Abstract: A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.

Abstract: A wiring substrate with bumps protruding from a surface of the substrate covers one side of a metallic base with an electrical insulating film thereon, having open holes exposing the base, etching the base through the open holes to form concavities in the base, electroplating the interior faces of the concavities to form a barrier metal film thereon filling the concavities with a bump material by electroplating, and forming a barrler layer on the bump material in each concavity. A stack of wiring patterns is formed on the insulating film, adjacent wiring patterns being separated by a respective intervening insulating layer and being electrically connected to each other through vias in the intervening insulating layer, and to the bump material filled in the concavities. Thereafter, the base and barrier metal film are removed.

Abstract: A clamp remover is disclosed. In one example of the present embodiments, a wire clamp remover includes a first engaging member configured to engage a clamp and a second engaging member configured to engage the clamp. In addition, the wire clamp remover also comprises a first interface member coupled to the first engaging member and a second interface member coupled to the second engaging member.

Abstract: In a method of manufacturing a center electrode for a spark plug, a core member is press-fitted into a metal cup and, thereafter, a cold-forging process is performed to form a small-diameter portion at a closed end of the metal cup. The small-diameter portion is completely free from deformation which may occur during press-fitting operation. Thus, the small-diameter portion has excellent accuracy in shape. Furthermore, since the press-fitting is performed before the cold-forging of the small-diameter portion, it is possible to increase the press-fitting load or pressure to the extent that the core member and the metal cup are joined together with a sufficient degree of adhesion which will insure the a center electrode to have good thermal conductivity.

Abstract: A method for manufacturing a heat-dissipating structure of a rectifier combines heat pipes into the heat-dissipating structure of the rectifier to enhance the heat-dissipating efficiency thereof. A metal tube of a heat pipe is has an inlet. A wick structure is formed inside the metal tube. The inlet of the metal tube is sealed. The metal tube is disposed in a mold of a heat-dissipating shell. A melted metal is cast into the mold and forms a heat-dissipating shell. The heat-dissipating shell is taken out from the mold. The sealed inlet of the metal tube in the heat-dissipating shell is cut. The metal tube is filled with a working fluid. The inlet of the metal tube is sealed.

Abstract: A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

Abstract: A process for preparing an over molded motor stator structure comprises constructing a bobbin assembly; constructing an intermediate stator assembly including assembling the bobbin assembly to a stator core having an internal and external diameter; disposing the intermediate stator assembly into a mold fixture comprising a cover half and an ejector half that includes an inner ejector core and a moveable plate; loading a bearing carrier into the mold fixture; closing the cover half causing the moveable plate to travel within the mold; injecting a unitizing material into the mold fixture to encapsulate the intermediate stator assembly and form an over molded motor stator structure. The moveable plate travels within the mold fixture so as prevent coating of the stator laminations external diameter. A tight tolerance relationship between the inner ejector core and the stator lamination inner diameter prevents the internal diameter from being encapsulated by the unitizing material.

Abstract: Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are exposed to bonding conditions effective to bond the balls with their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual solder balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are bonded with the individual associated bond pads. In another embodiment, a frame is provided having a hole. A solder ball is provided having an outer surface.

Abstract: The present invention's device of manufacturing metal ferrules used as connector elements for optical fibers is characterized such that, by growth-guidance of an internal-diameter formation member whose external diameter is the same as the internal diameter of the metal ferrule to be manufactured, an electroformed layer having a cylindrical internal hole is grown on the cathode side of an electroforming cistern and said cylindrical electroformed layer is grown to a prescribed external diameter in the process of lifting such electroformed layer from the aforementioned electroforming cistern, and such that said cylindrical electroformed layer, when outside the aforementioned electroforming cistern, is cut to prescribed dimensions.

Abstract: A method for producing a piezoelectric actuator (8) with a multilayer structure of layers of a piezoelectric sheet (3, 4), and with inner electrodes disposed between them, is proposed, in which the individual layers are formed of two continuous strands (3, 4) of the piezoelectric sheet, and the two strands (3, 4) are wound over one another in the form of a double helix to form a hollow-cylindrical stack, thereby enclosing the inner electrode between them. The two strands (3, 5) are preferably guided over deflection rollers (5, 6, 7) in such a way that the overlays of the two strands (3, 4) on the already-wound stack are offset from one another by a predetermined angular amount.

Abstract: A helical corrugated coaxial cable possesses low cost of manufacture comparable to that of braided shield coaxial cable, electrical performance comparable to solid tubular shielded cable, flexibility of helical and annular corrugated cable, and fluid blockage comparable to annular shielded cable. The cable has an inner conductor surrounded by a foam dielectric insulator. A tubular shield surrounds the dielectric and has helical corrugations penetrating into and compressing the foam dielectric to effectively suppress the formation of fluid migration air gaps or passageways between the shield and the dielectric. The shield is preferably composed of aluminum or aluminum alloy. Alternatively, the shield may be annularly corrugated for improved water blocking performance. The manufacturing process employs high speed welding and multi-lead corrugating operations to reduce cost.

