Patents Examined by Shamim Ahmed
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Patent number: 11834585Abstract: Powder coating compositions, particularly metal packaging powder coating compositions, coated metal substrates, and methods; wherein the powder coating compositions include powder polymer particles comprising a polymer having a number average molecular weight of at least 2000 Daltons, wherein the powder polymer particles have a particle size distribution having a D50 of less than 25 microns; and, in certain embodiments, one or more charge control agents in contact with the powder polymer particles.Type: GrantFiled: December 30, 2021Date of Patent: December 5, 2023Assignee: SWIMC LLCInventors: Richard D. Joslin, Charles I. Skillman, Joseph Desousa
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Patent number: 11837465Abstract: A deposition method for embedding a SiN film in a recessed pattern formed on a surface of a substrate includes: (a) activating and supplying a first process gas containing NH3 to the surface of the substrate and causing NHx groups to adsorb on the surface of the substrate, where x is 1 or 2; (b) supplying a silicon-containing gas to the surface of the substrate on which the NHx groups are adsorbed and causing the silicon-containing gas to adsorb on the NHx groups; and (c) activating and supplying a second process gas containing N2 to the surface of the substrate on which the NHx groups are adsorbed and partly replacing the NHx groups with N groups, wherein (a) and (b) are repeated, and (c) is performed every time (a) and (b) are repeated a predetermined number of times.Type: GrantFiled: September 8, 2021Date of Patent: December 5, 2023Assignee: Tokyo Electron LimitedInventors: Jun Ogawa, Takayuki Karakawa
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Patent number: 11826776Abstract: A method of coating a high-pressure fluid vessel comprises filling a high-pressure fluid vessel with a coating solution, draining the coating solution, and drying a remainder of the coating solution in the high-pressure fluid vessel. The coating solution may include a thermoplastic elastomer that is hard with a low glass transition temperature and a high melting temperature. Drying the remainder of the coating solution may form a food grade coating within the high-pressure fluid vessel.Type: GrantFiled: July 21, 2020Date of Patent: November 28, 2023Assignee: GOODRICH CORPORATIONInventors: Jin Hu, Nathaniel Ching, Phi Doan, Casey Slane
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Patent number: 11814548Abstract: A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, a cationic compound, and a liquid medium, in which a zeta potential of the abrasive grains is positive and a weight average molecular weight of the cationic compound is less than 1000.Type: GrantFiled: September 30, 2021Date of Patent: November 14, 2023Assignee: RESONAC CORPORATIONInventors: Tomohiro Iwano, Takaaki Matsumoto, Tomoyasu Hasegawa
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Patent number: 11814561Abstract: Provided is a novel etching gas composition that comprises a sulfur-containing unsaturated compound and that is useful for etching a stacked structure of silicon-based films. A dry etching gas composition comprises a sulfur-containing fluorocarbon compound that has an unsaturated bond and that is represented by general formula (1) of CxFySz where x, y, and z are 2?x?5, y?2x, and 1?z?2.Type: GrantFiled: October 25, 2019Date of Patent: November 14, 2023Assignee: KANTO DENKA KOGYO CO., LTD.Inventors: Hisashi Shimizu, Korehito Kato
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Patent number: 11814547Abstract: Provided is a polishing liquid composition that is able to improve the polishing rate of a silicon oxide film in one aspect. An aspect of the present disclosure relates to a polishing liquid composition for a silicon oxide film. The polishing liquid composition contains cerium oxide particles (component A), an additive (component B), and an aqueous medium. The component B is a compound having a reduction potential of 0.45 V or more when a 10 ppm aqueous solution of the component B is measured by cyclic voltammetry (with an Ag/AgCl electrode as a reference).Type: GrantFiled: September 18, 2019Date of Patent: November 14, 2023Assignee: KAO CORPORATIONInventors: Haruhiko Doi, Norihito Yamaguchi, Masato Sugahara, Takanao Seike, Masaki Inoue
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Patent number: 11814735Abstract: The present invention is a method of manufacturing a ceramic substrate, the method including forming a mask on one surface of a metal layer, forming an inclined protrusion by etching the metal layer exposed by the mask, and bonding the metal layer on which the inclined protrusion is formed to a ceramic base material, and according to the present invention, the inclined protrusion is formed on an outer perimeter of the metal layer bonded to the ceramic base material to increase a bonding strength between the ceramic base material and the metal layer and facilitate a metal layer etching process.Type: GrantFiled: March 25, 2020Date of Patent: November 14, 2023Assignee: Amosense Co., Ltd.Inventor: Ji-Hyung Lee
