Abstract: A technique for increasing electronic component density on circuitry boards is disclosed. In one embodiment, the technique is realized as a method for increasing electronic component density on an electronic circuit board. The electronic circuit board has an electrically conductive signal layer formed on a dielectric layer, wherein the electrically conductive signal layer has a plurality of electrically conductive pads formed therein. The method comprises forming a cavity in the electronic circuit board extending through the electrically conductive signal layer and the dielectric layer.

Abstract: The disclosure relates to a method of producing an electrical connection to a sheet metal part, in particular to a sheet metal part having a non-conductive or poorly conductive protective layer, using a hollow fastener element which is mounted by means of the riveting or pierce riveting process to the sheet metal part, wherein a terminal lug is attached by means of a screw to the hollow fastener element, i.e. to the sheet metal part. The method is characterized in that the screw which is screwed into the hollow attachment element penetrates the sheet metal part and forms or reforms a thread in the sheet metal part. The disclosure furthermore relates to a component assembly which is produced in accordance with the said method.

Abstract: Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-hold by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.

Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.

Abstract: A contact of a circuit element is fixed to a terminal of a metallic plate by plastically deforming a portion of the terminal against the contact. The method of connecting the contact to a terminal includes forming a contact through-hole in the terminal, and inserting the contact into the contact through-hole. Next, a crushing punch plastically deforms a portion of the upper surface of the terminal adjacent the contact through-hole so that the terminal is connected to the contact.

Abstract: A press-fitting unit includes a vertically movable press blade for press-fitting an electrical wire to a terminal disposed in a press-fit-type terminal of a connector. A connector retaining bar, movable in a horizontal direction, is disposed to be opposed to the press blade. The retaining bar is provided with a plurality of connector receiving recesses in parallel to hold connectors with a press-fit terminal. A wire chuck is disposed so as to abut against a rear part of the press blade so that the chuck unitedly moves with the press blade. The wire chuck is horizontally movable to a side of the press blade.

Abstract: An method of manufacturing an inductor having a large current capacity which includes a magnetic sintered body formed via wet pressing treatment and a coil assembly disposed within the magnetic sintered body. The coil assembly is defined by a substantially cylindrical magnetic core member which is wound by a coil. Both ends of the coil of the coil assembly are respectively and electrically connected to an input electrode and an output electrode which are respectively disposed on two mutually facing end surfaces of the magnetic sintered body.

Abstract: The present invention discloses a back-up plate up/down apparatus in which a back-up plate is ascended or descended without rocking, maintaining a parallel state. The back-up plate up/down apparatus includes a base plate; guide blocks installed with a constant distance to the base plate; a first driving cylinder installed between the guide blocks; fixed blocks installed with a constant distance to both ends of the base plate and having rotating shafts inserted to both ends thereof; rotating links, in which the rotating shaft is inserted to an end thereof and a connecting member is connected to the other end thereof; a second driving cylinder connected to the connecting members by means of a rod; holders fixed at rods of other connecting members slidably and for fixing the back-up plate; and sensors installed to the holders with a constant distance.

Abstract: An apparatus for detecting a positioning error of an electric component with respect to a suction nozzle by which the electric component is held by suction under a negative pressure, wherein image data representative of images of the suction nozzle and a dog disposed near the suction nozzle are processed to obtain a relative position between the suction nozzle and the dog, a second image-taking step of taking an image of the electric component held by the suction nozzle and an image of the dog, and the positioning error of the electric component with respect to the suction nozzle is obtained on the basis of image data representative of images of the electric component and the dog, and the obtained relative position between the suction nozzle and the dog. Also disclosed is a method and apparatus for mounting the electric component on a circuit substrate, on the basis of the obtained positioning error of the electric component.

Abstract: In an assembly of layers, a first layer has a recess, a second layer is deposited over the first layer, and a third layer is deposited over the second layer and fills the recess. The material of the third layer is less wear resistant than the second layer. After forming the second layer, the assembly is polished to create a flat and smooth surface. The polishing is stopped upon reaching the second layer.

Abstract: A method for fabricating an interconnect for testing semiconductor components forms contacts on a substrate configured to support and electrically engage bumped contacts on the components. Each contact includes a support member suspended on the substrate on cantilevered spring segment leads. The method includes the steps of forming a polymer material on the substrate, forming a metal layer on the polymer material and the substrate, forming the support member and leads in the metal layer, and then removing the polymer material to suspend the support member. In a first embodiment the polymer material fills a recess in the substrate and the support member is suspended on the recess. In a second embodiment the polymer material is formed as a bump, and the support member is suspended on a surface of the substrate.

