Abstract: A phase change memory structure (100) can include a memory cell, a dielectric material (130) adjacent to the memory cell, and a bit line. The memory cell can include a phase change material layer (110) and a top electrode layer (120) above the phase change material layer. The dielectric material can have a top surface (135) that is higher than a top surface (125) of the top electrode layer. The bit line (140) can have a non-flat bottom surface that contacts the top surface of the dielectric material and protrudes down from the top surface of the dielectric material to a top surface of the memory cell.

Abstract: In a flip-chip LED assembly having an array of LEDs formed on the same substrate, different LEDs of the array have different distances to the n-contacts of the assembly. This may cause current crowding as current has to spread from the n-contacts through the substrate to each the farthest LEDs of the LED array, requiring LEDs that are farther away to be driven with a higher voltage in order to receive a desired amount of current. To spread current more evenly through the LED assembly and reduce a voltage difference between the closest and farthest LEDs of the array, one or more additional n-contacts are formed within the LED array. In some embodiments, the n-contacts may replace a pixel of the LED array. In other embodiments, one or more p-contacts of the LED array are resized or repositioned to accommodate the additional n-contacts without sacrificing pixels of the LED array.

Abstract: An array substrate and a display device are provided. The array substrate is provided with a display area and a non-display area, and the array substrate further includes a plurality of thin film transistors, a driving circuit, a plurality of polysilicon resistors, and a plurality of fan-out wires. The thin film transistor array is arranged in the display area, and each thin film transistor is provided with an input end. The driving circuit corresponds to the non-display area, and the driving circuit is provided with an output end. The polysilicon resistors and the fanout wires correspond to the non-display area. Two ends of each polysilicon resistor are respectively connected to the input end of a corresponding thin film transistor and the output end of the driving circuit through a corresponding fanout wire.

Abstract: An electronic device including a semiconductor device capable of intermittent driving is provided. The electronic device includes a semiconductor device, and the semiconductor device includes a current mirror circuit, a bias circuit, and first to third transistors. The current mirror circuit includes a first output terminal and a second output terminal, and the current mirror circuit is electrically connected to a power supply line through the first transistor. The current mirror circuit has a function of outputting current corresponding to a potential of the first output terminal from the first output terminal and the second output terminal. The bias circuit includes a current source circuit and a current sink circuit, the current source circuit is electrically connected to the second output terminal through the second transistor, and the current sink circuit is electrically connected to the second output terminal through the third transistor.

Abstract: A display device including a substrate having thin film transistors (TFT) comprising: the TFT including an oxide semiconductor film, a gate electrode and an insulating film formed between the oxide semiconductor film and the gate electrode, wherein a first aluminum oxide film and a second aluminum oxide film, which is formed on the first aluminum oxide film, are formed between the insulating film and the gate electrode, an oxygen concentration in the first aluminum oxide film is bigger than an oxygen concentration in the second aluminum oxide film.

Abstract: An array substrate includes a base substrate, a first buffer layer, an oxygen barrier pattern, and a second buffer layer that are disposed on the base substrate in sequence, and a plurality of first thin film transistors (TFTs) that are disposed on the second buffer layer. The oxygen barrier pattern includes a plurality of oxygen barrier portions that are insulated and spaced apart. An orthographic projection of a portion of an active layer of one first TFT between a source and a drain on the base substrate is located within a range of an orthographic projection of one corresponding oxygen barrier portion of the plurality of oxygen barrier portions on the base substrate. And an oxygen content of the first buffer layer is higher than an oxygen content of the second buffer layer.

Abstract: A display panel including data lines, scan lines, pixel structures, power lines and a fixing layer is provided. The pixel structure includes a first transistor, a second transistor and a light emitting diode device. The first transistor is electrically coupled to a corresponding scan line, a corresponding data line and the second transistor. A first end of the light emitting diode device is electrically coupled to the second transistor. The power lines are electrically coupled to the second transistor of at least one of the pixel structures and a second end of the light emitting diode device of at least one of the pixel structures. The fixing layer is disposed on at least one of the power lines. The light emitting diode device of at least one of the pixel structures is disposed on the fixing layer and overlapped with the at least one of the power lines.

