer. The interlayer-insulating layer has an inner surface which confronts the etched first areas and an outer surface remote from the inner surface, such that the protrusions extend through the interlayer-insulating layer and have ends exposed at the outer surface. A second metal layer is then provided in conductive communication with the exposed ends of the protrusions, and the first and second metal layers are selectively patterned from surfaces remote from the interlayer-insulating layer.

Abstract: An integrated circuit includes a portion having at least one active circuit area. The integrated circuit also includes a redistribution metal layer fabricated at least partially during fabrication of the portion of the integrated circuit. A method for fabricating an integrated circuit includes fabricating a portion of the integrated circuit, where the portion includes at least one active circuit area. The method also includes fabricating a redistribution metal layer at least partially during fabrication of the portion of the integrated circuit.

Abstract: An interposer including a fence that receives and aligns a semiconductor device, such as a flip-chip type semiconductor device, with an interposer substrate. The fence may include edges that are configured to progressively align a semiconductor device with the interposer substrate. The fence may also include one or more laterally recessed regions to facilitate rough alignment of a semiconductor device with the interposer substrate. Methods for fabricating the fence include the use of stereolithographic and molding processes. When stereolithography is used to fabricate the fence, a machine vision system that includes at least one camera operably associated with a computer may be used to control a stereolithography apparatus and facilitates recognition of the position and orientation of interposer substrates on and around which material is to be applied in one or more layers to form the fence. As a result, the interposer substrates need not be precisely mechanically aligned.

Abstract: A method of installing a piston position sensor proximate to a closed end of a hydraulic cylinder is provided. The sensor is attached to the face of a piston and that piston/sensor combination is inserted into the cylinder tube to position the sensor in the desired location. When properly located within the cylinder tube, the sensor is affixed to the cylinder tube by means of beveled holes in the sensor that receive bolts threadedly inserted through the cylinder tube to further properly align the sensor within the cylinder tube. When so affixed, the sensor is then detached from the piston so that the piston can thereafter move independently of the sensor. A fixture is also used that allows the assembler to accurately align the angular orientation of the sensor prior to being inserted into the cylinder tube.

Abstract: A system for assembling wire harnesses with their connectors utilizes a compact computer-based system that is linked to an engineering data base. The data base contains component information, such as harness number, associated wires, and pin location to connector. An integrated tool contains a light panel that is linked to a dummy connector. The dummy connector has a mating end for the connector being pinned. The connector is mated to the dummy connector such that pin holes in the connector align with the light rods in the dummy connector. The wires are identified by voice recognition, bar code, and/or optical character recognition. Once a wire has been identified, the system illuminates the appropriate pin location on the selected connector, thereby providing a visible point of light in which the selected wire is to be terminated.

Abstract: A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.

Abstract: A system for performing an operation to a printed wiring board (PWB) having an apparatus for automatically resetting a PWB supporting device including a supporting table, supporting members which are set on a surface of the supporting table to support the PWB, a supporting-member storing device for storing the supporting members, a holding head for holding each of the supporting members, a moving device which moves the holding head relative to each of the supporting table and the storing device, in a direction parallel to the supporting table surface, so that the holding head takes a prescribed one of the supporting members from the storing device and sets the supporting member at a prescribed setting position on the surface of the supporting table, and takes the supporting member from the setting position and stores the supporting member in the storing device, and a control device which controls the moving device.

Abstract: The invention relates to a noise suppressor unit for installing a common mode choke for a noise suppressor in a power source module onto a circuit board of the power source module, the module being arranged onto a circuit board of a plug-in unit. The noise suppressor unit includes a holder onto which the common mode choke for the noise suppressor of the power source module is arranged, at least one lifting element for an assembly head or the like of an automatic assembly machine for placing the noise suppressor unit onto the circuit board of the power source module with the automatic assembly machine or the like, and at least one surface mounting element for surface mounting the common mode choke for the noise suppressor onto the circuit board of the power source module.

