Patents Examined by Minh Trinh
  • Patent number: 6625869
    Abstract: A method for manufacturing a nonreciprocal circuit device, wherein when the nonreciprocal circuit device, such as an isolator, is manufactured having central conductors disposed adjacent to a magnetic body, to which a DC magnetic field is applied, and a case receiving the central conductors and the magnetic body therein, the central conductors are integral with a hoop and are formed by punching the hoop made of a metal film, the hoop is wound around a reel while the central conductors are transported, and when the nonreciprocal circuit devices are manufactured, the central conductors are fed into a manufacturing step after being separated from the hoop.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: September 30, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takahiro Jodo
  • Patent number: 6625870
    Abstract: A method for aligning head suspension structures minimize to misalignments between a flexure and a load beam of the head suspension. The load beam and the flexure of the head suspension include a first aperture formed near a load point dimple of the head suspension to provide a reference datum. An elongated alignment aperture is formed in the rigid region of the load beam, and a proximal alignment aperture and a distal alignment aperture are formed in the flexure. The elongated the aperture overlaps at least a portion of the proximal and distal alignment apertures in such a manner that the proximal perimeter edge of the elongated aperture encroaches on the proximal alignment aperture and the proximal perimeter edge of the distal alignment aperture encroaches upon the elongated alignment aperture.
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: September 30, 2003
    Assignee: Hutchinson Technology Incorporated
    Inventors: Thomas F. Heeren, Kirk J. Van Dreel, Raymond R. Wolter
  • Patent number: 6622375
    Abstract: A method for producing a fuse element having a fusible portion and any other portion which are made of different kinds of metal. The method comprises the steps of boring through-hole in a substrate made of first metal, forming an element plate by fusion-bonding a second metal to the through-hole and integrally stamping a pair of substrate portion made of the first metal and a low-melting-point portion made of the second metal. The second metal is made of a metal whose melting point is lower than that of the first metal. Further, the pair of substrate portion is connected together by the low-melting-point portion so that the fuse element is formed.
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: September 23, 2003
    Assignee: Yazaki Corporation
    Inventors: Takayoshi Endo, Takashi Ishii
  • Patent number: 6622368
    Abstract: A method of manufacturing a transducer of the type having a diaphragm (11) with a predetermined tension. After the transducer has been manufactured with its basic structure the diaphragm is adjusted to have a predetermined tension, which is preferably low in order to obtain a high sensitivity. Two embodiments are disclosed. One embodiment includes heating the transducer to a temperature above the glass transition temperature of the material (12, 14) retaining the diaphragm. Another embodiment includes measuring the actual tension of the diaphragm, which can be used to calculate an adjustment of the thickness of the diaphragm resulting in the desired tension.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: September 23, 2003
    Assignee: SonionMEMS A/S
    Inventors: Matthias Müllenborn, Pirmin Rombach
  • Patent number: 6622370
    Abstract: A method for fabricating a suspended transmission line includes supporting a first conductive trace on a first side of a dielectric support layer. A second conductive trace is supported on a second side of the support layer. The first and second conductive traces are connected at spaced intervals. A first spacer is formed outwardly of the first side of the support layer A second spacer is formed outwardly of the second side of the support layer. A first plate is disposed outwardly of the first spacer and includes a first ground plane displaced from the first conductive trace. A second plate is disposed outwardly of the second spacer and includes a second ground plane displaced from the second conductive trace.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: September 23, 2003
    Assignee: Raytheon Company
    Inventors: James R. Sherman, Ray B. Jones, Barry B. Pruett
  • Patent number: 6618928
    Abstract: A method for loading slot cell insulators into a plurality of slots in a stator core of a dynamoelectric machine is disclosed. The method includes forming a slot cell insulator having a generally U-shape cross-section. The slot cell insulator may be turned so that an open end of the generally U-shape slot cell insulator face a loading assembly. The slot cell insulator is moved into the loading assembly. The forming and moving are repeated until a plurality of slot cell insulators are stored in the loading assembly. The plurality of slot cell insulators are pushed from the loading assembly into the slots of the stator core.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: September 16, 2003
    Assignee: Reliance Electric Technologies, LLC
    Inventor: Hobart DeHart
  • Patent number: 6618932
    Abstract: On a turntable are disposed a plurality of applicators and their respective terminal reels holding strings of terminals. A rail and a shank holder guide are provided between a press for operating one of the applicators and a waiting position on the turntable. One of the applicators alone moves between a set position in the press and the waiting position on the turntable.