Abstract: The present disclosure is directed to systems and methods for fabricating a semiconductor inductor that includes a coil deposited on a stop layer that is deposited on a sacrificial substrate. The semiconductor inductor may be fabricated on a silicon wafer and singulated. The sacrificial substrate beneficially provides structural support for the singulated semiconductor inductor. The singulated semiconductor inductor advantageously requires minimal active die surface area. The removal of the sacrificial substrate after coupling to the active die beneficially reduces the overall thickness (or height) of the semiconductor package, providing a decided advantage in low profile, portable, electronic devices.

Abstract: Display panels with hydrogen trap layers are described. The hydrogen trap layers may be incorporated into a variety of locations to getter or block hydrogen diffusion into the semiconductor oxide layer of an oxide transistor.

Abstract: A semiconductor substrate includes a substrate, a first metal oxide semiconductor layer, a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, and a second metal oxide semiconductor layer. The first transistor includes a first metal oxide semiconductor pattern of the first metal oxide semiconductor layer, a first gate of the first conductive layer, a first source of the second conductive layer, and a first drain of the second conductive layer. The second transistor includes a second metal oxide semiconductor pattern of the first metal oxide semiconductor layer, a second gate of the first conductive layer, a second source of the second conductive layer, a second drain of the second conductive layer, and a third metal oxide semiconductor pattern of the second metal oxide semiconductor layer.

Abstract: A flip chip package includes a substrate having a die attach surface, and a die mounted on the die attach surface with an active surface of the die facing the substrate. The die includes a base, a passivation layer overlying the base, a topmost metal layer overlying the passivation, and a stress buffering layer overlying the topmost metal layer, wherein at least two openings are disposed in the stress buffering layer to expose portions of the topmost metal layer. The die is interconnected to the substrate through a plurality of conductive pillar bumps on the active surface. At least one of the conductive pillar bumps is electrically connected to one of the exposed portions of the topmost metal layer through one of the at least two openings.

Abstract: A III-N device includes a III-N layer structure including a III-N channel layer, a III-N barrier layer over the III-N channel layer, and a graded III-N layer over the III-N barrier layer having a first side adjacent to the III-N barrier layer and a second side opposite the first side; a first power electrode and a second power electrode; and a gate between the first and second power electrodes, the gate being over the III-N layer structure. A composition of the graded III-N layer is graded so the bandgap of the graded III-N layer adjacent to the first side is greater than the bandgap of the graded III-N layer adjacent to the second side. A region of the graded III-N layer is (i) between the gate and the second power electrode, and (ii) electrically connected to the first power electrode and electrically isolated from the second power electrode.

Abstract: Thin film transistors having relatively increased width and shared bitlines are described. In an example, an integrated circuit structure includes a plurality of transistors formed in an insulator structure above a substrate. The plurality of transistors arranged in a column such that the respective lateral arrangement of the source, the gate, and the drain of each of the transistors aligns with an adjacent thin film transistor, wherein the plurality transistors extend vertically through the insulator structure at least two interconnect levels to provide increased relative width. A first conductive contact is formed between one of sources and drains of at least two of the plurality of transistors in the column, and the conductive contact extends through the insulator structure at least two interconnect levels.

Abstract: A three-dimensional memory device includes alternating stacks of insulating layers and electrically conductive layers located over a substrate, a first memory array region and a second memory array region that are laterally spaced apart along the first horizontal direction by an inter-array region therebetween, and memory stack structures extending through the alternating stacks in the first or second memory array region. Each of the alternating stacks includes a respective terrace region in which layers of a respective alternating stack have variable lateral extents within an area of the inter-array region, and a respective array interconnection region laterally offset from the respective terrace region and which continuously extends from the first memory array region to the second memory array region. Each of the alternating stacks has a width modulation along a second horizontal direction that is perpendicular to the first horizontal direction within the area of the inter-array region.

