Patents Examined by Minh Trinh
-
Patent number: 6658720Abstract: A method of manufacturing an electromagnetic flow sensor having a measuring tube with an insulating liner having a reinforcing body embedded therein includes the steps of producing the liner in situ in a support tube, and forming a sintering space in the support tube by inserting a sintering mandrel therein. The support tube is closed, leaving one filling aperture for a granular material to be sintered. The reinforcing body is formed in the support tube such that it fits its lumen, by introducing the material to be sintered into the sintering space, sintering, and removing the mandrel. A casting space is formed in the support tube by fixing a casting mandrel therein, and leaving one casting aperture for a liquefied insulting material. The liner is formed by introducing the insulating material into the casting space, allowing to penetrate into the reinforcing body, and solidify in the support tube lumen.Type: GrantFiled: March 13, 2000Date of Patent: December 9, 2003Assignee: Endress + Hauser Flowtec AGInventors: Daniel Frey, Antonio Magliocca
-
Patent number: 6655013Abstract: A terminal applicator (50) for attaching an electrical flag terminal (2) to a wire (54) includes a wire guide (74) and crimping tooling (70, 72) attached to and carried by a ram (68). The wire guide has a wire guiding surface (100) that cooperates with lead in angled surfaces (92, 98) of the crimping tooling (70, 72) to guide the wire into alignment with the terminal. The lead in angled surfaces of the tooling are typically limited to the side of the terminal opposite the receptacle portion (4) while the wire guide surface is positioned on the same side as the receptacle portion.Type: GrantFiled: June 6, 2001Date of Patent: December 2, 2003Assignee: Tyco Electronics CorporationInventors: Richard Orley Wilson, Russell Thomas Diven
-
Patent number: 6651316Abstract: An apparatus for automatically resetting a printed-wiring-board supporting device including a supporting table and a plurality of supporting members which are set on a surface of the supporting table to support a back surface of a printed wiring board, the apparatus including a supporting-member storing device in which the supporting members are stored, a holding head which can hold each of the supporting members, a moving device which moves the holding head relative to each of the supporting table and the storing device, in a direction parallel to the surface of the supporting table, so that the holding head takes a prescribed one of the supporting members from the storing device and sets the supporting member at a prescribed setting position on the surface of the supporting table, and takes the supporting member from the setting position and stores the supporting member in the storing device, and a control device which controls the moving device.Type: GrantFiled: July 27, 2001Date of Patent: November 25, 2003Assignee: Fuji Machine Mfg. Co., Ltd.Inventors: Takeyoshi Isogai, Noriaki Iwaki
-
Patent number: 6651321Abstract: A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element is heated so as to activate the bonding material, and then cooled, leaving said contacts on said microelectronic element bonded to said conductive features on the connection component. The connection component is maintained at an average temperature below the glass transition temperature of the polymer in the connection component during the heating and cooling steps.Type: GrantFiled: March 10, 2000Date of Patent: November 25, 2003Assignee: Tessera, Inc.Inventors: Masud Beroz, Belgacem Haba, Klaus-Jurgen Wolter
-
Patent number: 6651310Abstract: A method of manufacturing an aluminum rotor and motor incorporating the rotor where after a solvent cleaning step of a rotator body using a chlorine-family solvent, an alkaline degreasing step using an alkaline degreasing agent is executed for cleaning the rotator body, and the rotator body after undergoing the solvent cleaning step is simply immersed in a treatment tank storing an alkaline degreasing agent, whereby the chlorine-family solvent remaining on the rotator body or aluminum chloride produced by the chlorine-family solvent reacting with aluminum material reacts with the alkaline degreasing agent and is removed easily and well.Type: GrantFiled: February 23, 2000Date of Patent: November 25, 2003Assignee: Kabushiki Kaisha Sankyo Seiki SeisakushoInventor: Masayuki Ishikawa
-
Patent number: 6651315Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising: (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals. Preferably preferred devices contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes.Type: GrantFiled: October 27, 1998Date of Patent: November 25, 2003Assignee: Tyco Electronics CorporationInventors: Gregory A. Graves, Michael Mengruo Zhang, Daniel Chandler, Chi-Ming Chan, Shou-Mean Fang, Dennis Siden, Mark Thompson
-