Abstract: An antiferromagnetic stabilization scheme is employed in a magnetic head for magnetically stabilizing a free layer of a spin valve. This is accomplished by utilizing an antiferromagnetic oxide film below a spin valve sensor in a read region and first and second lead layers in end regions and a ferromagnetic film in each of the lead layers that exchange couples to the antiferromagnetic oxide film in the end regions. The ferromagnetic films are pinned with their magnetic moments oriented parallel to an air bearing surface (ABS) of the magnetic head. The ferromagnetic films magnetostatically couple to the free layer which causes the free layer to be in a single magnetic domain state. Accordingly, when the free layer is subjected to magnetic incursions from a rotating disk in a disk drive, the free layer maintains a stable magnetic condition so that resistance changes of the free layer are not altered by differing magnetic conditions of the free layer.

Abstract: A stator for an automotive alternator is provided with good installation characteristics for stator coils and which can lower noise. The stator includes a stator core in which a plurality of slots are formed at an inner circumference thereof and stator coils which are fitted into the slots. A rotor is provided inside the stator and includes a rotor coil, and a pole core for housing the rotor coil. Two slots are provided for each set of stator coils, each phase and each magnetic pole and the total number of slots is seventy-two or more. The stator core formed by laminating a plurality of sheet-shaped magnetic members. The stator coils are disposed in the slots, and the stator core is rounded such that the stator coils become the inner side thereof and both end surfaces thereof are contacted to connect the stator core in an annular shape.

Abstract: A liquid jetting head of the invention includes a flowing-path plate through which a flowing-path space is formed as a flowing-path for a liquid. A nozzle plate is provided on one side surface of the flowing-path plate, said nozzle plate having a nozzle that is communicated with the flowing-path space. A sealing plate is provided on the other side surface of the flowing-path plate for sealing the flowing-path space. A portion of the other side of the flowing-path space forms a pressure-chamber space. A portion of the other side of the flowing-path plate including at least a portion of the pressure-chamber space is formed by electrocasting. A pressure-generating unit is provided at a portion of the other side of the sealing plate corresponding to the pressure-chamber space for changing a pressure of the liquid in the pressure-chamber space.

Abstract: A method of removing an optical device contained within a device package from a circuit board, wherein the device package is secured to the circuit board using an adhesive pad. The method includes peeling a portion of the adhesive pad away from the circuit board, inserting an optical removal tool between the optical device and the circuit board, wherein the optical removal tool has a pair of fork portions and a cavity positioned between the fork portions, and the fork portions straddle one or more leads on the optical device during the inserting step, and prying the remainder of the adhesive pad away from the circuit board using the optical device removal tool.

Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7,8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31,51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior. Additional electrical components may be attached directly to the surface of the device or assembly.

Abstract: Method for controlling installation of a head stack assembly in a disc drive. The head stack assembly is aligned in a head stack installation tool. A base deck assembly is advanced to the head stack installation tool, the base deck assembly having a post supporting a tolerance ring. A robotic assembly is dispatched to pick and press the head stack assembly onto the tolerance ring and post while mechanical resistance and distance traveled parameters by the head stack assembly are measured. The installation is aborted or completed in relation to the mechanical resistance encountered and the distance traveled, thus allowing use of minimum and maximum force thresholds with respect to insertion distance and assuring correct installation of the head stack assembly.

Abstract: A method of manufacturing an edge reflection type surface acoustic wave device using a Shear Horizontal type surface acoustic wave includes the steps of making a first half cut defining a first end surface portions having a smooth surface, that is, opposing two end surfaces which function as reflection end surfaces, from the upper surface of a piezoelectric substrate after at least one of a plurality of IDTs has been formed on the upper surface of the piezoelectric substrate, making a second half cut for forming second end surface portions having a rough surface after making the first cut, and making a full cut for cutting the piezoelectric substrate so as to reach the lower surface of the piezoelectric substrate outside of the second end surface portions in the surface acoustic wave propagation direction.

Abstract: A method of producing a strain sensitive resistor includes matching an area of a film insulating layer to a shape of a recess in a surface of a support element. The film insulating area is applied to the support element so that the area of the film matching the shape of the recess is congruent with the shape of the recess. A resistive layer comprising strain-sensitive resistors is applied to the film insulating layer and the film insulating layer and the resistive layer are applied to heat treatment.

Abstract: In the multilayer inductor, the substrate thereof is composed of a constituent belonging to spinel ferrite, and is furnished with internal conductors of a main constituent being silver at the interior of the substrate. The internal conductors are drawn outside of the substrate, and the drawn portions are provided with external electrodes. The internal conductors contain manganese and bismuth, and the manganese and bismuth contents at an interface between the internal conductors and the substrate are more than those of other ranges. MnO2 of 0.02 to 0.1 wt % and Bi2O3 of 0.5 to 1.2 wt % are added to a paste of the main constituent being silver to be used to the internal conductors, and the paste is baked together with spinel ferrite material.