Abstract: A substrate for displays including a base, a plurality of first interconnects disposed on the base, a plurality of second interconnects disposed on the base to intersect with the first interconnects, and a plurality of sub-pixels disposed on the base and including one or more of the first and second interconnects, each of the sub-pixels including at least one interconnect extension protruding from at least one side of the second interconnect, first and second mounting portions formed between the at least one interconnect extension and the first interconnect, and a light emitting diode mounted on the first mounting portion, in which the second mounting portion is configured to mount another light emitting diode thereon.

Abstract: A method for fabricating a semiconductor device including vertical transistors having uniform channel length includes defining a channel length of at least one first fin formed on a substrate in a first device region and a channel length of at least one second fin formed on the substrate in a second device region. Defining the channel lengths includes creating at least one divot in the second device region. The method further includes modifying the channel length of the at least one second fin to be substantially similar to the channel length of the at least one first fin by filling the at least one divot with additional gate conductor material.

Abstract: An optocoupler is provided, including at least one light source and at least one matrix of photovoltaic cells facing the at least one light source, the at least one light source being configured to receive, at an input, an input electrical signal, and to generate, at an output, according to the input electrical signal, a light signal, sent to the at least one matrix of photovoltaic cells, the at least one matrix of photovoltaic cells being configured to receive, at the input, at least partially the light signal and to deliver, at the output, at least one output electrical signal, at the level of at least two connection pads, and the at least one light source being a matrix of laser diodes.

Abstract: A semiconductor device includes a memory macro having first and second well pick-up (WPU) areas along first and second edges of the memory macro, respectively, and memory bit areas between the first and the second WPU areas. The first and second WPU areas are oriented lengthwise generally along a first direction. In each of the first and second WPU areas, the memory macro includes n-type wells and p-type wells arranged alternately along the first direction with a well boundary between each of the n-type wells and the adjacent p-type well. The memory macro further includes active regions; an isolation structure; gate structures, and a first dielectric layer that is disposed at each of the well boundaries. From a top view, the first dielectric layer extends generally along a second direction perpendicular to the first direction and through all the gate structures in the first and the second WPU areas.

Abstract: An organic electroluminescent diode, a display panel, a display device and a manufacturing method of an organic electroluminescent diode are provided. The organic electroluminescent diode includes a first electrode, a first electron blocking layer, a light-emitting layer and a second electrode which are stacked arranged in sequence, a surface of the first electron blocking layer in contact with the light-emitting layer is doped with a hole-type non-metallic material. In the embodiment of the present disclosure, by doping the hole-type non-metallic material in the first electron blocking layer, the density of the holes at the recombination interface is increased, the utilization rate of the holes is improved, and the loss of holes in the transmission process is avoided, which ensures that the holes are timely recombined with the transmitted electrons, and avoids the accumulation of too many electrons at the interface between the first electron blocking layer and the light-emitting layer.

Abstract: A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface, a sidewall substantially orthogonal to the first surface and the second surface; and a metallic layer surrounding and connected with the sidewall of the substrate, wherein the metallic layer includes an exposed surface substantially level with the first or second surface of the substrate. Further, a method of manufacturing the semiconductor structure is also disclosed.

Abstract: A display panel includes a thin film encapsulation layer which has a stack of layers: an organic encapsulation layer and an inorganic encapsulation layer covering the organic encapsulation layer; an inorganic insulation layer; also first touch electrodes; and first bridge structures. First and second recessed structures that are connected to each other are formed in the inorganic encapsulation layer and the inorganic insulation layer in one arrangement, or the first and second recessed structures are provided in the inorganic insulation layer in another arrangement. The first touch electrode and the first bridge structure are located in the first recessed structure and the second recessed structure, or the first bridge structure and the first touch electrode are located in the first recessed structure and the second recessed structure.

Abstract: A workpiece processing system and method provides an end effector coupled to a workpiece transfer apparatus. The end effector has support members for selectively contacting and supporting a workpiece. One or more temperature sensors are coupled to the support members and are configured to contact a backside of the workpiece to measure and define one or more measured temperatures of the workpiece. A heated chuck has a support surface at a predetermined temperature, and is configured to radiate heat from the support surface. A controller control the workpiece transfer apparatus to selectively support the workpiece at a predetermined distance from the support surface of the heated chuck to radiatively heat the workpiece, and to selectively transfer the workpiece from the end effector to the support surface of the heated chuck based, at least in part, on the one or more measured temperatures.

Abstract: The present disclosure provides a display panel and a fabricating method thereof. The display panel includes a substrate and a plurality of mutually insulated binding pads disposed on the substrate. Each binding pad includes an upper surface, a lower surface and a side surface. The upper surface and the lower surface are both parallel to a plane of the substrate, the side surface is located between the upper surface and the lower surface, and the side surface connects the upper surface with the lower surface. A first insulating layer is disposed on the side surface of the binding pad, the first insulating layer is in contact with the side surface of the binding pad and is made of an inorganic material. With such a configuration, the side surface of the binding pad will not be damaged by an etching process subsequent to fabrication of the binding pads.