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Patent number: 11795397Abstract: Provided is a novel etching gas composition that comprises a sulfur-containing compound and that can selectively etch SiO2 over low dielectric constant materials (low-k materials; SiON, SiCN, SiOCN, SiOC). A dry etching gas composition comprises a saturated and cyclic sulfur-containing fluorocarbon compound that is represented by general formula (1) of CxFySz where x, y, and z are 2?x?5, y?2x, and 1?z?2.Type: GrantFiled: January 18, 2022Date of Patent: October 24, 2023Assignee: KANTO DENKA KOGYO CO., LTD.Inventors: Hisashi Shimizu, Korehito Kato
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Patent number: 11795396Abstract: Provided is a novel etching gas composition that comprises a sulfur-containing unsaturated compound and that is useful for etching a stacked structure of silicon-based films. A dry etching gas composition comprises a sulfur-containing fluorocarbon compound that has an unsaturated bond and that is represented by general formula (1) of CxFySz where x, y, and z are 2?x?5, y?2x, and 1?z?2.Type: GrantFiled: January 18, 2022Date of Patent: October 24, 2023Assignee: KANTO DENKA KOGYO CO., LTD.Inventors: Hisashi Shimizu, Korehito Kato
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Patent number: 11800726Abstract: A method for preparing photoactive perovskite materials. The method comprises the steps of preparing a bismuth halide precursor ink. Preparing a bismuth halide precursor ink comprises the steps of introducing a bismuth halide into a vessel; introducing a first solvent to the vessel; and contacting the bismuth halide with the first solvent to dissolve the bismuth halide to form the bismuth halide precursor ink; depositing the bismuth halide precursor ink onto a substrate; drying the bismuth halide precursor ink to form a thin film; annealing the thin film; and rinsing the thin film with a solvent comprising: a second solvent; a first salt selected from the group consisting of methylammonium halide, formamidinimum halide, guanidinium halide, 1,2,2-triaminovinylammonium halide, and 5-aminovaleric acid hydrohalide; and a second salt selected from the group consisting of methylammonium halide, formamidinimum halide, guanidinium halide, 1,2,2-triaminovinylammonium halide, and 5-aminovaleric acid hydrohalide.Type: GrantFiled: October 20, 2022Date of Patent: October 24, 2023Assignee: CubicPV Inc.Inventors: Michael D. Irwin, Jerred A. Chute, Vivek V. Dhas
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Patent number: 11791165Abstract: A method of etching a copper (Cu) thin film and a Cu thin film prepared therefrom, the method including patterning a hard mask layer on the Cu thin film to form a hard mask on the Cu thin film; forming a plasma of a mixed gas, the mixed gas including an inert gas and an organic chelator material including an amine group, the mixed gas not including a halogen gas or a halide gas; and etching the Cu thin film through the hard mask using the plasma generated in the forming of the plasma of the mixed gas.Type: GrantFiled: August 30, 2021Date of Patent: October 17, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Cheewon Chung, Jaesang Choi
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Patent number: 11791138Abstract: Embodiments of the present disclosure relate to a system for pulsed direct-current (DC) biasing and clamping a substrate. In one embodiment, the system includes a plasma chamber having an electrostatic chuck (ESC) for supporting a substrate. An electrode is embedded in the ESC and is electrically coupled to a biasing and clamping network. The biasing and clamping network includes at least a shaped DC pulse voltage source and a clamping network. The clamping network includes a DC source and a diode, and a resistor. The shaped DC pulse voltage source and the clamping network are connected in parallel. The biasing and clamping network automatically maintains a substantially constant clamping voltage, which is a voltage drop across the electrode and the substrate when the substrate is biased with pulsed DC voltage, leading to improved clamping of the substrate.Type: GrantFiled: May 12, 2021Date of Patent: October 17, 2023Assignee: Applied Materials, Inc.Inventors: Linying Cui, James Rogers, Leonid Dorf
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Patent number: 11791175Abstract: An etching method for selectively etching a material containing Si and O is provided. The etching method includes providing a substrate containing the material containing Si and O in a chamber, repeating a first period for supplying a basic gas, which is started first, and a second period for supplying a fluorine-containing gas, which is started next, with at least a part of the second period not overlapping with the first period, and heating and removing a reaction product generated by the supply of the basic gas and the supply of the fluorine-containing gas.Type: GrantFiled: May 13, 2021Date of Patent: October 17, 2023Assignee: Tokyo Electron LimitedInventors: Yoshiki Igarashi, Satoru Kikushima, Takayuki Suga, Jun Lin, Chengya Chu
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Patent number: 11781039Abstract: Solutions are disclosed for preventing the settling of an abrasive, while maintaining the polishing performance of a polishing composition. Solutions are disclosed for improving the redispersibility of an abrasive while maintaining the polishing performance. Polishing compositions for use in polishing a semiconductor substrate according to the present disclosure include an abrasive, a layered compound, and a dispersion medium.Type: GrantFiled: December 22, 2017Date of Patent: October 10, 2023Assignee: FUJIMI INCORPORATEDInventors: Tomoaki Ishibashi, Hiroki Kon