    Type: Grant
    Filed: March 20, 2001
    Date of Patent: September 16, 2003
    Assignee: Yazaki Corporation
    Inventor: Hiroshi Hasegawa
  • Patent number: 6618939
    Abstract: A process for producing a resonant tag, wherein a metal foil having a thermal adhesion adhesive applied to at least one face thereof is stamped out into a circuit-like shape and is adhered to a base sheet, the process comprising: stamping out the metal foil into a predetermined shaped metal foil portion (4c) while being passed through a die roll (1) having thereon a stamping blade with a predetermined shape and a transfer roll (2) in contact with the die roll (1) which functions also as a die back-up roll; holding this metal foil portion obtained by the stamping-out operation onto the surface of the transfer roll by suction holes formed in the transfer roll; and thermally adhering the stamped metal foil portion to the base sheet (7) in contact with the transfer roll (2) at its another face by an adhesive roll (3) in contact with the transfer roll through the base sheet.
    Type: Grant
    Filed: September 15, 1999
    Date of Patent: September 16, 2003
    Assignee: Kabushiki Kaisha Miyake
    Inventors: Shinya Uchibori, Takaaki Mizukawa, Yoshinori Hatanaka
  • Patent number: 6618930
    Abstract: A method for improving the operational performance of a disc drive through the identification of vital product information associated with a head-disc assembly (HDA) of the disc drive. The disc drive comprises a printed wiring assembly (PWA) housing control circuitry for the disc drive. The HDA of the disc drive is operably coupled to the printed wiring assembly and includes a rotatable disc to which data are written by a controllably positionable head. A non-volatile memory device is mounted on the HDA and operably coupled to the PWA so that, when the disc drive is initialized, the PWA verifies the configuration of the HDA before proceeding with the initialization of the disc drive, thereby preventing errors and damage to the disc drive as a result of the installation of a new, replacement PWA in the disc drive, or the downloading of new, incorrect firmware to the PWA.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: September 16, 2003
    Assignee: Seagate Technology LLC
    Inventors: Wilson Massey Fish, David Christopher Pruett
  • Patent number: 6615486
    Abstract: A pressure welding device for wiring and a wire harness manufacturing method are provided. The pressure welding device for wiring includes a pressure welding unit for pressure-welding wires to connectors and a wiring plate provided with wiring fittings and placed in a position toward which the wires are pulled from the pressure welding unit. The wiring plate and the pressure welding unit are movable in a wire pulling direction. Wires are pressure-welded to one connector by the pressure welding unit. As the connector is pulled toward the wiring plate so as to hook the wires by predetermined wiring fittings. The wires are then pressure-welded to the other connector. After the wires are pressure-welded to the other connector, a continuity test of the wire harness is conducted on the wiring plate. After the wiring, the wiring plate and the pressure welding unit are moved in a wire pulling direction so as to eliminate the slack of the wires.
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: September 9, 2003
    Assignee: Yazaki Corporation
    Inventor: Kazuhiko Takada
  • Patent number: 6615481
    Abstract: The present invention relates to a method of fabricating electromagnetic coil vanes. The method utilizes laser machining to provide high resolution, dense coil wire patterns on both sides of a ceramic vane substrate. A firing operation is first performed that eutectically bonds the copper to the ceramic. Laser machining is then used to produce a coil pattern in the copper. The substrate is drilled to provide a through hole which, when filled or partially filled with a conducting material, forms an electrical connection between the two coil patterns.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: September 9, 2003
    Assignee: Nikon Corporation
    Inventors: Mark J. LaPlante, David J. Pinckney
  • Patent number: 6606791
    Abstract: A method of attaching a component having a fiducial marker to a substrate is provided. The method includes detecting alignment of the fiducial marker, aligning the component such that the fiducial marker matches a predetermined fiducial alignment, and attaching the component to a substrate.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: August 19, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Darryl L. Gamel, Kreg W. Hines
  • Patent number: 6606783
    Abstract: A chip thermistor has a pair of outer electrodes opposite each other with a specified distance in between on one of the surfaces of a thermistor element and an inner electrode extending inside the thermistor element so as to overlap these outer electrodes in the direction perpendicular to the surface on which the outer electrodes are formed. An electrically insulating layer is preferably formed on the same surface as and between the pair of outer electrodes. Each of the outer electrodes may be formed with two or more layers, the outermost of the layers being of gold. The resistance value of such a chip thermistor can be adjusted by abrading at least a portion of the edges of the thermistor element together with portions of the outer electrodes.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: August 19, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masahiko Kawase, Norimitsu Kitoh
  • Patent number: 6598508
