Abstract: A dual-channel Dual In-Line Memory Module (DIMM) includes a first memory element configured to perform memory transactions for first memory locations associated with the first memory element via a first memory channel of the dual-channel DIMM, and a second memory element configured to perform memory transactions for second memory locations associated with the second memory element via a second memory channel of the dual-channel DIMM, wherein the first memory channel is different than the second memory channel, and wherein the first memory element is a different type of memory element than the second memory element.

Abstract: A memory system includes: a memory device including a plurality of memory blocks; a memory; a data classifier suitable for classifying check-pointing information stored in the memory as selective information and mandatory information; and a check-pointing component suitable for performing a control to periodically perform a check-pointing operation of programming the selective information and the mandatory information in a memory block, wherein the check-pointing component performs the check-pointing operation by performing a control to program the mandatory information after programming the selective information.

Abstract: A device, for example a memory system, is disclosed wherein two or more operational modes may be set. The clock toggle rate and ODT resistors are dynamically controlled based on one or more of a desired margin of signal integrity, performance, cooling rate, and power consumption.

Abstract: Apparatuses and techniques for compensating for noise, such as a leakage current, in a memory array are described. Leakage currents may, for example, be introduced onto a digit line from unselected memory cells. In some cases, a compensation component may be coupled with the digit line during a first phase of a read operation, before the target memory cell has been coupled with the digit line. The compensation component may sample a current on the digit line and store a representation of the sampled current. During a second phase of the read operation, the target memory cell may be coupled with the digit line. During the second phase, the compensation component may compensate for leakage or other parasitic effects by outputting a current on the digit line during the read operation based on the stored representation of the sampled current.

Abstract: A method is described. The method includes configuring first register space to establish ODT values of a data strobe signal trace of a DDR data bus. The method also includes configuring second register space to establish ODT values of a data signal trace of the DDR data bus. The ODT values for the data strobe signal trace are different than the ODT values for the data signal trace. The ODT values for the data strobe signal do not change when consecutive write operations of the DDR bus write to different ranks of a same DIMM.

Abstract: A memory device includes a memory cell array including a plurality of word lines, at least one select line provided above the plurality of word lines, and a channel region passing through the plurality of word lines and the at least one select line, the plurality of word lines and the channel region providing a plurality of memory cells, and a controller. The controller is to store data in a program memory cell among the plurality of memory cells by sequentially performing a first programming operation and a second programming operation, and to determine a program voltage input to a program word line connected to the program memory cell, in the first programming operation, based on information regarding the program memory cell.

Abstract: Structures for a bitcell of a non-volatile memory and methods of fabricating and using such structures. Non-volatile memory elements are arranged in a Wheatstone bridge arrangement having a first terminal and a second terminal. A first field-effect transistor is coupled with the first terminal of the Wheatstone bridge arrangement, and a second field-effect transistor is coupled with the second terminal of the Wheatstone bridge arrangement.

Abstract: Briefly, embodiments of claimed subject matter relate to circuits and methods for providing signals, such as signals to bring about writing of binary logic values to magnetic random-access memory (MRAM) cells. In particular embodiments, such circuits may operate to control output signal variability over an operating temperature range.

Abstract: A motherboard is provided. The motherboard includes a memory module, a processor and a memory slot. The memory module includes a first memory rank, a second memory rank, a plurality of first pins coupled to the first memory rank and a plurality of second pins coupled to the second memory rank. The processor includes a memory channel. The memory slot is coupled between the processor and the memory module, and is configured to transmit a first control signal from the memory channel to at least one of the plurality of first pins, or transmit a second control signal from the memory channel to at least one of the plurality of second pins. The first memory rank receives the first control signal through at least one of the plurality of first pins. The second memory rank receives the second control signal through at least one of the plurality of second pins.

Abstract: A system for refresh operations in semiconductor memories, and an apparatus and method therefore, are described. The system includes, for example, memory cells in memory banks that are refreshed during a self-refresh operation or an auto refresh operation. The self-refresh operation includes a different number of refresh activations than the auto refresh operation. The system further includes a row control circuit configured to refresh the memory cells in the memory banks based on refresh control signals received from a refresh control circuit, the refresh control signals provided by the refresh control circuit based on internal control signals received by the refresh control circuit from a command control circuit. The auto refresh operation includes a per bank refresh operation configured to refresh a corresponding memory bank or an all-bank refresh operation configured to refresh all memory banks.