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Patent number: 11781196Abstract: A grain-oriented electromagnetic steel sheet exhibits excellent magnetic characteristics and excellent coating film adhesion after strain relieving annealing. The grain-oriented electromagnetic steel sheet includes: a steel sheet; a coating film layer A that is a ceramic coating film which is formed on the steel sheet and has an oxide content of less than 30% by mass; and a coating film layer B that is an insulating tension coating film which is arranged on the coating film layer A and contains an oxide. The binding energy of the 1s orbital of oxygen in the coating film layer B is higher than 530 eV; and tension applied to the steel sheet by the coating film layer B per a thickness of 1.0 ?m of the coating film layer B is 4.0 MPa/?m or more.Type: GrantFiled: November 20, 2017Date of Patent: October 10, 2023Assignee: JFE Steel CorporationInventors: Takumi Umada, Shigehiro Takajo, Takashi Terashima
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Patent number: 11781580Abstract: A method of applying a corrosion-resistant coating to a fastener that includes preheating an area of the fastener to be coated to elevate a temperature of the area and spraying the preheated area of the fastener with a molten or semi-molten metal. In one embodiment, a corrosion-resistant coating applicator includes a support structure, a rotatable slotted fastener conveyer supported by the support structure, a feeder configured to feed fasteners to the rotatable slotted fastener conveyer, a fastener aligner configured to make head portions of the fasteners aligned with each other, a heater configured to heat head portions of the fasteners as the fasteners are being conveyed by the slotted fastener conveyer, and a sprayer configured to apply a corrosion-resistant coating to the heated head portions of the fasteners being conveyed by the slotted fastener conveyer. The present disclosure also provides corrosion-resistant coated fasteners made using the coating methods and/or coating apparatus.Type: GrantFiled: June 9, 2020Date of Patent: October 10, 2023Assignee: Illinois Tool Works Inc.Inventors: Christopher A. Horst, Donald E. Bergstrom, Johnny Bertelsen, Signe Tolberg Andersen, Flemming Sørensen
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Patent number: 11781023Abstract: A free radical curable automotive body primer is provided that has a color change corresponding to the progress of the cure process until a dry to sand condition has been attained and an internal colored guide coat that does not change color given its exposure to ambient air and as a result, has a different color on the surface of the primer than when in bulk, allowing for the detection and removal of low spots or other imperfections from a vehicle body by additional sanding of the inventive primer to remove oxidized guide coat colorant surface regions. The cure color change is achieved through resort to at least one color changing dye that reacts with a free radical cure initiator during the vehicle body priming process and changes color to indicate when the primer composition has achieved a level of cure so as to be dry enough to sand.Type: GrantFiled: January 20, 2020Date of Patent: October 10, 2023Assignee: Illinois Tool Works Inc.Inventors: Helena Twardowska, Carlton G. Seaboldt, David J. McKinney
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Patent number: 11781066Abstract: The invention provides a composition and method for improving the selectivity of nitride etching versus oxide etching and can be used with conventional phosphoric acid wet etch compositions. The invention describes additives that serve to inhibit silicon, oxides, and related compounds regrowth (i.e., redeposition) on the silicon oxide surface. In certain embodiments, the invention provides certain amino-substituted aryl compounds which are bound to a tri-alkoxy silane.Type: GrantFiled: May 18, 2022Date of Patent: October 10, 2023Assignee: ENTEGRIS, INC.Inventors: YoungMin Kim, Michael White, Daniela White, Emanuel Cooper, Steven M. Bilodeau
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Patent number: 11773353Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.Type: GrantFiled: February 10, 2021Date of Patent: October 3, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Pinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Chi-Jen Liu, Liang-Guang Chen, Yi-Sheng Lin
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Patent number: 11773010Abstract: The invention relates generally to optically high transparency and high haze structures and, more particularly, to plastic, e.g., polymer, and glass structures having a sub-wavelength texture formed on a surface thereof, which is effective to impart the optical properties of high transparency and high haze to the structures. The texture is in a grass-like or needle-like form. Additionally, the optically high transparency and high haze structures may include a transparent conductor. Furthermore, the glass structures may exhibit a self-cleaning function.Type: GrantFiled: May 30, 2018Date of Patent: October 3, 2023Assignee: UNIVERSITY OF PITTSBURGH—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATIONInventors: Sajad Haghanifar, Bradley D. Pafchek, Paul W. Leu, Tongchuan Gao