Patent number: 6643917Abstract: The system of the present invention provides a pair of assembly modules for assembling electronic components to a series of printed circuit boards or like substrates. The pair of assembly modules are operatively connected in series, and each module includes a pair of assembly stations operating in parallel within the module. Means are provided to bypass the first assembly module and deliver unpopulated substrates to the second module for processing, while simultaneously bypassing the second assembly module with substrates populated by the first assembly module. In the event that one of the assembly stations of either assembly module is inoperative, it may be bypassed and the assembly of its electronic components redistributed to the remaining, operative assembly stations to optimize the productivity of the system.Type: GrantFiled: January 19, 2000Date of Patent: November 11, 2003Assignee: Delaware Capital FormationInventor: Koenraad A. Gieskes
-
Patent number: 6643918Abstract: The present invention provides methods for shielding a cable that comprises a plurality of conductive leads that are encapsulated by a dielectric substrate. One embodiment of the method comprises applying a metallized layer around the dielectric substrate and coupling a metallized thermoform shield around an end of the metallized dielectric substrate and conductive leads so as to create a conductive connection between the metallized thermoform shield and the metallized layer on the dielectric substrate.Type: GrantFiled: February 16, 2001Date of Patent: November 11, 2003Assignee: Shielding for Electronics, Inc.Inventors: Jesus Al Ortiz, Rocky R. Arnold
-
Patent number: 6640419Abstract: A method of making magnetic circuit (1) with coil having an electric coil (2) and a magnetic core (3), the coil (2) comprising a conducting wire (6) and an end plate (4) and connector (5) being arranged at respective ends of the coil (2). The coil is mounted on the magnetic core (3) which is formed of a tore-shaped magnetic wire.Type: GrantFiled: March 15, 2000Date of Patent: November 4, 2003Assignee: Liaisons Electroniques-Mecaniques LEM S.A.Inventor: Frédéric Cattaneo
-
Patent number: 6640436Abstract: A method for fabricating a semiconductor device includes removing a predetermined part of an insulative layer of a coated fine metallic wire by irradiating the predetermined part with a laser light and connecting the predetermined part of the fine metallic wire to one of the semiconductor device and a package of the semiconductor device. The insulative layer contains a substance that absorbs the laser light at a predetermined lasing wavelength.Type: GrantFiled: September 19, 2000Date of Patent: November 4, 2003Assignee: NEC Electronics CorporationInventors: Naoto Kimura, Takahiro Ito
-
Patent number: 6640432Abstract: A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.Type: GrantFiled: April 12, 2000Date of Patent: November 4, 2003Assignee: FormFactor, Inc.Inventors: Gaetan L. Mathieu, Benjamin N. Eldridge, Stuart W. Wenzel
-
Patent number: 6634089Abstract: A method for dismantling a magnetic field generator, which includes the steps of providing a plate yoke, and a permanent magnet provided on the plate yoke and having a plurality of neodymium magnets bonded together by an adhesive for the magnetic field generator; heating the magnetic field generator at a temperature of 200° C.˜1000° C.; and thereafter dismantling the magnetic field generator. The dismantling method further includes the step of providing a column yoke connected to the plate yoke for the magnetic field generator.Type: GrantFiled: July 13, 2000Date of Patent: October 21, 2003Assignee: Sumitomo Special Metals Co. Ltd.Inventors: Masaaki Aoki, Shigeo Hashimoto
-
Patent number: 6634100Abstract: Methods for fabricating an interposer, wherein the fence include the use of stereolithographic and molding processes. When stereolithography is used to fabricate the fence, a machine vision system that includes at least one camera operably associated with a computer may be used to control a stereolithography apparatus and facilitates recognition of the position and orientation of interposer substrates on and around which material is to be applied in one or more layers to form the fence. As a result, the interposer substrates need not be precisely mechanically aligned.Type: GrantFiled: April 26, 2001Date of Patent: October 21, 2003Assignee: Micron Technology, Inc.Inventors: Salman Akram, Alan G. Wood, Warren M. Farnworth
-
Patent number: 6634096Abstract: A terminal removal jig, for removing a terminal within a connector housing, having an outer case with a guide groove, a positioning member which has a protruding portion to be engaged with a terminal insertion hole at a front end of the connector housing, an elastic body for urging the positioning member and an unlocking plate secured on the outer case and having an unlocking pin to be mated with a locking lance within the connector housing. The unlocking pin is located behind the protruding portion and is kept in contact with the outer wall of the positioning member. The protruding portion is engaged with the terminal insertion hole and the tip of the unlocking pin faces a terminal removal jig insertion hole opposite to the locking lance. A protruding strip is formed on the outer wall and a front guide hole is formed in the unlocking plate.Type: GrantFiled: November 6, 2000Date of Patent: October 21, 2003Assignee: Yazaki CorporationInventors: Masaya Yamamoto, Kimihiro Abe
-