Abstract: A hand-held tool for terminating connectors onto a coaxial cable has an elongated body and an end stop and plunger on the body, the plunger being controlled by a lever arm which will axially advance the plunger toward and away from the end stop to radially compress a portion of the connector into firm crimping engagement with the end of the coaxial cable. To accommodate different lengths of connectors, a receiver is resiliently mounted on the plunger for insertion of different length adapter tips to vary the axial spacing between the receiver and the end stop according to the length of connector being terminated; and in still another form the body may include a hinged adapter adjacent to the end stop to vary the effective distance between the end stop and plunger according to the length of fitting being terminated.

Abstract: Apparatus for the manufacture of a component such as an integrated circuit chip, including: a plurality of processing stations forming a production line for the manufacture of the component, a conveyor adapted to transport component forming materials from one processing station to another in the production line, and a storage on the production line for storing the materials during transport along the production line. The storage acts as buffers effectively to collect materials and store them for efficient transport along the production line.

Abstract: A nozzle-mounting device for removably mounting, on a nozzle holder, a suction nozzle for holding an electric component by suction, wherein the nozzle holder includes one of a first fitting portion and a second fitting portion which respectively have an inner circumferential surface and an outer circumferential surface and which are arranged to effect a fitting engagement with each other at the inner and outer circumferential surfaces, while the suction nozzle includes the other of the first and second fitting portions, and one of the first and second fitting portions is provided with a first abutting portion located at an axially intermediate portion of mutually fitting parts of the inner and outer circumferential surfaces, while the other of the first and second fitting portions is provided with a second abutting portion arranged to be brought into abutting contact with the first abutting portion in a direction intersecting the axes of the fitting portions, and wherein a pressing device is provided to force

Abstract: A tool for inserting wires or cables in a flexible harness wrap is disclosed. The tool includes a first member and a second member connected to the first member. The first member has an extension member connected thereto, and a first nose portion extending at an oblique angle from the first bottom end. The second member has a receiving member connected thereto, and a second nose portion extending at an oblique angle from the second bottom end. The first and second members are movable from a first, closed position to a second, open position. The open position is at least 50 degrees from the closed position. A method of inserting wires or cables in a flexible harness wrap is also disclosed.

Abstract: The manufacturing method for components of the inductive type, in particular inductance coils, transformers or antennae, consists in making by micro-machining simultaneously on a first substrate made of magnetic material a plurality of first parts (1) connected to each other by connecting elements (2) or a connecting support, inserting on the arms (8a, 8b, 8c) of these first parts (1) a printed multi-layered plate (4, 5) having openings for the arms and metal windings ending in at least two contact pads (7a, 7b), in placing and securing a second substrate made of magnetic material on the first substrate and the plate, said second substrate having undergone micro-machining to obtain second parts (13) complementary to the first parts. These second parts are connected to each other by connecting elements or a connecting support.

Abstract: A manufacturing method of a printed wiring board. On a conductor plate 1, approximately conical conductor bumps 1a, 1a, . . . are formed, the conductor bumps 1a, 1a, . . . being caused to penetrate through a prepreg 5 to project tip ends of the conductor bumps 1a, 1a, . . . from an opposite side of the prepreg 5. The tip ends of the conductor bumps 1a, 1a, . . . and interconnection patterns 7a and 7b on surfaces of core material 17A, before bonding, are exposed to plasma to activate. The activated tip ends of the conductor bump 1a, 1a, . . . and interconnection patterns 7a and 7b on the surface of the core material are stacked to bond both.

Abstract: Linear configurations of metallic fuse sections have a bit combination which represents a characteristic of a circuit on a wafer. The metallic fuse sections need to be rid of a polyimide layer covering them in order to make it possible to burn the fuse sections. In the event of unsatisfactory adherence to process parameters and insufficient removal of polyimide on the metallic fuse sections, a resulting relative error in a characteristic of the circuit is minimized according to the method since the fuse section corresponding to the most significant bit is neighbored on both sides by other fuse sections.

Abstract: A method and circuit board assembly provide a zero interconnection height in a board-to-board interconnect while maintaining efficient space allocation for multiple axis connections by providing a floating connection in one plane thereby enabling a connection in another plane.

Abstract: A method for manufacturing radio frequency module components with a surface acoustic wave element includes a gold plating step of plating gold at a component bonded portion on a conductive surface of a ceramic multi-layer substrate 40 to have a mounted electrode 43, a surface acoustic wave element mounting step of face down bonding a flip chip 30 as the surface acoustic wave element on the ceramic multi-layer substrate 40 by the gold—gold connection, a side wall formation step of bonding a side wall member 60 surrounding the flip chip 30 onto the ceramic multi-layer substrate 40 by adhesives, a lid formation step of bonding a lid member 61 enclosing an opening of the side wall onto the side wall member by adhesives, after mounting the flip chip 30, and a soldered component mounting step of mounting a soldered component 50 by the use of solder, after the lid formation step.