Abstract: A method of producing ceramic laminates includes forming a ceramic green sheet by applying a ceramic slurry on a carrier film; forming, maintaining a predetermined gap, a plurality of electrically conducting patterns having inclined surfaces at the ends by printing an electrically conducting paste on the main surface of the ceramic green sheet; forming ceramic patterns having inclined surfaces at the ends among the electrically conducting patterns by printing a ceramic paste with a distance of not smaller than 10?m from the electrically conducting patterns; and laminating ceramic green sheets on which are formed the electrically conducting and ceramic patterns.

Abstract: The present invention provides for a method for manufacturing flip chip resistors by applying a first electrode layer to a substrate to create at least one pair of opposite electrodes, applying a resistance layer between each pair of opposite electrodes, applying a first protective layer at least partially overlaying the resistance layer, applying a second protective layer at least partially overlaying at least a portion of the resistance layer, and applying a second electrode layer overlaying the first electrode layer, a portion of the resistance layer, and at least a portion of the second protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.

Abstract: Solder balls such as, low melt C4 solder balls, undergo volume expansion during reflow, such as may occur during attachment of chip modules to a PCB. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodated this volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.

Abstract: The method of forming a radiation shielding structure includes a first adhesive layer, a resin layer, and a metal foil laminated sequentially on a release layer of a plastic film. A metal layer pattern is formed from the metal foil. The first adhesive layer, the resin layer, and the metal layer pattern are formed sequentially from the bottom on a transparent substrate by separating the release layer from the first adhesive layer along an interface and then adhering the first adhesive layer to the transparent substrate.

Abstract: The present invention relates to a method for manufacturing a probe for detecting surface signals or chemical signals through a long and slender rod-shaped nano structure such as tungsten nanowire, carbon nanotube, boron nanotube, etc., being attached to a tip end portion thereof. According to the method, a holder, acting as the probe, including a first electrode to which the rod-shaped nano structure is attached, and a second electrode at a predetermined distance from the first electrode are partially or fully immersed in a solution containing the rod-shaped structure. When a voltage is applied between two electrodes, an electrical field is generated, and the rod-shaped nano structure is attached to the holder, acting as the probe.

Abstract: A method of forming a semiconductor package is provided. The method includes forming a leadframe wherein the conductors or leads of the leadframe extend from a first end to a second end such that a portion of each lead exhibits a generally arcuate shape. The first end may be coupled with a printed circuit board and the second end may be coupled with a semiconductor die. The generally arcuately shaped portion of the leads may include a portion which exhibits a constant radius. The generally arcuately shaped portion may also be formed from a plurality of conductor segments including, for example, at least one generally arcuately shaped segment. The semiconductor die and at least a portion of the leads may be encapsulated with an insulating material.

Abstract: An anti-electrostatic discharge (ESD) tool for engaging electronic device under test (DUT) boards whereby ESD damage to the tested devices is prevented. The tool includes an aluminum support frame, guides on opposing edges of one side of the frame for slidably receiving a DUT board, and at least one electrical shorting connector extending from the frame and electrically connecting and shorting socket connectors and leads of electronic devices when the DUT board is inserted into the guides. The electrical shorting connector preferably comprises an array of fine wire brushes which have sufficient rigidity and flexibility for engaging solder points on the DUT board for the socket connectors.

Abstract: A method of manufacturing an electronic component with a contact having a terminal section for brazing and a contact section includes steps that construct a contact base member of a material that is poorly wettable, forms a primer plating layer of a material that is poorly wettable to the weld brazing material on the base member, forms a finish plating layer of a material that is highly wettable to the weld brazing material on the primer plating layer, and selectively removes a portion of the finish plating layer to obtain an exposed region of the primer plating layer that serves as an arresting region for arresting the weld brazing material from creeping up and migrating along the highly wettable finish plating layer in brazing the terminal section to the brazing pad of a wiring board.

Abstract: An apparatus for dispensing blocks in a fluid over a substrate. The apparatus includes a first tube having a first end and a second end. A compression device is coupled to the first tube. A second tube is connected to the first tube to deliver a slurry having blocks to the first tube. The compression device pulsates at least one block in the slurry which is flowing through a portion of the first tube.