Abstract: A display apparatus includes: a first substrate including a transmission area, a display area that surrounds at least part of the transmission area, and a first non-display area between the transmission area and the display area; an insulating layer in the display area and the first non-display area; a plurality of display elements in the display area; a spacer above the insulating layer in the first non-display area and surrounding the transmission area; and a second substrate facing the first substrate.

Abstract: Devices and methods of their fabrication for pixels or displays are disclosed. Pixels and displays having redundant subpixels are described. Subpixels are initially isolated by an unprogrammed antifuse. A subpixel is connected to the display by programming the antifuse, electrically connecting it to the pixel or display. Defective subpixels can be determined by photoluminescent testing or electroluminescent testing, or both. A redundant subpixel can replace a defective subpixel before pixel or display fabrication is complete.

Abstract: A semiconductor device is described, which includes a first transistor, a second transistor, and a capacitor. The second transistor and the capacitor are provided over the first transistor so as to overlap with a gate of the first transistor. A semiconductor layer of the second transistor and a dielectric layer of the capacitor are directly connected to the gate of the first transistor. The second transistor is a vertical transistor, where its channel direction is perpendicular to an upper surface of a semiconductor layer of the first transistor.

Abstract: Structures including a photodiode and methods of fabricating such structures. A substrate has a top surface, a well, and a trench extending from the top surface to the well. A photodiode is positioned in the trench. The photodiode includes an electrode that is provided by a first portion of the well. A bipolar junction transistor has an emitter that is positioned over the top surface of the substrate and a subcollector that is positioned below the top surface of the substrate. The subcollector is provided by a second portion of the well.

Abstract: An organic light emitting display device comprises two emission portions between first and second electrodes, wherein at least one among the two emission portions includes two emitting layers, whereby efficiency and a color reproduction ratio may be improved.

Abstract: A lead frame includes a lead portion having a first surface and a second surface, a connecting bar that has a first surface and a second surface and to which the lead portion is connected, and a raised portion provided on the first surface of the connecting bar. The first surface of the connecting bar is positioned between the first and the second surfaces of the lead portion. The tip of the raised portion is positioned between the first surface of the lead portion and the first surface of the connecting bar.

Abstract: Disclosed is a thin-film transistor-based pressure sensor including a gate electrode; a gate dielectric layer provided on the gate electrode; a semiconductor layer provided on the gate dielectric layer; and a source electrode and a drain electrode provided on the semiconductor layer, wherein each of the source and drain electrodes has an elastic body that includes: an elastic part having a protrusion; and a conductive part provided on a surface of the elastic part and having a conductive material. According to the pressure sensor and a method of manufacturing the same of the present invention, the elastic body coated with the conductive material is patterned to serve as the source electrode and the drain electrode of the pressure sensor whereby it is possible to drive an active matrix, drive the pressure sensor with low power, and manufacture the pressure sensor through a simple process.

Abstract: method of manufacturing a semiconductor device capable of manufacturing a miniaturized semiconductor device is provided. The method of manufacturing a semiconductor device according to an embodiment includes the steps of: preparing a semiconductor substrate having a first surface and a second surface which is an opposite surface of the first surface; forming a hard mask having an opening on the first surface; forming a gate trench extending toward the second surface on the first surface using the hard mask as a mask; widening the width of the opening; filling the opening with an interlayer insulating film; and forming a contact hole in the interlayer insulating film by removing the hard mask.

Abstract: A technique comprising: forming on a support film a first stack of layers defining an array of photodiodes; forming over the first stack of layers in situ on the support film a second stack of layers defining electrical circuitry by which the photoresponse of each photodiode is independently detectable via an array of conductors outside the array of photodiodes; wherein forming the first stack of layers comprises depositing an organic semiconductor material over a first electrode, and depositing a second electrode over the organic semiconductor material, wherein the electrical circuitry comprises transistors including photosensitive semiconductor channels, and the second electrode also functions to substantially block the incidence of light on the photosensitive semiconductor channels from the direction of the support film.

Abstract: An embodiment relates to an ultraviolet light-emitting device, a method for manufacturing the ultraviolet light-emitting element, a light-emitting element package, and a lighting device. An ultraviolet light-emitting element according to an embodiment includes: a first conductive type first semiconductor layer having a light extraction structure; an etching-blocking layer on the first conductive type first semiconductor layer; a first conductive type second semiconductor layer on the etching-blocking layer, an active layer on the first conductive type second semiconductor layer; a second conductive type semiconductor layer on the active layer; and an electron spreading layer disposed between the etching-blocking layer and the active layer, wherein the electron spreading layer includes a first conductive type or an undoped AlGaN-based or a GaN-based semiconductor layer, an undoped AlN, and a first conductive type AlGaN-based second semiconductor layer.

Abstract: Discussed is a display device, including a semiconductor light emitting device and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed on an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction of the semiconductor light emitting device, wherein the first conductive semiconductor layer has a symmetrical shape with respect to at least one direction of the semiconductor light emitting device so that the first conductive electrode and the second conductive electrode are arranged at preset positions when the semiconductor light emitting device is accommodated into