Patent number: 6634093Abstract: A mounter head is provided for a surface mounting apparatus which is capable of easily controlling a pitch of a mounting device as well as preventing backlash when the device is mounted on a printed circuit board. The mounter head includes a rack block having a rack for moving up and down by means of a pinion rotated by a driving source; a nozzle shaft installed at one side of the moving unit; a nozzle secured to the lower end of the nozzle shaft for sucking a device to be mounted; and a driving source installed corresponding to each nozzle shaft for rotating each nozzle.Type: GrantFiled: March 27, 2000Date of Patent: October 21, 2003Assignee: Mirae CorporationInventor: Dong Suh Lee
-
Patent number: 6634079Abstract: An optical fiber cleaver, comprising a blade capable of applying a scratch to the outer peripheral surface of an optical fiber and a pusher pushing the optical fiber to cleave it at the scratched part, wherein it further comprises a reverse-running prevention mechanism which prevents the blade which was moved directly and gave scratch to the optical fiber from being directly moved reversely and giving scratch again to the optical fiber, the reverse-running prevention mechanism comprises a cam moved directly in connection with the blade and a cam follower being in contact with the cam and capable of directly moving the pusher, and the cam presses the pusher automatically against the optical fiber for cleavage after the optical fiber has been scratched by the blade and, after the scratch has been given completely, locked with the cam follower so as to suppress the cam from being moved directly in the reverse direction.Type: GrantFiled: May 11, 2000Date of Patent: October 21, 2003Assignee: The Furukawa Electric Co., Ltd.Inventor: Junichi Kazama
-
Patent number: 6634083Abstract: A method is used for forming a magnet keeper assembly for use in a microactuator. The method comprises forming a keeper from a ferromagnetic material where the keeper has a plurality of notches for accepting a plurality of magnetic materials, securing the magnetic materials in the notches in the keeper, notching the magnetic material and the keeper transversely at a depth approximately equal to the depth of the magnetic material, removing any debris generated during notching, subjecting the keeper to a magnetic field such that the magnetic materials become magnetized, and cutting the keeper into magnet keeper assemblies.Type: GrantFiled: February 20, 2001Date of Patent: October 21, 2003Assignee: Seagate Technology LLCInventor: Zine-Eddine Boutaghou
-
Patent number: 6629357Abstract: A magnetic head manufacturing method. In one embodiment, a wafer including magnetic head devices formed on the surface thereof are cut out into individual sliders. Photoresist is applied on the air bearing surfaces of the sliders and is then baked. The surface tension causes the photoresist at the peripheral regions of the air bearing surface to taper and become rounded or thinned. The air bearing surface is then uniformly dry-etched such that the peripheral regions of the air bearing surface are rounded in a tapered shape.Type: GrantFiled: February 10, 1999Date of Patent: October 7, 2003Assignee: Read-Rite SMI Corp.Inventor: Shin-ichi Akoh
-
Patent number: 6629363Abstract: A process for picking up and moving a microelectronic package during card assembly operations. A clipping lid having a top surface and at least two sides attaches to a substrate via friction where the sides act as leaf springs gripping the substrate. The top surface of the lid provides a clean, smooth, flat surface to which a vacuum probe may be attached. In the preferred embodiment, the lid and sides are formed from an integral piece of stainless steel. Also provided are flares at the bottom of each side to aid in guiding the lid onto the substrate. Protrusions are provided in the sides to prevent the lid from slipping too far onto the substrate and contacting the components mounted to the substrate. Also provided is at least one hole in the top surface to allow the lid to be pried free from the substrate after completion of the steps where vacuum probe movement is required.Type: GrantFiled: January 22, 1998Date of Patent: October 7, 2003Assignee: International Business Machines CorporationInventor: Joseph Ying-Yuen Chan
-
Patent number: 6629365Abstract: A method of providing environmental protection to an electronic component includes placing an electromagnetic shield having at least one cavity in contact with a circuit board having electrical components thereon so as to substantially enclose at least a first compartment between the circuit board and the shield, the shield includes at least one entry hole connecting to the first compartment. A conformal coating is applied by introducing the conformal coating into the first compartment through the entry hole while holding the shield in contact with the circuit board so that the coating is applied to the exposed portions of the circuit board within the compartment, but not applied to portions of the circuit board contacted by the shield. An electrically conductive gasket may be positioned between and in contact with both the circuit board and the shield before the applying of the conformal coating.Type: GrantFiled: February 7, 2001Date of Patent: October 7, 2003Assignee: Ericsson Inc.Inventors: Quentin Scott Denzene, Edwin John Nealis