    Abstract: An optical fiber cutting device provided with a speed reducing part which transmits drive force by reducing the drive speed of the external drive force, a drive force transmission part which transmits the drive force from the speed reduction part to the cutting blade holder, a cutting blade holder, a cutting blade which is held by the cutting blade holder and moves to the cutting position along with said cutting blade holder, and an optical fiber supporter which supports the optical fiber so as to be perpendicular to said cutting blade at the cutting position. In addition, when a cutting blade with a blade thickness &agr; (mm) is used, and said cutting blade is moved at a speed &bgr; (mm/minute) during cutting, &agr; and &bgr; fulfill the expression &bgr;≦−253&agr;+65.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: July 29, 2003
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Ryuichi Ishikawa, Kyosuke Harada, Taichi Masuda
  • Patent number: 6594891
    Abstract: A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material with a plane of at least one electrically insulating material on both sides of the at least one plane of at least one electrically conducting material. The at least one core includes a plurality of placed through holes formed therethrough. At least one pad is provided over at least one of the plated through holes. The pad provides a flat surface for attaching an electronic device and also prevents solder from entering the at least one plated through hole.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: July 22, 2003
    Assignee: International Business Machines
    Inventors: James Steven Kamperman, Thomas Patrick Gall, David Brian Stone
  • Patent number: 6594882
    Abstract: In a motor yoke manufacturing method, a flat metal plate is die-cut into a base plate for a yoke which comprises a bottom wall and a side wall. The base plate is plastically deformed to form a bearing accommodating holder and protrusions on the bottom wall. After a bearing member is placed in the bearing accommodating holder, a resilient plate is placed in contact with the bearing member and the protrusions are plastically deformed to tightly fix the resilient plate to the bottom wall. The base plate is plastically deformed to shape a generally bottomed cylindrical configuration of the yoke. Thus, the yoke is manufactured without a flushing process for removing machining oil or machining debris.
    Type: Grant
    Filed: November 10, 1999
    Date of Patent: July 22, 2003
    Assignee: Asmo Co., Ltd.
    Inventors: Fumihiro Tanida, Matsuo Yamashita, Kazuhiko Nagasaka
  • Patent number: 6591491
    Abstract: A producing method of a multilayer circuit board for ensuring that a circuit board, such as an interposer, is provided on the multilayer circuit board. The method includes the steps forming the interposer on a support board; forming a multilayer circuit board separately from the interposer; joining the interposer formed on the support board to the multilayer circuit board; and then removing the support board. According to this method, even if the production of the interposer fails after the production of the multilayer circuit board, it is possible to scrap the interposer only and there is no need to scrap it together with the multilayer circuit board. Besides, although the interposer is thin and limp, since it is formed on the support board, the interposer can surely and readily be joined to the multilayer circuit board.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: July 15, 2003
    Assignee: Nitto Denko Corporation
    Inventors: Hirofumi Fujii, Satoshi Tanigawa
  • Patent number: 6591726
    Abstract: A orientation device including two turrets, carrying a plurality of punch-die pairs, are rotatable to carry a punch-die pair to a work station and, simultaneously, another punch-die pair to a changeover station. A magazine of punch-die pairs comprises at least one pair of discs joined to each other and carrying a series of punch-die pairs. The discs are selectively rotated to take a predetermined new punch-die pair to a collection station. At least one exchange arm is rotated by a corresponding servomotor and carries at least one gripper element, axially and radially moveable with respect to the arm, independently of each other.
    Type: Grant
    Filed: July 16, 1998
    Date of Patent: July 15, 2003
    Assignee: Rainer S.r.l.
    Inventor: Eugenio Perazzolo
  • Patent number: 6591480
    Abstract: A method for fabricating a flux concentrating stitched write head for high data rate applications wherein said flux concentration is achieved by means of a non-magnetic step embedded into a portion of the lower magnetic pole just beneath the write gap layer. The design permits extremely short throat heights, which will be required by future high data rate applications.
    Type: Grant
    Filed: May 12, 2000
    Date of Patent: July 15, 2003
    Assignee: Headway Technologies, Inc.
    Inventors: Mao-Min Chen, Pokang Wang, Cherng-Chyi Han
  • Patent number: 6591477
    Abstract: A method for making an armature assembly is provided that reduces the level of acoustic noise during initial engagement of the armature, during slippage, and during disengagement. The armature assembly includes an armature disc, an annulus of sound damping material, and a hub assembly having a flexible spider with a web portion. The armature assembly is made by first forming the annulus of sound damping material with a plurality of angularly spaced molding tabs. The annulus is affixed to the web portion of the hub assembly using the molding tabs and is then compressed by securing the armature disc to the web portion such that one side of the annulus is disposed against the web portion and a second side of the annulus is disposed against the armature disc.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: July 15, 2003
    Assignee: Warner Electric Technology, Inc.
    Inventor: James A. Licari