Abstract: A semiconductor device having favorable electrical characteristics is provided. The semiconductor device includes a first insulator, a second insulator over the first insulator, a third insulator over the second insulator, a fourth insulator and a first conductor over the third insulator, a fifth insulator over the fourth insulator and the first conductor, a first oxide over the fifth insulator, a second conductor and a third conductor over the first oxide, a second oxide over the first oxide and between the second conductor and the third conductor, a sixth insulator over the second oxide, and a fourth conductor over the sixth insulator. The hydrogen concentration of the second insulator is lower than that of the first insulator. The hydrogen concentration of the third insulator is lower than that of the second insulator.

Abstract: The disclosed technology relates to a method of forming a stacked semiconductor device. One aspect includes fin structures formed by upper and lower channel layers which are separated by an intermediate layer. After preliminary fun cuts are formed in the fin structure, a sacrificial spacer is formed that covers end surfaces of an upper channel layer portion. Final fin cuts are formed in the fin structure where the lower channel layer is etched which defines a lower channel layer portion. Lower source/drain regions are formed on end surfaces of the lower channel layer portion. The sacrificial spacer shields the end surfaces of the upper channel layer portion allowing for selective deposition of material for the lower source/drain regions.

Abstract: An object is to provide a semiconductor device having a structure in which parasitic capacitance between wirings can be efficiently reduced. In a bottom gate thin film transistor using an oxide semiconductor layer, an oxide insulating layer used as a channel protection layer is formed above and in contact with part of the oxide semiconductor layer overlapping with a gate electrode layer, and at the same time an oxide insulating layer covering a peripheral portion (including a side surface) of the stacked oxide semiconductor layer is formed. Further, a source electrode layer and a drain electrode layer are formed in a manner such that they do not overlap with the channel protection layer. Thus, a structure in which an insulating layer over the source electrode layer and the drain electrode layer is in contact with the oxide semiconductor layer is provided.

Abstract: Provided are an array substrate, a manufacturing method thereof, and a display panel. The array substrate includes: a substrate, a first active layer of a first thin film transistor, a first insulating layer, a first metal layer, and a second active layer of a second thin film transistor. The first metal layer includes a first connection portion, which overlaps one of a source contact region or a drain contact region of the first active layer and overlaps one of a source contact region or a drain contact region of the second active layer. The one of the source contact region or the drain contact region of the first active layer and the one of the source contact region or the drain contact region of the second active layer overlap each other, and are electrically connected through a via in the first insulating layer and the first connection portion.

Abstract: Techniques are disclosed for forming germanium (Ge)-rich channel transistors including one or more dopant diffusion barrier elements. The introduction of one or more dopant diffusion elements into at least a portion of a given source/drain (S/D) region helps inhibit the undesired diffusion of dopant (e.g., B, P, or As) into the adjacent Ge-rich channel region. In some embodiments, the elements that may be included in a given S/D region to help prevent the undesired dopant diffusion include at least one of tin and relatively high silicon. Further, in some such embodiments, carbon may also be included to help prevent the undesired dopant diffusion. In some embodiments, the one or more dopant diffusion barrier elements may be included in an interfacial layer between a given S/D region and the Ge-rich channel region and/or throughout at least a majority of a given S/D region. Numerous embodiments, configurations, and variations will be apparent.

Abstract: Methods for forming an interconnections structure on a substrate in a cluster processing system and thermal processing such interconnections structure are provided. In one embodiment, a method for a device structure for semiconductor devices includes forming a barrier layer in an opening formed in a material layer disposed on a substrate, forming an interface layer on the barrier layer, forming a gap filling layer on the interface layer, and performing an annealing process on the substrate, wherein the annealing process is performed at a pressure range greater than 5 bar.