Abstract: A semiconductor memory system and an operating method thereof include a controller configured to perform macro management; and a memory device including Nand pages, counters, a self-management component, and devoted memories, wherein the memory device is coupled and controlled by the controller, the Nand pages contains data corresponding to commands received from the controller, the counters are configured to track operation information corresponding to the Nand pages in accordance with the commands, the devoted memories are configured to record recovery information, and the self-management component configured to perform micro management in accordance at least in part with the operation information or the recovery information.

Abstract: A single-event-upset (SEU) stabilized memory cell includes a latch portion including a cross-coupled latch, and at least one cross coupling circuit path in the latch portion including a first series-connected pair of vertical resistors.

Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.

Abstract: The invention relates to a DRAM structure which comprise a capacitor set and at least a transistor. The capacitor set includes a first capacitor with a first electrode and a second capacitor with a second electrode, and a counter electrode is shared by the first and the second capacitors. The counter electrode is perpendicular or substantially perpendicular to an extension direction of an active region of the transistor, or the counter electrode is not positioned above or below the first and second electrode.

Abstract: Embodiments of three-dimensional memory device architectures and fabrication methods therefor are disclosed. In an example, the memory device includes a substrate and one or more peripheral devices on the substrate. The memory device also includes one or more interconnect layers and a semiconductor layer disposed over the one or more interconnect layers. A layer stack having alternating conductor and insulator layers is disposed above the semiconductor layer. A plurality of structures extend vertically through the layer stack. A first set of conductive lines are electrically coupled with a first set of the plurality of structures and a second set of conductive lines are electrically coupled with a second set of the plurality of structures different from the first set. The first and second sets of conductive lines are vertically distanced from opposite ends of the plurality of structures.

Abstract: A semiconductor storage device comprises a plurality of memory cells arranged in a matrix. Each of the memory cells includes: a semiconductor storage element including a silicon carbide substrate and a silicon carbide film on a first surface of the silicon carbide substrate; a lower electrode on a second surface facing away from the first surface of the silicon carbide substrate; and an upper electrode on at least part of a surface of the silicon carbide film, the surface facing away from another surface of the silicon carbide film in contact with the silicon carbide substrate. Each memory cell includes at least one basal plane dislocation formed at at least part of the semiconductor storage element.

Abstract: The present invention relates to a flash memory cell with only four terminals and a high voltage row decoder for operating an array of such flash memory cells. The invention allows for fewer terminals for each flash memory cell compared to the prior art, which results in a simplification of the decoder circuitry and overall die space required per flash memory cells. The invention also provides for the use of high voltages on one or more of the four terminals to allow for read, erase, and programming operations despite the lower number of terminals compared to prior art flash memory cells.

Abstract: The disclosure provides a novel system of storing information using a charged polymer, e.g., DNA, the monomers of which correspond to a machine-readable code, e.g., a binary code, and which can be synthesized and/or read using a novel nanochip device comprising nanopores; novel methods and devices for synthesizing oligonucleotides in a nanochip format; novel methods for synthesizing DNA in the 3? to 5? direction using topoisomerase; novel methods and devices for reading the sequence of a charged polymer, e.g., DNA, by measuring capacitive or impedance variance, e.g., via a change in a resonant frequency response, as the polymer passes through the nanopore; and further provides compounds, compositions, methods and devices useful therein.

Abstract: A CDMR memory cell, includes a first bitcell which is used to store a current data level and a second bitcell which is used to store the complementary data level. When a read operation is performed, a comparator compares the data levels read from the two bitcells. If these two levels are not complementary, the comparator outputs an indicator. This indicator serves as an alert that a storage error has, or may have, occurred.

Abstract: A memory device includes a memory bank having multiple addressable groups of memory cells. The multiple addressable groups of memory cells include a primary set of addressable groups and a secondary set of addressable groups. The memory bank has a control circuitry that activates an addressable group with the control circuitry including repair address match circuitry that includes dynamic selection circuitry having multiple first inputs that receive row address values corresponding to the primary set. The dynamic selection circuitry includes one or more second inputs configured to receive one or more fused address values corresponding to the secondary set of addressable groups. The dynamic selection circuitry includes an output configured to selectively transmit a result that is based at least in part on a selection of one or more first inputs and a comparison of the selected one or more first inputs with the one or more the second inputs.